Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
Add filters
All
Selected
MT18HTF25672AZ-80EH1
Micron Technology
DRAMs; Temperature Grade: COMMERCIAL; No. of Terminals: 240; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
.4 ns
400 MHz
COMMON
R-PDMA-N240
e3
19327352832 bit
72
1
240
268435456 words
256M
70 Cel
0 Cel
256MX72
3-STATE
PLASTIC/EPOXY
DIMM
DIMM240,40
RECTANGULAR
MICROELECTRONIC ASSEMBLY
1.8
Not Qualified
8192
.126 Amp
Other Memory ICs
1953 mA
NO
CMOS
COMMERCIAL
MATTE TIN
NO LEAD
1 mm
DUAL
MT18HTF25672FDZ-667H1D6
333 MHz
e4
1.5,1.8
4480 mA
GOLD
MT18HTS25672RHZ-80EH1
Micron Technology's MT18HTS25672RHZ-80EH1 is a 256MX72 DRAM module with synchronous operation at 400 MHz clock frequency. It features self-refresh capability, operates at 1.8V, and has a memory density of 19.3 Gb. Ideal for applications requiring high-speed data processing in commercial temperature environments.
DUAL BANK PAGE BURST
AUTO/SELF REFRESH; WD-MAX
R-XZMA-N200
67.6 mm
SYNCHRONOUS DRAM MODULE
200
SYNCHRONOUS
UNSPECIFIED
DIMM200,24
30.15 mm
YES
3123 mA
1.9 V
1.7 V
.6 mm
ZIG-ZAG
3.8 mm
MT18HVF25672PDZ-80EH1
4230 mA
MT18HVF25672PZ-80EH1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 240; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
DDR DRAM MODULE
DRAMs
3780 mA
MT18JDF51272PDZ-1G4D1
.255 ns
667 MHz
38654705664 bit
536870912 words
512M
512MX72
1.5
.216 Amp
3573 mA
MT18JSF51272AZ-1G4D1
3393 mA
MT18JSF51272AZ-1G6M1
DDR3 DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 240; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
800 MHz
DDR3 DRAM MODULE
MT18JSF51272PDZ-1G4D1
MT36HTF1G72PZ-667C1
.45 ns
SELF REFRESH; WD-MAX
R-XDMA-N240
133.35 mm
77309411328 bit
1073741824 words
1G
1GX72
30.5 mm
4 mm
MT36HTF1G72PZ-80EC1
MT36HTF25672PZ-667G1
2646 mA
MT36JSZF1G72PZ-1G4D1
.432 Amp
7200 mA
MT4HTF3264HZ-667G1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 200; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
R-PDMA-N200
2147483648 bit
64
33554432 words
32M
32MX64
.028 Amp
1400 mA
MT4HTF3264HZ-800G1
DDR DRAM MODULE; Temperature Grade: OTHER; No. of Terminals: 200; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
SINGLE BANK PAGE BURST
AUTO/SELF REFRESH
536870912 bit
16
85 Cel
32MX16
1480 mA
3.6 V
OTHER
2.45 mm
MT4HTF6464HZ-800H1
4294967296 bit
67108864 words
64M
64MX64
1760 mA
MT72JSS2G72PZ-1G1D1
.3 ns
533 MHz
154618822656 bit
2147483648 words
2G
2GX72
.864 Amp
7130 mA
MT8HTF12864HZ-667H1
8589934592 bit
134217728 words
128M
128MX64
.056 Amp
2240 mA
MT8HTF12864HZ-800H1
Micron Technology's MT8HTF12864HZ-800H1 is a 128MX64 DDR DRAM MODULE with 400 MHz clock frequency. Operating at 1.8V, it offers 8192 refresh cycles and has a memory density of 8589934592 bits. Ideal for applications requiring high-speed synchronous memory access in commercial temperature environments.
2680 mA
MT8JSF25664HZ-1G1D1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 204; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
R-XZMA-N204
17179869184 bit
204
256MX64
DIMM204,24
1.5,3.3
.096 Amp
2560 mA
1.575 V
1.425 V
MT8JSF25664HZ-1G4D1
Micron Technology's MT8JSF25664HZ-1G4D1 is a 256MX64 DDR DRAM MODULE with 667 MHz clock frequency. Operating at 1.5V, it offers 8192 refresh cycles and features a single bank page burst access mode. Ideal for commercial applications requiring high-speed memory performance in microelectronic assemblies.
R-PDMA-N204
2920 mA
30 mm
MT9HTF12872AZ-667H1
9663676416 bit
128MX72
.063 Amp
2520 mA
MT9HTF12872AZ-80EH1
2250 mA
MT9HTF6472PKZ-667G1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 244; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
R-PDMA-N244
4831838208 bit
244
64MX72
DIMM244,24
1260 mA
MT9HVF12872PZ-80EH1
1890 mA
MT9HVF6472PZ-667G1
MT9JSF25672AZ-1G4D1
.108 Amp
3285 mA
2.7 mm
MT16JTF25664HZ-1G4G1
.192 Amp
4016 mA
MT16JTF25664HZ-1G6G1
4896 mA
MT47H512M8WTR-3:C
DDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 63; Package Code: FBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
R-PBGA-B63
DDR2 DRAM
8
63
512MX8
FBGA
BGA63,9X11,32
GRID ARRAY, FINE PITCH
BALL
.8 mm
BOTTOM
MT8JTF12864HZ-1G4G1
3920 mA
MT8JTF12864HZ-1G6G1
Micron Technology's MT8JTF12864HZ-1G6G1 is a 128MX64 DDR DRAM MODULE with 204 terminals, operating at 800 MHz. It has a memory density of 8589934592 bits and supports a max clock frequency of 800 MHz. Ideal for commercial applications requiring high-speed data processing and storage capabilities.
