Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MT48H16M32L2B5-10IT
Micron Technology
SYNCHRONOUS DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 90; Package Code: LFBGA; Package Shape: RECTANGULAR; Access Mode: FOUR BANK PAGE BURST;
FOUR BANK PAGE BURST
AUTO/SELF REFRESH
R-PBGA-B90
e1
13 mm
536870912 bit
SYNCHRONOUS DRAM
32
1
90
16777216 words
16M
SYNCHRONOUS
85 Cel
-40 Cel
16MX32
PLASTIC/EPOXY
LFBGA
RECTANGULAR
GRID ARRAY, LOW PROFILE, FINE PITCH
Not Qualified
1.4 mm
YES
1.9 V
1.7 V
1.8
CMOS
INDUSTRIAL
TIN SILVER COPPER
BALL
.8 mm
BOTTOM
8 mm
MT48H16M32L2B5-10
SYNCHRONOUS DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 90; Package Code: LFBGA; Package Shape: RECTANGULAR; Additional Features: AUTO/SELF REFRESH;
70 Cel
0 Cel
COMMERCIAL
MT48H16M32L2B5-8IT
SYNCHRONOUS DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 90; Package Code: LFBGA; Package Shape: RECTANGULAR; Memory Density: 536870912 bit;
8.5 ns
MT48H16M32L2B5-8
SYNCHRONOUS DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 90; Package Code: LFBGA; Package Shape: RECTANGULAR; Self Refresh: YES;
MT48H16M32L2F5-10IT
SYNCHRONOUS DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 90; Package Code: LFBGA; Package Shape: RECTANGULAR; Qualification: Not Qualified;
e0
TIN LEAD SILVER
MT48H16M32L2F5-10
SYNCHRONOUS DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 90; Package Code: LFBGA; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 1.9 V;
MT48H16M32L2F5-8IT
SYNCHRONOUS DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 90; Package Code: LFBGA; Package Shape: RECTANGULAR; Terminal Position: BOTTOM;
MT48H16M32L2F5-8
SYNCHRONOUS DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 90; Package Code: LFBGA; Package Shape: RECTANGULAR; Memory Width: 32;
MT48LC32M8A2P-75IT:DTR
SYNCHRONOUS DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 54; Package Code: TSOP2; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;
5.4 ns
R-PDSO-G54
e3
22.22 mm
268435456 bit
8
54
33554432 words
32M
32MX8
TSOP2
SMALL OUTLINE, THIN PROFILE
260
1.2 mm
3.6 V
3 V
3.3
Matte Tin (Sn)
GULL WING
DUAL
30
10.16 mm
MT46V64M8BN-6IT:FTR
DDR1 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 60; Package Code: TBGA; Package Shape: RECTANGULAR; Surface Mount: YES;
.7 ns
R-PBGA-B60
12.5 mm
DDR1 DRAM
60
67108864 words
64M
64MX8
TBGA
GRID ARRAY, THIN PROFILE
2.7 V
2.3 V
2.5
Tin/Silver/Copper (Sn/Ag/Cu)
1 mm
10 mm
MT47H128M8HQ-3:ETR
DDR2 DRAM; Temperature Grade: COMMERCIAL EXTENDED; No. of Terminals: 60; Package Code: TFBGA; Package Shape: RECTANGULAR; Qualification: Not Qualified;
MULTI BANK PAGE BURST
.45 ns
11.5 mm
1073741824 bit
DDR2 DRAM
134217728 words
128M
128MX8
TFBGA
GRID ARRAY, THIN PROFILE, FINE PITCH
COMMERCIAL EXTENDED
MT48H16M16LFBF-75:GTR
SYNCHRONOUS DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 54; Package Code: VFBGA; Package Shape: RECTANGULAR; Minimum Operating Temperature: 0 Cel;
6 ns
R-PBGA-B54
9 mm
16
16MX16
VFBGA
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
1.95 V
MT48LC32M16A2P-75:CTR
Micron Technology's MT48LC32M16A2P-75:CTR is a 32MX16 DRAM with 33554432 words and 536870912 bit memory density. Operating at 3.3V, it offers synchronous operation, self-refresh capability, and a max access time of 5.4 ns. Ideal for commercial applications requiring fast and reliable memory performance.
32MX16
MT48LC4M32LFB5-8IT:GTR
SYNCHRONOUS DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 90; Package Code: VFBGA; Package Shape: RECTANGULAR; Qualification: Not Qualified;
7 ns
134217728 bit
4194304 words
4M
4MX32
MT47H128M8CF-187E:H
DDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 60; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
.35 ns
533 MHz
COMMON
4,8
3-STATE
BGA60,9X11,32
8192
DRAMs
250 mA
OTHER
MT47H128M8CF-25:H
Micron Technology's MT47H128M8CF-25:H is a DDR2 DRAM with 128MX8 organization, operating at 400 MHz. It features synchronous mode, self-refresh capability, and common I/O type. Ideal for applications requiring high-speed memory access in devices with limited space and power constraints.
