Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MT48LC2M32B2P-6AAAT:J
Micron Technology
SYNCHRONOUS DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 86; Package Code: TSOP2; Package Shape: RECTANGULAR; Terminal Position: DUAL;
FOUR BANK PAGE BURST
5.4 ns
AUTO/SELF REFRESH
R-PDSO-G86
22.22 mm
67108864 bit
SYNCHRONOUS DRAM
32
1
86
2097152 words
2M
SYNCHRONOUS
105 Cel
-40 Cel
2MX32
PLASTIC/EPOXY
TSOP2
RECTANGULAR
SMALL OUTLINE, THIN PROFILE
AEC-Q100
1.2 mm
YES
3.6 V
3 V
3.3
CMOS
INDUSTRIAL
GULL WING
.5 mm
DUAL
10.16 mm
MT48LC2M32B2P-6AAIT:J
Micron Technology's MT48LC2M32B2P-6AAIT:J is a 3.3V, 2MX32 Synchronous DRAM with 67108864-bit memory density. Operating at -40 to 85 °C, it features a fast access time of 5.4 ns and is ideal for industrial applications requiring high-speed data processing.
85 Cel
MT48LC2M32B2P-5:J
SYNCHRONOUS DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 86; Package Code: TSOP2; Refresh Cycles: 4096; Package Shape: RECTANGULAR;
4.5 ns
200 MHz
COMMON
1,2,4,8
e3
70 Cel
0 Cel
3-STATE
TSSOP86,.46,20
260
Not Qualified
4096
1,2,4,8,FP
DRAMs
COMMERCIAL
Matte Tin (Sn)
30
MT42L128M32D1LF-25WT:A
LPDDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 168; Package Code: VFBGA; Refresh Cycles: 8192; Package Shape: SQUARE;
SINGLE BANK PAGE BURST
5.5 ns
SELF CONTAINED REFRESH; ALSO REQUIRES 1.8 V SUPPLY
400 MHz
4,8,16
S-PBGA-B168
e1
12 mm
4294967296 bit
LPDDR2 DRAM
168
134217728 words
128M
-30 Cel
128MX32
VFBGA
BGA168,23X23,20
SQUARE
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
1.2,1.8
8192
.75 mm
.0001 Amp
194 mA
1.3 V
1.14 V
1.2
OTHER
TIN SILVER COPPER
BALL
BOTTOM
MT16HTF25664HZ-667H1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 200; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
333 MHz
R-PDMA-N200
17179869184 bit
DDR DRAM MODULE
64
200
268435456 words
256M
256MX64
DIMM
DIMM200,24
MICROELECTRONIC ASSEMBLY
1.8
.112 Amp
3440 mA
NO
NO LEAD
.6 mm
MT16HTF25664HZ-800H1
DUAL BANK PAGE BURST
AUTO/SELF REFRESH; WD-MAX
R-XZMA-N200
e4
67.6 mm
UNSPECIFIED
30.15 mm
3760 mA
1.9 V
1.7 V
GOLD
ZIG-ZAG
3.8 mm
MT18HTF25672PKZ-80EH1
DRAMs; Temperature Grade: COMMERCIAL; No. of Terminals: 244; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
.4 ns
R-PDMA-N244
19327352832 bit
72
244
256MX72
DIMM244,24
Other Memory ICs
4230 mA
MT36HTF51272FZ-667H1D6
DRAMs; No. of Terminals: 240; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR; Memory Density: 38654705664 bit;
R-PDMA-N240
38654705664 bit
240
536870912 words
512M
512MX72
DIMM240,40
1.5,1.8
4480 mA
1 mm
MT47H256M8THN-3:H
DDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 63; Package Code: FBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
R-PBGA-B63
2147483648 bit
DDR2 DRAM
8
63
256MX8
FBGA
BGA63,9X11,32
GRID ARRAY, FINE PITCH
.014 Amp
192 mA
.8 mm
MT47H512M4THN-3:H
4
512MX4
MT8HTF12864HDZ-667H1
MT8HTF12864HDZ-667H1 by Micron Technology is a 128MX64 DDR DRAM MODULE with 400 MHz clock frequency. It operates at 1.8V, has 200 terminals, and supports DUAL BANK PAGE BURST access mode. Ideal for applications requiring high-speed synchronous memory with a memory density of 8589934592 bits.