.225 ns
4800 mA
MT41K1G8THE-15E:D
DDR3L DRAM; Temperature Grade: OTHER; No. of Terminals: 78; Package Code: TFBGA; Package Shape: RECTANGULAR; Terminal Position: BOTTOM;
SELF REFRESH
R-PBGA-B78
12 mm
DDR3L DRAM
78
1GX8
TFBGA
GRID ARRAY, THIN PROFILE, FINE PITCH
1.2 mm
1.45 V
1.283 V
1.35
10.5 mm
MT41K1G8TRF-125:E
MT41K1G8TRF-125:E by Micron Technology is a DDR3L DRAM with 1GX8 organization, operating at 800 MHz. It features a thin profile grid array package and consumes up to 243 mA of current. Ideal for applications requiring high-speed synchronous memory with common I/O type and self-refresh capability.
e0
11.5 mm
BGA78,9X13,32
.036 Amp
243 mA
TIN LEAD SILVER
9.5 mm
MT41K2G4TRF-125:E
DDR3L DRAM; Temperature Grade: OTHER; No. of Terminals: 78; Package Code: TFBGA; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
4
2GX4
MT16KTF51264AZ-1G4M1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; Package Code: DIMM; Width: 4 mm; Organization: 512MX64; Length: 133.35 mm;
34359738368 bit
512MX64
MT8JTF25664HZ-1G4M1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; Package Code: DIMM; Access Mode: SINGLE BANK PAGE BURST; Maximum Seated Height: 30.15 mm; No. of Functions: 1;
MT48LC4M16A2P-75:GTR
Micron Technology's MT48LC4M16A2P-75:GTR is a 3.3V Synchronous DRAM with 4MX16 organization, operating at 70°C max temp. It features self-refresh mode, small outline package, and dual terminal position. Ideal for commercial applications requiring fast access time and high memory density.
FOUR BANK PAGE BURST
5.4 ns
R-PDSO-G54
22.22 mm
67108864 bit
SYNCHRONOUS DRAM
3
54
4194304 words
4M
4MX16
TSOP2
SMALL OUTLINE, THIN PROFILE
260
3 V
3.3
Matte Tin (Sn)
GULL WING
30
10.16 mm
MT48H8M32LFB5-75IT:H
Micron Technology's MT48H8M32LFB5-75IT:H is a 8MX32 DRAM with 133 MHz clock frequency, 85 mA supply current, and 85°C max operating temp. Ideal for industrial applications requiring high-speed synchronous memory with common I/O type and self-refresh capability.
133 MHz
1,2,4,8
R-PBGA-B90
e1
13 mm
268435456 bit
32
90
8388608 words
8M
-40 Cel
8MX32
VFBGA
BGA90,9X15,32
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
4096
1,2,4,8,FP
.00001 Amp
85 mA
1.95 V
INDUSTRIAL
TIN SILVER COPPER
8 mm
MT16LSDF6464HY-13EG1
SYNCHRONOUS DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 144; Package Code: DIMM; Package Shape: RECTANGULAR; Length: 67.585 mm;
R-XZMA-N144
67.585 mm
144
65 Cel
31.88 mm
Gold (Au)
MT16HTF51264HZ-800C1
MT16HTF25664HIZ-667H1
Micron Technology's MT16HTF25664HIZ-667H1 is a 256MX64 DDR DRAM MODULE with 333 MHz clock frequency. It operates synchronously at 1.8V, featuring self-refresh capability and dual bank page burst access mode. Ideal for industrial applications requiring high memory density and fast data processing.
.112 Amp
3440 mA
MT41K512M8RH-125:E
Micron Technology's MT41K512M8RH-125:E is a DDR3L DRAM with 512MX8 organization, operating at 800 MHz. It features synchronous mode, self-refresh capability, and common I/O type. Ideal for applications requiring high-speed memory access in devices like smartphones and tablets.
MULTI BANK PAGE BURST
95 Cel
.016 Amp
220 mA
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
9 mm
MT41K256M16HA-125:E
Micron Technology's MT41K256M16HA-125:E is a DDR3L DRAM with 256MX16 organization, operating at 800 MHz. It features synchronous operation, self-refresh capability, and a low supply voltage of 1.35V. Ideal for applications requiring high-speed memory access in compact electronic devices.
R-PBGA-B96
14 mm
96
256MX16
BGA96,9X16,32
MT18VDDT12872AY-40BF1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 184; Package Code: DIMM; Refresh Cycles: 8192; Package Shape: RECTANGULAR;
.7 ns
200 MHz
R-XDMA-N184
184
DIMM184
2.6
31.9 mm
4095 mA
2.7 V
2.5 V
1.27 mm
MT4JTF25664AZ-1G6E1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 240; Package Code: DIMM; Package Shape: RECTANGULAR; Technology: CMOS;
MT18JSF51272PKZ-1G4K1
DDR DRAM MODULE; Temperature Grade: COMMERCIAL; No. of Terminals: 240; Package Code: DIMM; Package Shape: RECTANGULAR; Length: 82 mm;
82 mm
MT47R128M8CF-25:H
DDR2 DRAM; Temperature Grade: OTHER; No. of Terminals: 60; Package Code: TFBGA; Package Shape: RECTANGULAR; No. of Ports: 1;
R-PBGA-B60
10 mm
1073741824 bit
60
128MX8
NOT SPECIFIED
1.5 V
1.55
© 2023 All rights reserved
