Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MT9JSF25672AZ-1G4K1
Micron Technology
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 240; Package Code: DIMM; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 1.425 V;
SINGLE BANK PAGE BURST
AUTO/SELF REFRESH; WD-MAX
R-XDMA-N240
e4
133.35 mm
19327352832 bit
DDR DRAM MODULE
72
1
240
268435456 words
256M
SYNCHRONOUS
70 Cel
0 Cel
256MX72
UNSPECIFIED
DIMM
RECTANGULAR
MICROELECTRONIC ASSEMBLY
30.5 mm
YES
1.575 V
1.425 V
1.5
NO
CMOS
COMMERCIAL
GOLD
NO LEAD
DUAL
2.7 mm
MT47H128M4CF-187E:G
DDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 60; Package Code: TFBGA; Package Shape: RECTANGULAR; Terminal Form: BALL;
FOUR BANK PAGE BURST
.35 ns
AUTO/SELF REFRESH
R-PBGA-B60
e1
10 mm
536870912 bit
DDR2 DRAM
4
60
134217728 words
128M
85 Cel
128MX4
PLASTIC/EPOXY
TFBGA
GRID ARRAY, THIN PROFILE, FINE PITCH
260
1.2 mm
1.9 V
1.7 V
1.8
OTHER
Tin/Silver/Copper (Sn/Ag/Cu)
BALL
.8 mm
BOTTOM
30
8 mm
MT47H128M8CF-25EAIT:H
DDR2 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 60; Package Code: TFBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
MULTI BANK PAGE BURST
.4 ns
1073741824 bit
8
-40 Cel
128MX8
AEC-Q100
INDUSTRIAL
MT47H128M8CF-3AIT:H
DDR2 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 60; Package Code: TFBGA; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 1.8;
.45 ns
MT47H32M16HR-187E:G
DDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 84; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
533 MHz
COMMON
4,8
R-PBGA-B84
12.5 mm
16
84
33554432 words
32M
32MX16
3-STATE
BGA84,9X15,32
Not Qualified
8192
.007 Amp
DRAMs
TIN SILVER COPPER
MT47H64M16HR-25EAAT:H
DDR2 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 84; Package Code: TFBGA; Package Shape: RECTANGULAR; No. of Ports: 1;
67108864 words
64M
105 Cel
64MX16
NOT SPECIFIED
MT47H64M16HR-25EAIT:H
DDR2 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 84; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
400 MHz
260 mA
MT47H64M16HR-3AAT:H
DDR2 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 84; Package Code: TFBGA; Package Shape: RECTANGULAR; Self Refresh: YES;
MT47H64M16HR-3AIT:H
Micron Technology's MT47H64M16HR-3AIT:H is a DDR2 DRAM with 64MX16 organization, operating at 333 MHz. It features a thin profile grid array package, suitable for industrial applications requiring high-speed synchronous memory with common I/O type and self-refresh capability. With AEC-Q100 screening level, it offers reliable performance in automotive electronics.
333 MHz
230 mA
MT47H64M8CF-187E:G
DDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 60; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
64MX8
BGA60,9X11,32
MT48LC16M8A2BB-6A:L
SYNCHRONOUS DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 60; Package Code: TFBGA; Refresh Cycles: 4096; Package Shape: RECTANGULAR;
5.4 ns
167 MHz
1,2,4,8
16 mm
134217728 bit
SYNCHRONOUS DRAM
16777216 words
16M
16MX8
BGA60,8X15,32
3.3
4096
1,2,4,8,FP
.0025 Amp
100 mA
3.6 V
3 V
MT48LC16M8A2P-6A:L
SYNCHRONOUS DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 54; Package Code: TSOP2; Refresh Cycles: 4096; Package Shape: RECTANGULAR;
R-PDSO-G54
22.22 mm
54
TSOP2
TSOP54,.46,32
SMALL OUTLINE, THIN PROFILE
GULL WING
10.16 mm
MT48LC16M8A2P-6AIT:L
SYNCHRONOUS DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 54; Package Code: TSOP2; Refresh Cycles: 4096; Package Shape: RECTANGULAR;
MT48LC16M8A2P-7E:L
143 MHz
e3
.002 Amp
330 mA
TIN
MT48LC8M16A2B4-6A:L
SYNCHRONOUS DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 54; Package Code: VFBGA; Refresh Cycles: 4096; Package Shape: SQUARE;
S-PBGA-B54
8388608 words
8M
8MX16
VFBGA
BGA54,9X9,32
SQUARE
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
1 mm
MT48LC8M16A2P-7EIT:L
Micron Technology's MT48LC8M16A2P-7EIT:L is a 3.3V Synchronous DRAM with 8MX16 organization, operating at 143 MHz clock frequency. It features common I/O type, self-refresh mode, and industrial temperature grade. Ideal for applications requiring fast access times and high memory density.
