Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MT8HTF12864AZ-800M1
Micron Technology
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 240; Package Code: DIMM; Package Shape: RECTANGULAR; Additional Features: SELF REFRESH; WD-MAX;
SINGLE BANK PAGE BURST
SELF REFRESH; WD-MAX
R-XDMA-N240
133.35 mm
8589934592 bit
DDR DRAM MODULE
64
1
240
134217728 words
128M
SYNCHRONOUS
70 Cel
0 Cel
128MX64
UNSPECIFIED
DIMM
RECTANGULAR
MICROELECTRONIC ASSEMBLY
30.5 mm
YES
1.9 V
1.7 V
1.8
NO
CMOS
COMMERCIAL
NO LEAD
DUAL
2.7 mm
MT8HTF12864HDZ-800M1
Micron Technology's MT8HTF12864HDZ-800M1 is a 128MX64 DDR DRAM MODULE with 8589934592 bit memory density. It operates synchronously at 1.8V, featuring dual bank page burst access mode. Ideal for commercial applications, this rectangular microelectronic assembly has a max temperature of 70°C.
DUAL BANK PAGE BURST
PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH; WD-MAX
R-XDMA-N200
67.6 mm
200
30.15 mm
3.8 mm
MT9HTF12872AZ-80EM1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 240; Package Shape: RECTANGULAR; Memory Width: 72; Technology: CMOS;
AUTO/SELF REFRESH; WD-MAX
9663676416 bit
72
128MX72
MT9HTF12872PZ-80EM1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 240; Package Code: DIMM; Package Shape: RECTANGULAR; Self Refresh: YES;
260
1 mm
30
MT9HTF12872RHZ-80EM1
Micron Technology's MT9HTF12872RHZ-80EM1 is a 128MX72 DDR DRAM MODULE with 9663676416 bit memory density. Operating at 1.8V, it features SYNCHRONOUS mode and SELF REFRESH capability. Ideal for commercial applications, this MICROELECTRONIC ASSEMBLY has a temperature range of 0-70 °C.
R-XZMA-N200
ZIG-ZAG
MT41K256M16HA-125AAT:E
DDR3L DRAM; No. of Terminals: 96; Package Code: TFBGA; Package Shape: RECTANGULAR; Memory Density: 4294967296 bit; Operating Mode: SYNCHRONOUS;
MULTI BANK PAGE BURST
AUTO/SELF REFRESH
R-PBGA-B96
14 mm
4294967296 bit
DDR3L DRAM
16
96
268435456 words
256M
256MX16
PLASTIC/EPOXY
TFBGA
GRID ARRAY, THIN PROFILE, FINE PITCH
AEC-Q100
1.2 mm
1.45 V
1.283 V
1.35
BALL
.8 mm
BOTTOM
9 mm
MT41K256M16HA-125AIT:E
Micron Technology's MT41K256M16HA-125AIT:E is a DDR3L DRAM with 256MX16 organization, operating at 1.35V. It features synchronous mode, self-refresh capability, and multi-bank page burst access for high-performance applications in automotive electronics.
MT41K512M8RH-125AAT:E
DDR3L DRAM; No. of Terminals: 78; Package Code: TFBGA; Package Shape: RECTANGULAR; Maximum Seated Height: 1.2 mm; Memory Density: 4294967296 bit;
R-PBGA-B78
10.5 mm
8
78
536870912 words
512M
512MX8
MT41K512M8RH-125AIT:E
DDR3L DRAM; No. of Terminals: 78; Package Code: TFBGA; Package Shape: RECTANGULAR; Terminal Position: BOTTOM; Operating Mode: SYNCHRONOUS;
MT46H128M16LFB7-5IT:B
DDR1 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 60; Package Code: VFBGA; Package Shape: SQUARE; No. of Functions: 1;
FOUR BANK PAGE BURST
5 ns
S-PBGA-B60
e1
10 mm
2147483648 bit
DDR1 DRAM
60
85 Cel
-40 Cel
128MX16
VFBGA
SQUARE
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
1.95 V
INDUSTRIAL
TIN SILVER COPPER
MT46H128M16LFDD-48WT:C
LPDDR1 DRAM; Temperature Grade: OTHER; No. of Terminals: 60; Package Code: VFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
4.8 ns
208 MHz
COMMON
2,4,8,16
R-PBGA-B60
LPDDR1 DRAM
-25 Cel
3-STATE
BGA60,9X10,32
Not Qualified
8192
.00001 Amp
DRAMs
90 mA
OTHER
8 mm
MT46H128M32L2KQ-6IT:B
Micron Technology's MT46H128M32L2KQ-6IT:B is a DDR1 DRAM with 128MX32 organization, operating at 1.8V. It features synchronous operation, self-refresh capability, and industrial temperature grade suitability. This memory IC has a max access time of 5ns and is ideal for applications requiring high-speed data processing in industrial environments.
