Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Xilinx XCVU9P-1FLGB2104I FPGA features 2586150 logic cells, 147780 CLBs, and 832 inputs/outputs. Ideal for industrial applications, it operates b/w -40 to 100°C with a supply voltage range of 0.825V to 0.876V. This GRID ARRAY package measures 47.5mm x 47.5mm with a seated height of 4.32mm, making it suitable for various high-performance computing tasks.
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The use of plastic/epoxy material provides a cost-effective solution while still maintaining durability and reliability.
The high number of logic cells allows for complex and large-scale programmable logic designs to be implemented efficiently.
Surface mount technology simplifies PCB assembly processes and saves space, making it suitable for compact designs.
The low maximum supply voltage is beneficial for power efficiency and helps in reducing power consumption.
The abundance of Configurable Logic Blocks (CLBs) provides flexibility in designing custom logic functions and circuits.
Having a high number of inputs allows for versatile input configurations and enables handling of multiple input signals efficiently.
The square package shape facilitates easier handling and placement on the PCB, optimizing space utilization.
The ball terminals offer good mechanical connection and reliability, ensuring secure contact with the PCB.
The nominal supply voltage of 0.85V provides a stable operating voltage for the FPGA, ensuring consistent performance.
Having a high number of terminals allows for easy connectivity and routing of signals in complex PCB layouts.
Being a Field Programmable Gate Array (FPGA) offers reconfigurability and adaptability to changing design requirements, making it versatile.
The grid array package style provides a compact and organized arrangement of terminals, improving signal integrity and ease of soldering.
The low minimum supply voltage ensures compatibility with various power sources and aids in design flexibility.
The high maximum operating temperature ensures reliability in harsh environmental conditions and industrial applications.
The 1mm pitch of terminals allows for precise placement and soldering on the PCB, enhancing manufacturing efficiency.
The organized structure of 147780 Configurable Logic Blocks (CLBs) streamlines logic implementation and design flow.
The low minimum operating temperature ensures reliable operation even in extreme cold conditions, suitable for a wide range of environments.
Having terminals at the bottom simplifies PCB layout and assembly, enabling more compact and efficient designs.
The low maximum seated height allows for slim and compact PCB designs, saving space in electronic devices.
The compact width of 47.5mm enables efficient PCB layout and integration of the FPGA into various electronic systems.
With a high number of outputs, the FPGA can support multiple output signals, enabling versatile signal processing capabilities.
The length of 47.5mm complements the width for a compact form factor, allowing for space-efficient PCB designs.
The industrial-grade temperature grading ensures reliable operation in harsh industrial environments, making it suitable for industrial applications.
Field Programmable Gate Arrays (FPGA) XCVU9P-1FLGB2104I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx
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XCVU9P-1FLGB2104I Programmable ICs trade compliance attributes, and parameters.
ECCN
3A001.A.7.B
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD
BAV99WT1G
Fairchild Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
General Diode
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Maximum Reverse Recovery Time: .004 us; Terminal Finish: Tin/Lead (Sn/Pb); No. of Elements: 1;
Sinyork
RECTIFIER DIODE; Surface Mount: NO; Maximum Non Repetitive Peak Forward Current: .5 A; Maximum Output Current: .15 A; Maximum Repetitive Peak Reverse Voltage: 100 V; No. of Phases: 1;
FDN5618P
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Transistor Element Material: SILICON; Moisture Sensitivity Level (MSL): 1;
SMBJ18CA
Bourns
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
261
New England Microwave
Other Interface ICs; No. of Terminals: 14; Package Equivalence Code: FL14(UNSPEC); Power Supplies (V): +-5,-15; Package Body Material: PLASTIC/EPOXY; Surface Mount: YES;
PIC18F4550-I/ML
Microchip Technology
The Microchip Technology PIC18F4550-I/ML is an 8-bit microcontroller with a max clock frequency of 48 MHz. It features 13-Ch 10-Bit ADC channels and USB connectivity, making it ideal for industrial applications requiring high-speed data processing and analog-to-digital conversion. With low power mode and flash ROM programmability, this chip offers efficient performance in compact designs.
CDSOT23-SM712
Bourns CDSOT23-SM712 is a bidirectional Transient Voltage Suppressor diode with 400W peak power dissipation and 20uA reverse current. Ideal for surge protection in applications requiring a max clamping voltage of 14V, such as IEC-61000-4-2 compliant systems. Operates b/w -55°C to 150°C with matte tin finish and Gull Wing terminals.
NE555D
NXP Semiconductors
SQUARE; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: LSOP; Package Shape: RECTANGULAR; Surface Mount: YES;
Bkc Semiconductors
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
CL31B104KBCNNNC
Samsung Electro-mechanics
Samsung Electro-mechanics CL31B104KBCNNNC is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It features X7R temperature characteristics, -55 to 125 °C operating range, and compact SMT package style. Ideal for applications requiring high reliability in compact electronic devices.