Matte Tin (Sn)
MT41J128M16HA-107G:D
Micron Technology's MT41J128M16HA-107G:D is a DDR3 DRAM with 128MX16 organization, operating at 1.5V. It features synchronous mode, self-refresh capability, and multi-bank page burst access for high-performance applications in electronics requiring thin profile grid array packages.
R-PBGA-B96
14 mm
2147483648 bit
DDR3 DRAM
96
128MX16
9 mm
MT41J128M16HA-125G:D
DDR3 DRAM; No. of Terminals: 96; Package Code: TFBGA; Package Shape: RECTANGULAR; Surface Mount: YES; Width: 9 mm;
MT41J128M16JT-093G:K
Micron Technology's MT41J128M16JT-093G:K is a DDR3 DRAM with 128MX16 organization, operating at 1.5V. It features synchronous mode, self-refresh capability, and multi-bank page burst access for high-speed memory applications in various electronic devices.
MT41J128M16JT-107G:K
DDR3 DRAM; No. of Terminals: 96; Package Code: TFBGA; Package Shape: RECTANGULAR; Additional Features: AUTO/SELF REFRESH; Self Refresh: YES;
MT41J256M16HA-093G:E
DDR3 DRAM; Temperature Grade: OTHER; No. of Terminals: 96; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
.18 ns
1066 MHz
4294967296 bit
256MX16
BGA96,9X16,32
.018 Amp
305 mA
MT72JSZS4G72LZ-1G9E2A7
DDR DRAM MODULE; No. of Terminals: 240; Package Code: DIMM; Package Shape: RECTANGULAR; Operating Mode: SYNCHRONOUS; Maximum Supply Voltage (Vsup): 1.575 V;
SELF REFRESH; WD-MAX
309237645312 bit
4294967296 words
4G
4GX72
4.67 mm
MT36KDZS2G72PDZ-1G4E1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 240; Package Code: DIMM; Package Shape: RECTANGULAR; No. of Functions: 1;
AUTO/SELF REFRESH; ALSO OPERATES AT 1.5V SUPPLY; WD-MAX
154618822656 bit
2147483648 words
2G
2GX72
18.9 mm
1.45 V
1.283 V
1.35
4 mm
MT8JTF51264HZ-1G6E1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 204; Package Code: DIMM; Package Shape: RECTANGULAR; Organization: 512MX64;
R-XZMA-N204
67.6 mm
34359738368 bit
64
204
536870912 words
512M
512MX64
30.15 mm
.6 mm
ZIG-ZAG
3.8 mm
MT44K16M36RB-125F:A
DDR DRAM; No. of Terminals: 168; Package Code: TBGA; Package Shape: SQUARE; Self Refresh: YES; Terminal Pitch: 1 mm;
S-PBGA-B168
13.5 mm
603979776 bit
DDR DRAM
36
168
16MX36
TBGA
GRID ARRAY, THIN PROFILE
1.42 V
1.28 V
MT18KDF1G72PDZ-1G4E1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 240; Package Code: DIMM; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 1.45 V;
DUAL BANK PAGE BURST
AUTO/SELF REFRESH; WD-MAX; ALSO OPERATES AT 1.5V NOMINAL SUPPLY
77309411328 bit
1073741824 words
1G
1GX72
MT41K512M16TNA-125M:E
DDR3L DRAM; No. of Terminals: 96; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR; Maximum Seated Height: 1.2 mm;
934.5 MHz
8589934592 bit
DDR3L DRAM
512MX16
BGA96,6X16,32
MT41J128M8JP-107:G
DDR3 DRAM; Temperature Grade: OTHER; No. of Terminals: 78; Package Code: TFBGA; Package Shape: RECTANGULAR; No. of Ports: 1;
R-PBGA-B78
11.5 mm
78
MT41J64M16JT-107:G
DDR3 DRAM; Temperature Grade: OTHER; No. of Terminals: 96; Package Code: TFBGA; Package Shape: RECTANGULAR; No. of Ports: 1;
MT47H256M8EB-25EAIT:C
Micron Technology's MT47H256M8EB-25EAIT:C is a DDR2 DRAM with 256MX8 organization, operating at 1.8V. It features synchronous operation, self-refresh capability, and industrial temperature grade suitability. Ideal for applications requiring high memory density and fast access times in automotive electronics or industrial systems.