S-PBGA-B168
12 mm
32
168
128MX32
.75 mm
.5 mm
MT46H256M32L4JV-5IT:B
DDR1 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 168; Package Code: VFBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH;
256MX32
MT46H256M32L4JV-6WT:B
DDR1 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 168; Package Code: VFBGA; Package Shape: SQUARE; Maximum Access Time: 5 ns;
Tin/Silver/Copper (Sn/Ag/Cu)
MT46H256M32L4SA-48WT:C
LPDDR1 DRAM; Temperature Grade: OTHER; No. of Terminals: 168; Package Code: FBGA; Refresh Cycles: 8192; Package Shape: SQUARE;
FBGA
BGA168,23X23,20
GRID ARRAY, FINE PITCH
MT46H64M32LFCX-5IT:B
DDR1 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 90; Package Code: VFBGA; Package Shape: RECTANGULAR; JESD-609 Code: e1;
R-PBGA-B90
13 mm
90
67108864 words
64M
64MX32
MT46H64M32LFMA-5IT:B
DDR1 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 168; Package Code: VFBGA; Package Shape: SQUARE; Additional Features: AUTO/SELF REFRESH;
.7 mm
MT48LC16M8A2BB-6AAAT:L
SYNCHRONOUS DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 60; Package Code: TFBGA; Package Shape: RECTANGULAR; No. of Functions: 1;
5.4 ns
16 mm
134217728 bit
SYNCHRONOUS DRAM
16777216 words
16M
105 Cel
16MX8
3.6 V
3 V
3.3
MT48LC16M8A2BB-6AAIT:L
SYNCHRONOUS DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 60; Package Code: TFBGA; Package Shape: RECTANGULAR; Length: 16 mm;
MT48LC16M8A2P-6AAIT:L
SYNCHRONOUS DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 54; Package Code: TSOP2; Package Shape: RECTANGULAR; Length: 22.22 mm;
R-PDSO-G54
e3
22.22 mm
54
TSOP2
SMALL OUTLINE, THIN PROFILE
Matte Tin (Sn)
GULL WING
10.16 mm
MT48LC8M16A2B4-6AAIT:L
Micron Technology's MT48LC8M16A2B4-6AAIT:L is a 8MX16 Synchronous DRAM with 134217728 bit memory density. Operating at 3.3V, it offers a max access time of 5.4 ns and features self-refresh capability. Ideal for industrial applications requiring high-speed and reliable memory performance.
S-PBGA-B54
8388608 words
8M
8MX16
MT48LC8M16A2P-6AAIT:L
Micron Technology's MT48LC8M16A2P-6AAIT:L is a 8MX16 Synchronous DRAM with 8388608 words, 134217728 bit memory density, and operates at 3.3V. It features self-refresh mode, industrial temperature grade, and is suitable for applications requiring fast access time and high memory capacity.
MT18HVF25672PDZ-667H1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 240; Package Code: DIMM; Package Shape: RECTANGULAR; Memory Density: 19327352832 bit;
e4
19327352832 bit
256MX72
4 mm
GOLD
17.9 mm
MT46H16M32LFB5-6AT:C
DDR1 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 90; Package Code: VFBGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH;
536870912 bit
16MX32
MT46H16M32LFB5-6IT:C
DDR1 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 90; Package Code: VFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
166 MHz
BGA90,9X15,32
105 mA
MT46H32M16LFBF-6AT:C
Micron Technology's MT46H32M16LFBF-6AT:C is a DDR1 DRAM with 32MX16 organization, 33554432 words, and 536870912 bit memory density. Operating at 105 °C max temp, it suits industrial applications requiring fast access times of 5 ns. With synchronous operation and self-refresh capability, this DRAM offers reliable performance in various electronic systems.
33554432 words
32M
32MX16
MT46H32M16LFBF-6IT:C
Micron Technology's MT46H32M16LFBF-6IT:C is a 32MX16 DDR1 DRAM with 536870912 bit memory density. It operates at 166 MHz clock frequency, suitable for industrial applications requiring fast access time of 5 ns. The package style is grid array with very thin profile and fine pitch, making it ideal for space-constrained designs.