.4 ns
400 MHz
210 mA
MT47H128M8CF-25E:H
Micron Technology's MT47H128M8CF-25E:H is a DDR2 DRAM with 128MX8 organization, operating at 400 MHz. It features a 1.8V supply voltage and offers 8192 refresh cycles. Ideal for applications requiring high-speed synchronous memory with a capacity of 1073741824 bits in a compact grid array package.
MT47H128M8CF-25EIT:H
DDR2 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 60; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
MT47H128M8CF-3:H
Micron Technology's MT47H128M8CF-3:H is a DDR2 DRAM with 128MX8 organization, operating at 333 MHz. It features synchronous mode, self-refresh capability, and common I/O type. Suitable for applications requiring high-speed memory access in devices like computers and networking equipment.
333 MHz
3
185 mA
MT47H128M8CF-3IT:H
Micron Technology's MT47H128M8CF-3IT:H is a DDR2 DRAM with 128MX8 organization, operating at 333 MHz. It features synchronous mode, self-refresh capability, and common I/O type. Ideal for industrial applications requiring high memory density and fast access times.
MT47H128M8CF-3L:H
MT47H256M4CF-25E:H
4
268435456 words
256M
256MX4
MT47H256M4CF-3:H
MT47H256M4CF-3IT:H
MT47H64M16HR-187E:H
DDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 84; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
R-PBGA-B84
84
64MX16
BGA84,9X15,32
.007 Amp
300 mA
MT47H64M16HR-25:H
260 mA
MT47H64M16HR-25E:H
MT47H64M16HR-25EIT:H
Micron Technology's MT47H64M16HR-25EIT:H is a DDR2 DRAM with 64MX16 organization, operating at 400 MHz. It features synchronous mode, self-refresh capability, and common I/O type. Ideal for industrial applications requiring high memory density and fast access times.
MT47H64M16HR-25EL:H
MT47H64M16HR-25IT:H
DDR2 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 84; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
MT47H64M16HR-3:H
Micron Technology's MT47H64M16HR-3:H is a DDR2 DRAM with 64MX16 organization, operating at 333 MHz. It features synchronous mode, self-refresh capability, and common I/O type. Ideal for applications requiring high-speed memory access in devices such as computers and networking equipment.
230 mA
MT47H64M16HR-3IT:H
Micron Technology's MT47H64M16HR-3IT:H is a DDR2 DRAM with 64MX16 organization, operating at 333 MHz. It features a thin profile grid array package and operates in industrial temperature range. Suitable for applications requiring high-speed synchronous memory with common I/O type and self-refresh capability.
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
MT9HTF12872PKZ-80EH1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 244; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
SINGLE BANK PAGE BURST
R-XDMA-N244
e4
82 mm
9663676416 bit
DDR DRAM MODULE
72
244
128MX72
UNSPECIFIED
DIMM
DIMM244,24
MICROELECTRONIC ASSEMBLY
3.8 mm
1890 mA
NO
Gold (Au)
NO LEAD
.6 mm
30 mm
MT9HTF12872PZ-80EH1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 240; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
R-XDMA-N240
133.35 mm
240
DIMM240,40
30.5 mm
.063 Amp
Other Memory ICs
30.175 mm
MT47H128M8JN-25E:H
MT47H128M8JN-3:H
MT16HTS51264HY-667A1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 200; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
DUAL BANK PAGE BURST
R-XZMA-N200
67.6 mm
34359738368 bit
64
200
536870912 words
512M
512MX64
DIMM200,24
.128 Amp
2824 mA
GOLD
ZIG-ZAG
MT47H64M16HW-3:H
350 mA
MT47H64M16HW-3IT:H
Micron Technology's MT47H64M16HW-3IT:H is a DDR2 DRAM with 64MX16 organization, operating at 333 MHz. It features synchronous mode, self-refresh capability, and common I/O type. Ideal for industrial applications requiring high memory density and fast access times.
235
Tin/Lead/Silver (Sn/Pb/Ag)
MT16VDDF12864HY-335F2
167 MHz
8589934592 bit
128MX64
.08 Amp
4640 mA
MT8VDDT6464HDG-40BF2
200 MHz
R-PDMA-N200
4294967296 bit
64MX64
2.6
.04 Amp
1940 mA
MT18VDDF12872Y-335F1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 184; Package Code: DIMM; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 2.5;
AUTO/SELF REFRESH; WD-MAX
R-XDMA-N184
184
28.73 mm
1.27 mm
3.99 mm
MT18VDDT12872AY-335F1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 184; Package Code: DIMM; Package Shape: RECTANGULAR; No. of Words Code: 128M;
31.9 mm
4 mm
MT8VDDT6464HDG-335F2
1640 mA
MT16VDDT12864AY-335F2
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 184; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
R-PDMA-N184
DIMM184
MT8VDDT3264HY-335G3
2147483648 bit
32MX64
3280 mA
MT36VDDF12872G-335G3
166 MHz
10440 mA
MT4VDDT3264HG-335F2
1620 mA
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