8589934592 bit
128MX64
.056 Amp
1430 mA
.45 mm
MT8HTF12864HDZ-800H1
SELF REFRESH; WD-MAX
1790 mA
MT9HTF12872PZ-667H1
DRAMs; Temperature Grade: COMMERCIAL; No. of Terminals: 240; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
.45 ns
9663676416 bit
128MX72
.063 Amp
1665 mA
MT9HTF12872RHZ-80EH1
DRAMs; Temperature Grade: COMMERCIAL; No. of Terminals: 200; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
1890 mA
MT9HVF12872PKZ-80EH1
3015 mA
MT48LC16M16A2B4-7E:G
Micron Technology's MT48LC16M16A2B4-7E:G is a 16MX16 DRAM with 3.3V supply, 143 MHz clock frequency, and 5.4 ns access time. Ideal for commercial applications requiring high-speed memory with common I/O type and self-refresh capability in a compact grid array package.
143 MHz
S-PBGA-B54
8 mm
268435456 bit
16
54
16777216 words
16M
16MX16
BGA54,9X9,32
.0025 Amp
150 mA
Tin/Silver/Copper (Sn/Ag/Cu)
MT48LC32M8A2P-6AIT:G
Micron Technology's MT48LC32M8A2P-6AIT:G is a 32MX8 DRAM with 3.3V supply, operating at 167MHz clock frequency. Ideal for industrial applications, it offers synchronous operation, self-refresh capability, and a small outline package style.
167 MHz
R-PDSO-G54
33554432 words
32M
32MX8
TSOP54,.46,32
100 mA
MATTE TIN
MT48LC2M32B2TG-6A:J
166 MHz
e0
180 mA
TIN LEAD
MT41K512M16TNA-107:E
DDR3L DRAM; No. of Terminals: 96; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR; Memory Width: 16;
MULTI BANK PAGE BURST
934.5 MHz
4,8
R-PBGA-B96
14 mm
DDR3L DRAM
96
512MX16
TFBGA
BGA96,6X16,32
GRID ARRAY, THIN PROFILE, FINE PITCH
1.283 V
1.45 V
1.35
10 mm
MT41K512M16TNA-125IT:E
Micron Technology's MT41K512M16TNA-125IT:E is a DDR3L DRAM with 512MX16 organization, operating at 800 MHz clock frequency. It features synchronous operation, self-refresh capability, and common I/O type. Ideal for industrial applications requiring high memory density and fast data access.
800 MHz
95 Cel
1.425 V
MT9JSF25672AZ-1G9K1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 240; Package Code: DIMM; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 1.575 V;
R-XDMA-N240
133.35 mm
30.5 mm
1.575 V
1.5
2.7 mm
MT41K128M16HA-15EIT:D
DDR3L DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 96; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
.255 ns
667 MHz
128MX16
BGA96,9X16,32
.012 Amp
425 mA
9 mm
MT41K256M8DA-107IT:K
DDR3L DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 78; Package Code: TFBGA; Package Shape: RECTANGULAR; Length: 10.5 mm;
AUTO/SELF REFRESH; ALSO OPERATES AT 1.5V NOMINAL SUPPLY
R-PBGA-B78
10.5 mm
78
MT42L16M32D1AC-25AAT:A
LPDDR2 DRAM; No. of Terminals: 134; Package Code: VFBGA; Package Shape: RECTANGULAR; JESD-30 Code: R-PBGA-B134; JESD-609 Code: e1;
SELF REFRESH
R-PBGA-B134
11.5 mm
536870912 bit
134
16MX32
1.95 V
.65 mm
MT42L16M32D1AC-25AIT:A
LPDDR2 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 134; Package Code: VFBGA; Package Shape: RECTANGULAR; Length: 11.5 mm;
MTA9ASF51272AZ-2G1A1
DDR4 DRAM MODULE; Temperature Grade: OTHER; No. of Terminals: 284; Package Code: DIMM; Package Shape: RECTANGULAR; No. of Words: 536870912 words;
R-XDMA-N284
DDR4 DRAM MODULE
284
31.38 mm
1.26 V
2.61 mm
MT42L128M32D1GU-18WT:A
LPDDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 134; Package Code: VFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
SELF REFRESH; IT ALSO REQUIRES 1.2V NOM