2N2222A
Ksl Microdevices
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
1N4148WS
Multicomp Pro
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Semitron
2N7002
North American Philips Discrete Products Div
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Operating Mode: ENHANCEMENT MODE; Maximum Drain Current (ID): .115 A;
LM555CN
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
Plessey Semiconductors Discrete Components Div
Other Transistors;
National Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .5 A;
Forward International Electronics
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Maximum Reverse Recovery Time: .004 us; Maximum Operating Temperature: 200 Cel; No. of Phases: 1;
M39029/56-351
Glenair
CONNECTOR ACCESSORY; Associated Backshell Military - Specifications: MIL-DTL-38999; Material: COPPER ALLOY; Associated Military - Specifications: MIL-DTL-38999; Contact Gender: FEMALE; DIN Conformity: NO;
EP3C5E144C8N
Intel
EP3C5E144C8N by Intel is a CMOS FPGA with 5136 logic cells and CLBs. It operates at 1.2V nominal voltage, suitable for applications requiring high-speed processing and low power consumption in various industries such as telecommunications, automotive, and consumer electronics. With a compact rectangular package style and GULL WING terminals, it offers flexibility for surface mount integration in space-constrained designs.
EP4CE22F17I7N
EP4CE22F17I7N by Intel is a FPGA with 22320 logic cells, 1395 CLBs, and max clock frequency of 472.5 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.
XC7A100T-1CSG324C
Xilinx
Xilinx XC7A100T-1CSG324C FPGA features 101440 logic cells, 7925 CLBs, and a max clock frequency of 1098 MHz. Ideal for high-performance applications requiring fast processing speeds in compact designs with low power consumption.
A3PE1500-PQG208I
A3PE1500-PQG208I by Microchip Technology is a CMOS FPGA with 38400 logic cells and 1500000 equivalent gates. It operates at a supply voltage of 1.5V, suitable for industrial applications requiring high-speed processing and programmable logic capabilities in a compact 28mm square package.
LCMXO2-256HC-4TG100I
Lattice Semiconductor
LCMXO2-256HC-4TG100I by Lattice Semiconductor is a 256 Logic Cell FPGA with 55 inputs/outputs, operating at 2.5V nominal voltage. It comes in a square package with Gull Wing terminals, suitable for applications requiring high-speed processing and programmable logic capabilities.
LCMXO2-2000HC-4TG144I
LCMXO2-2000HC-4TG144I by Lattice Semiconductor is a 2112 logic cell FPGA with 264 CLBs and 111 inputs/outputs. Operating at max clock frequency of 133 MHz, it's ideal for applications requiring high-speed processing in industrial automation and telecommunications.
XC7A50T-L2CSG325E
Xilinx XC7A50T-L2CSG325E FPGA features 52160 logic cells, 4075 CLBs, and operates at a max clock frequency of 1098 MHz. Ideal for applications requiring high-speed processing such as telecommunications, networking, and industrial automation.
LAE5UM-45F-6BG381E
FIELD PROGRAMMABLE GATE ARRAY; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260;
M2GL090T-1FG676I
M2GL090T-1FG676I by Microchip Technology is a CMOS FPGA with 86316 logic cells, 425 inputs/outputs, and operates at temperatures from -40 to 100°C. It comes in a plastic/epoxy package with a grid array style, suitable for industrial applications requiring high-performance programmable ICs.
XC7A100T-3FTG256E
Xilinx XC7A100T-3FTG256E FPGA features 101440 logic cells, 7925 CLBs, and a max clock frequency of 1412 MHz. Ideal for applications requiring high-speed processing such as telecommunications, networking, and industrial automation.
EP3C40Q240C8N
Altera
The EP3C40Q240C8N by Altera is a field programmable gate array (FPGA) with 39,600 logic cells and 128 inputs/outputs. It has a maximum clock frequency of 472.5 MHz and operates at a supply voltage range of 1.15V to 1.25V. This FPGA is surface mountable and has a compact rectangular package shape. Its applications include digital signal processing, communications, and embedded systems.
10M02SCM153C8G
Intel 10M02SCM153C8G FPGA features 2000 logic cells, 125 CLBs, and 246 inputs/outputs. With a supply voltage range of 2.85V to 3.15V, it is ideal for applications requiring high-performance programmable ICs in a compact square package with ball terminals.
XC6SLX9-2FTG256C
XC6SLX9-2FTG256C by Xilinx is a CMOS-based FPGA with 9152 logic cells and 715 CLBs. It operates at a max clock frequency of 667 MHz and is commonly used in applications requiring programmable ICs for high-speed data processing.