110 mA
MT48H16M32LFB5-75IT:C
DDR DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 90; Package Code: VFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
133 MHz
1,2,4,8
DDR DRAM
95 mA
MT48H32M16LFB4-75IT:C
DDR DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 54; Package Code: VFBGA; Refresh Cycles: 8192; Package Shape: SQUARE;
BGA54,9X9,32
MT49H16M36BM-25:A
DDR DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 144; Package Code: TBGA; Package Shape: RECTANGULAR; Maximum Operating Temperature: 70 Cel;
20 ns
AUTO REFRESH
400 MHz
R-PBGA-B144
18.5 mm
603979776 bit
36
144
16MX36
TBGA
BGA144,12X18,40/32
GRID ARRAY, THIN PROFILE
1.5/1.8,1.8,2.5
2,4,8
.048 Amp
1100 mA
11 mm
MT46V32M8P-5BIT:K
DDR1 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 66; Package Code: TSSOP; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
.7 ns
200 MHz
R-PDSO-G66
268435456 bit
66
32MX8
TSSOP
TSSOP66,.46
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
2.6
.004 Amp
290 mA
2.7 V
2.5 V
MATTE TIN
.65 mm
MT8HTF12864HTZ-667H1
DDR DRAM MODULE; Temperature Grade: INDUSTRIAL; No. of Terminals: 200; Package Code: DIMM; Package Shape: RECTANGULAR; Package Style (Meter): MICROELECTRONIC ASSEMBLY;
SELF CONTAINED REFRESH
30 mm
MT9VDDT6472HIY-335F2
Micron Technology's MT9VDDT6472HIY-335F2 is a 64MX72 DDR DRAM MODULE with 4831838208-bit memory density. Operating at 2.5V, it features synchronous mode and self-refresh capability. Ideal for commercial applications requiring high-speed single bank page burst access.
4831838208 bit
64MX72
2.3 V
2.5
31.75 mm
MT41J128M8JP-125:G
DDR3 DRAM; Temperature Grade: OTHER; No. of Terminals: 78; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
.1 ns
800 MHz
11.5 mm
1073741824 bit
DDR3 DRAM
3
128MX8
BGA78,9X13,32
1.5
600 mA
1.575 V
1.425 V
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
MT41J128M8JP-15E:G
.125 ns
667 MHz
490 mA
MT41J128M8JP-15EIT:G
DDR3 DRAM; No. of Terminals: 78; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 1.575 V;
MT41J256M4JP-125:G
4
256MX4
400 mA
MT41J256M4JP-15E:G
315 mA
MT41J64M16JT-125:G
DDR3 DRAM; Temperature Grade: OTHER; No. of Terminals: 96; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
64MX16
BGA96,9X16,32
.012 Amp
300 mA
MT41J64M16JT-125E:G
DDR3 DRAM; Temperature Grade: OTHER; No. of Terminals: 96; Package Code: TFBGA; Package Shape: RECTANGULAR; Maximum Seated Height: 1.2 mm;
MT41J64M16JT-15E:G
MT41J64M16JT-15E:G by Micron Technology is a DDR3 DRAM with 64MX16 organization, operating at 667 MHz. It features a 1.5V supply voltage and offers 67108864 words of memory. Ideal for applications requiring high-speed synchronous operation and common I/O type, such as servers, workstations, and networking equipment.
265 mA
MT41J64M16JT-15EIT:G
Micron Technology's MT41J64M16JT-15EIT:G is a DDR3 DRAM with 64MX16 organization, operating at 667 MHz. It features a 1.5V supply voltage and offers 67108864 words of memory. Suitable for applications requiring high-speed synchronous memory access in compact devices.
MT41J64M16JT-187E:G
.15 ns
533 MHz
MT18HTF25672PDZ-667H1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 240; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
.45 ns
SELF CONTAINED REFRESH; WD-MAX
333 MHz
DIMM240,40
.126 Amp
1728 mA
MT4HTF6464HZ-667H1
DDR DRAM MODULE; Temperature Grade: INDUSTRIAL; No. of Terminals: 200; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
WD-MAX
64MX64
DIMM200,24
.028 Amp
1400 mA
.6 mm
2.45 mm
MT4JSF12864HZ-1G4D1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 204; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
.255 ns
R-XDMA-N204
204
DIMM204,24
NOT SPECIFIED
1700 mA
MT4JTF12864AZ-1G4D1
1.5,3.3
1780 mA
Gold (Au)
MT48LC32M16A2P-75IT:CTR
Micron Technology's MT48LC32M16A2P-75IT:CTR is a 32MX16 DRAM with 33554432 words, 16-bit memory width, and 536870912 bit memory density. It operates synchronously at -40 to 85 °C, suitable for industrial applications requiring fast access time of 5.4 ns.
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