533 MHz
BGA134,10X17,25
.7 mm
220 mA
MT42L128M32D1LH-25WT:A
LPDDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 216; Package Code: VFBGA; Refresh Cycles: 8192; Package Shape: SQUARE;
S-PBGA-B216
216
BGA216,29X29,16
.4 mm
MT42L128M64D2LL-18WT:A
.002 Amp
MT42L128M64D2LL-25WT:A
MT42L128M64D2MC-18WT:A
LPDDR2 DRAM; No. of Terminals: 240; Package Code: VFBGA; Package Shape: SQUARE; Operating Mode: SYNCHRONOUS; Nominal Supply Voltage / Vsup (V): 1.8;
S-PBGA-B240
MT42L128M64D2MP-25WT:A
LPDDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 220; Package Code: VFBGA; Refresh Cycles: 8192; Package Shape: SQUARE;
S-PBGA-B220
220
BGA220,27X27,20
MT42L256M32D2LG-25WT:A
256MX32
MT42L256M32D2LK-18WT:A
MT42L256M64D4EV-18WT:A
LPDDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 253; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: SQUARE;
S-PBGA-B253
11 mm
253
BGA253,17X17,20
MT42L256M64D4EV-25WT:A
MT42L256M64D4LD-25WT:A
MT42L256M64D4LM-18WT:A
LPDDR2 DRAM; No. of Terminals: 216; Package Code: VFBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH; Terminal Form: BALL;
MT42L256M64D4LM-25WT:A
LPDDR2 DRAM; No. of Terminals: 216; Package Code: VFBGA; Package Shape: SQUARE; No. of Words Code: 256M; Terminal Finish: TIN SILVER COPPER;
MT48LC4M16A2B4-6A:J
SYNCHRONOUS DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 54; Package Code: VFBGA; Refresh Cycles: 4096; Package Shape: SQUARE;
4194304 words
4M
4MX16
MT48LC4M16A2B4-6AIT:J
Micron Technology's MT48LC4M16A2B4-6AIT:J is a 4MX16 Synchronous DRAM with 3.3V supply, operating at 167MHz. It features a very thin profile grid array package and supports common I/O type. Ideal for industrial applications requiring fast access times and low power consumption.
MT48LC4M16A2B4-7E:J
MT48LC8M8A2P-6A:J
Micron Technology's MT48LC8M8A2P-6A:J is a 3.3V Synchronous DRAM with 8MX8 organization, operating at 167MHz clock frequency. It features common I/O type, self-refresh mode, and 4096 refresh cycles. Ideal for commercial applications requiring high-speed memory access in a compact form factor.
8388608 words
8M
8MX8
MT47H64M16HR-25E:HTR
DDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 84; Package Code: TFBGA; Package Shape: RECTANGULAR; No. of Words Code: 64K;
R-PBGA-B84
12.5 mm
1048576 bit
84
65536 words
64K
64KX16
MT46H256M32L4JV-5WT:B
DDR1 DRAM; Temperature Grade: OTHER; No. of Terminals: 168; Package Code: VFBGA; Refresh Cycles: 8192; Package Shape: SQUARE;
5 ns
2,4,8,16
DDR1 DRAM
-25 Cel
.00001 Amp
MT9KSF51272HZ-1G6E1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 204; Package Code: DIMM; Package Shape: RECTANGULAR; Width: 3.8 mm;
AUTO/SELF REFRESH; WD-MAX; ALSO OPERATES AT 1.5V NOMINAL SUPPLY
R-XZMA-N204
204
MTA18ADF1G72PZ-2G1A1
DDR DRAM MODULE; Temperature Grade: OTHER; No. of Terminals: 288; Package Code: DIMM; Package Shape: RECTANGULAR; Terminal Form: NO LEAD;
R-XDMA-N288
77309411328 bit
288
1073741824 words
1G
1GX72
18.9 mm
3.9 mm
MTA18ASF1G72HZ-2G1A1
Micron Technology's MTA18ASF1G72HZ-2G1A1 DDR DRAM MODULE offers 1GX72 organization, 72-bit memory width, and operates at 1.2V. Ideal for servers and high-performance computing applications due to its synchronous operation and self-refresh capability.
R-XZMA-N260
69.6 mm
NOT SPECIFIED
30.13 mm
3.7 mm
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