XC6SLX25-2FGG484C
The Xilinx XC6SLX25-2FGG484C is a FPGA with 24051 logic cells, 1879 CLBs, and max clock frequency of 667 MHz. It operates at a nominal voltage of 1.2V and is suitable for applications requiring high-speed processing in electronics and telecommunications industries.
M2GL025-FGG484I
M2GL025-FGG484I by Microchip Technology is a CMOS FPGA with 27696 logic cells, 267 inputs/outputs, and operates at 1.2V. Ideal for industrial applications requiring high-performance computing in a compact 23x23mm grid array package with bottom terminals for surface mounting.
5CEBA2F17C8N
The 5CEBA2F17C8N by Altera is a field programmable gate array (FPGA) with a maximum supply voltage of 1.13V. It has a package shape of a square and a form of terminal as a ball. The FPGA has 256 terminals and operates at a nominal supply voltage of 1.1V. This device is suitable for various applications where programmable ICs are required.
EP4CE22E22C8N
EP4CE22E22C8N by Intel is a FPGA with 22320 logic cells, 1395 CLBs, and max clock frequency of 472.5 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems. With a package style including flatpack and low profile options, it offers versatility in design and integration.
LCMXO3LF-6900C-5BG324C
LCMXO3LF-6900C-5BG324C by Lattice Semiconductor is a 2.5V FPGA with 858 CLBs, operating b/w 0-85°C. It features a grid array package style, 0.8mm terminal pitch, and TIN SILVER COPPER finishing. Ideal for applications requiring low profile, fine pitch ICs in compact spaces.
XC7A50T-2FGG484C
The Xilinx XC7A50T-2FGG484C is a FPGA with 52160 logic cells, 4075 CLBs, and max clock frequency of 1286 MHz. It uses CMOS technology and is ideal for applications requiring high-speed processing in electronics and telecommunications industries.
M1A3P250-PQG208
Microsemi
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
XCVU47P-2FSVH2892E
FIELD PROGRAMMABLE GATE ARRAY; JESD-609 Code: e1; Finishing Of Terminal Used: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 4;
XCVU3P-2FFVC1517E
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;
XCVU9P-2FLGB2104I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;
XCVU9P-2FLGC2104I
XCVU3P-1FFVC1517E
Xilinx XCVU3P-1FFVC1517E is a plastic/epoxy FPGA with 862,050 logic cells and 49,260 CLBs. It has a max supply voltage of 0.876V and is suitable for applications requiring high-performance programmable ICs.
XCVU3P-2FFVC1517I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;
XCVU9P-L2FSGD2104E
FIELD PROGRAMMABLE GATE ARRAY; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
XCVU13P-L2FHGA2104E
XCVU11P-1FLGB2104I
XCVU19P-1FSVA3824E
FIELD PROGRAMMABLE GATE ARRAY; Moisture Sensitivity Level (MSL): 4; Finishing Of Terminal Used: TIN SILVER COPPER; JESD-609 Code: e1;
XCVU3P-L2FFVC1517E
XCVU9P-L2FLGA2577E
FIELD PROGRAMMABLE GATE ARRAY; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
XCVU33P-2FSVH2104E
FIELD PROGRAMMABLE GATE ARRAY; Maximum Time At Peak Reflow Temperature (s): 30; JESD-609 Code: e1; Finishing Of Terminal Used: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 4; Peak Reflow Temperature (C): 240;
XCVU9P-1FLGA2577E
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2577; Package Code: BGA; Package Shape: SQUARE;
XCVU9P-2FLGA2104E
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2104; Package Code: BGA; Package Shape: SQUARE;
XCVU37P-1FSVH2892E
FIELD PROGRAMMABLE GATE ARRAY; Peak Reflow Temperature (C): 240; Moisture Sensitivity Level (MSL): 4; Finishing Of Terminal Used: TIN SILVER COPPER; JESD-609 Code: e1; Maximum Time At Peak Reflow Temperature (s): 30;
XCVU37P-2FSVH2892E
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 2892; Package Code: BGA; Package Shape: SQUARE;
XCVU37P-3FSVH2892E
FIELD PROGRAMMABLE GATE ARRAY; Moisture Sensitivity Level (MSL): 4; Peak Reflow Temperature (C): 240; Finishing Of Terminal Used: TIN SILVER COPPER; JESD-609 Code: e1; Maximum Time At Peak Reflow Temperature (s): 30;
XCVU37P-L2FSVH2892E
FIELD PROGRAMMABLE GATE ARRAY; JESD-609 Code: e1; Moisture Sensitivity Level (MSL): 4;
XCVU13P-L2FHGC2104E
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