256MX8
MT49H16M18CBM-25IT:B
DDR DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 144; Package Code: TBGA; Package Shape: RECTANGULAR; Terminal Position: BOTTOM;
.3 ns
AUTO REFRESH
SEPARATE
2,4,8
R-PBGA-B144
18.5 mm
301989888 bit
18
144
16MX18
BGA144,12X18,40/32
1.5/1.8,1.8,2.5
.005 Amp
655 mA
11 mm
MT41J256M16HA-093:E
Micron Technology's MT41J256M16HA-093:E is a DDR3 DRAM with 256MX16 organization, operating at 1066 MHz. It features synchronous operation, self-refresh capability, and a max clock frequency of 1066 MHz. Ideal for applications requiring high-speed memory access in devices such as computers and servers.
MT41J256M16HA-107:E
.195 ns
933 MHz
95 Cel
274 mA
MT41J256M16HA-125:E
Micron Technology's MT41J256M16HA-125:E is a DDR3 DRAM with 256MX16 organization, operating at 800 MHz. It features a thin profile grid array package and synchronous operation mode. Ideal for applications requiring high-speed memory access in devices like servers and networking equipment.
.225 ns
800 MHz
243 mA
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
MT41J512M8RH-093:E
DDR3 DRAM; Temperature Grade: OTHER; No. of Terminals: 78; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
10.5 mm
512MX8
BGA78,9X13,32
282 mA
MT41J512M8RH-107:E
251 mA
MT41K128M16JT-107G:K
DDR3L DRAM; No. of Terminals: 96; Package Code: TFBGA; Package Shape: RECTANGULAR; Memory Width: 16; Access Mode: MULTI BANK PAGE BURST;
AUTO/SELF REFRESH; ALSO OPERATES AT 1.5V NOMINAL SUPPLY
MT41K256M16HA-107G:E
DDR3L DRAM; No. of Terminals: 96; Package Code: TFBGA; Package Shape: RECTANGULAR; Organization: 256MX16; Package Body Material: PLASTIC/EPOXY;
MT36KDZS2G72PZ-1G4E1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 240; Package Code: DIMM; Package Shape: RECTANGULAR; Package Body Material: UNSPECIFIED;
6.19 mm
MT36KSS2G72RHZ-1G6E1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 204; Package Code: DIMM; Package Shape: RECTANGULAR; Maximum Operating Temperature: 70 Cel;
R-XDMA-N204
MT42L32M32D2AC-25AAT:A
LPDDR2 DRAM; No. of Terminals: 134; Package Code: VFBGA; Package Shape: RECTANGULAR; Operating Mode: SYNCHRONOUS; Surface Mount: YES;
5.5 ns
SELF REFRESH
R-PBGA-B134
LPDDR2 DRAM
32
134
32MX32
1.95 V
.65 mm
MT42L32M32D2AC-25AIT:A
LPDDR2 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 134; Package Code: VFBGA; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 1.95 V;
MT36KSF1G72PZ-1G4K1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 240; Package Code: DIMM; Package Shape: RECTANGULAR; Terminal Position: DUAL;
MT46H128M16LFB7-5AIT:B
LPDDR1 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 60; Package Code: VFBGA; Package Shape: SQUARE; Memory Density: 2147483648 bit;
5 ns
S-PBGA-B60
LPDDR1 DRAM
MT46H64M32LFCX-5AIT:B
LPDDR1 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 90; Package Code: VFBGA; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;
R-PBGA-B90
13 mm
90
64MX32
MT49H16M18BM-18:B
DDR DRAM; No. of Terminals: 144; Package Code: TBGA; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 1.8; Technology: CMOS;
830 mA
MT49H16M18BM-25IT:B
DDR DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 144; Package Code: TBGA; Package Shape: RECTANGULAR; Length: 18.5 mm;
MT49H16M18FM-25:B
DDR DRAM; No. of Terminals: 144; Package Code: TBGA; Package Shape: RECTANGULAR; No. of Ports: 1; Output Characteristics: 3-STATE;
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