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72V36100L15PFI

Integrated Device Technology

72V36100L15PFI by Integrated Device Technology

72V36100L15PFI by Integrated Device Technology is a FIFO with 64Kx36 organization, operating at 66.7 MHz clock frequency and 15 ns cycle time. Ideal for industrial applications, it features synchronous operation, low profile flatpack package style, and a memory density of 2359296 bits.

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AZTECH Wire

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Aranea Global

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Overview

Experience seamless data transfer and efficient memory management with the 72V36100L15PFI FIFO by Integrated Device Technology. As a leading manufacturer in the industry, IDT offers top-notch quality and reliability in their products. Ideal for industrial applications, this FIFO ensures optimal performance with a nominal supply voltage of 3.3V and a cycle time of 15ns. Say goodbye to slow data processing and hello to improved efficiency with this advanced technology. Choose IDT for cutting-edge solutions that elevate your systems to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for various applications.

Surface Mount: YES

Being surface mountable allows for easy installation and space-saving design in electronic devices.

Cycle Time: 15 ns

With a fast cycle time of 15 nanoseconds, this FIFO ensures efficient data processing and high-speed performance.

Package Shape: RECTANGULAR

The rectangular package shape provides ease of handling and fits well within compact electronic systems.

Operating Mode: SYNCHRONOUS

The synchronous operating mode enables synchronized data transfer and reliable communication between components.

Nominal Supply Voltage / Vsup (V): 3.3

The nominal supply voltage of 3.3V ensures compatibility with a wide range of systems and power sources.

Power Supplies (V): 3.3

The consistent power supply of 3.3V maintains stable operation and prevents voltage fluctuations.

No. of Terminals: 128

With 128 terminals, this FIFO offers ample connectivity options for seamless integration into a circuit.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style makes this product suitable for space-constrained environments.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliability in various operating conditions.

Organization: 64KX36

The organization of 64Kx36 provides a large memory capacity and efficient data storage capabilities.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows for reliable performance in cold environments.

Terminal Finish: TIN LEAD

The tin lead terminal finish ensures good conductivity and reliable connections with other components.

Terminal Position: QUAD

The quad terminal position offers enhanced stability and secure mounting on PCBs.

Maximum Seated Height: 1.6 mm

With a slim maximum seated height of 1.6mm, this FIFO is suitable for compact designs with limited space.

Maximum Clock Frequency (fCLK): 66.7 MHz

The high maximum clock frequency of 66.7MHz allows for fast data processing and efficient operation.

Width: 14 mm

The slim width of 14mm enables easy integration into tight spaces within electronic systems.

Minimum Supply Voltage (Vsup): 3.15 V

The minimum supply voltage of 3.15V ensures power efficiency and compatibility with low voltage requirements.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, this product offers robust soldering characteristics.

Peak Reflow Temperature °C: 225

The high peak reflow temperature of 225°C ensures secure solder joints and reliable connections.

Length: 20 mm

The compact length of 20mm makes this FIFO suitable for small electronic devices and tight spaces.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in harsh environmental conditions.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high-speed operation.

Parallel or Serial: PARALLEL

The parallel operation allows for simultaneous data transfer and efficient processing.

Terminal Form: GULL WING

The gull wing terminal form provides secure mounting and reliable connections on PCBs.

Maximum Supply Current: 40 mA

The maximum supply current of 40mA ensures power efficiency and stable operation.

No. of Words: 65536 words

With 65,536 words capacity, this FIFO offers ample storage for data-intensive applications.

Memory Width: 36

The memory width of 36 bits ensures efficient data processing and storage capabilities.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm allows for high-density mounting and space-saving design.

No. of Words Code: 64K

The 64K words code provides a standardized format for data storage and retrieval.

Moisture Sensitivity Level (MSL): 3

The MSL level of 3 indicates moderate moisture sensitivity, suitable for various operating environments.

Maximum Supply Voltage (Vsup): 3.45 V

The maximum supply voltage of 3.45V ensures compatibility with higher voltage systems and power sources.

Memory Density: 2359296 bit

With a high memory density of 2,359,296 bits, this FIFO offers ample storage capacity for data-intensive applications.

Memory IC Type: OTHER FIFO

The use of a specialized FIFO memory IC ensures efficient data handling and reliable performance.

Output Enable: YES

The output enable feature allows for control over data output and enhances flexibility in data processing.

Maximum Standby Current: 0.015 Amp

The low maximum standby current of 0.015A ensures power efficiency during idle periods.

Maximum Access Time: 10 ns

With a maximum access time of 10 nanoseconds, this FIFO provides fast data retrieval and efficient operation.

Technical Specifications

FIFO 72V36100L15PFI attributes and parameters. Explore more FIFO devices from Integrated Device Technology

Specs

Maximum Access Time:

10 ns

Additional Features:

RETRANSMIT; AUTO POWER DOWN; ASYNCHRONOUS MODE IS ALSO POSSIBLE

Maximum Clock Frequency (fCLK):

66.7 MHz

Cycle Time:

15 ns

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e0

Length:

20 mm

Memory Density:

2359296 bit

Memory IC Type:

Memory Width:

36

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

128

No. of Words:

65536 words

No. of Words Code:

64K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

64KX36

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.63X.87,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

225

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Standby Current:

.015 Amp

Sub-Category:

FIFOs

Maximum Supply Current:

40 mA

Maximum Supply Voltage (Vsup):

3.45 V

Minimum Supply Voltage (Vsup):

3.15 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Trade Compliance

72V36100L15PFI Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

PCN

Manufacturer Highlights

Integrated Device Technology

Renesas Electronics Corporation (TSE: 6723, “Renesas”), a premier supplier of advanced semiconductor solutions, and Integrated Device Technology, Inc. (“IDT”), a leading supplier of analog mixed-signal products, including sensors, connectivity and wireless power, today jointly announced the successful completion of Renesas’ acquisition of IDT, as of March 30, 2019 JST, March 29, 2019 PDT, following approvals by IDT shareholders and the relevant regulatory authorities.

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