Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 3340; Package Code: HBGA; Package Shape: SQUARE; Maximum Operating Temperature: 110 Cel;
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Other Function uPs,uCs & Peripheral ICs XCVP1502-2LSEVSVA3340 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx
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XCVP1502-2LSEVSVA3340 Peripheral ICs trade compliance attributes, and parameters.
HTS
8542.31.00.01
SB
8542.31.00.00
Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD
2N7002-7-F
Diodes Incorporated
Diodes Inc. 2N7002-7-F is a N-channel FET with 60V DS breakdown voltage, 0.115A max drain current, and 13.5 ohm RDS(on). Ideal for switching applications in enhancement mode operation. Features Gull Wing terminals, small outline package style, and operates up to 150°C.
2N2222A
Forward International Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .625 W; Maximum Collector Current (IC): .6 A;
C0603X104K5RACAUTO
KEMET Corporation
C0603X104K5RACAUTO by KEMET Corp is a ceramic capacitor with capacitance of 0.1 uF and rated DC voltage of 50 V. It has a temperature coefficient of 15% and can operate b/w -55 to 125 °C. This SMT package is commonly used in automotive applications due to its AEC-Q200 reference standard.
MMBT3904-7-F
Diodes Inc. MMBT3904-7-F is a NPN BJT transistor for switching applications. Features include VCEsat of 0.3V, hFE of 30, and IC of 0.2A. With a max operating temp of 150°C, it's ideal for small outline SMT designs in automotive electronics.
CL31B104KBCNNNC
Samsung Electro-mechanics
Samsung Electro-mechanics CL31B104KBCNNNC is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It features X7R temperature characteristics, -55 to 125 °C operating range, and compact SMT package style. Ideal for applications requiring high reliability in compact electronic devices.
LM107H
Advanced Micro Devices
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Maximum Bias Current (IIB) @25C: .075 uA;
SMBJ18CA
Changzhou Starsea Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MBRS130LT3G
Onsemi
MBRS130LT3G by Onsemi is a Schottky rectifier diode with a max output current of 1A and forward voltage of 0.445V. It operates b/w -65 to 125°C, has a reverse test voltage of 30V, and is ideal for power applications due to its small outline package style.
1N4148
Silicon Standard
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Pulse Electronics
SS14
Hitano Enterprise
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148W-T
Rectron
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MBR0530T1G
MBR0530T1G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.375V and output current of 0.5A. It operates b/w -65°C to 125°C, making it suitable for applications requiring high-speed switching in compact electronic devices like smartphones and tablets. The package style is small outline with gull wing terminals for surface mount assembly.
LL4148
Micronas Semiconductor Holding Ag
RECTIFIER DIODE; Surface Mount: YES; No. of Phases: 1; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Output Current: .2 A; Maximum Forward Voltage (VF): 1.2 V;
MMBT2222ALT1G
MMBT2222ALT1G by Onsemi is a NPN BJT transistor with 3 terminals, max power dissipation of 0.3W, and hFE of 75. Ideal for switching applications, it operates b/w -55 to 150 °C with a max collector-emitter voltage of 40V. This surface-mount device has a transition frequency of 300MHz and turn-on time of 35ns.
STM32H753IIK6
STMicroelectronics
STM32H753IIK6 by STMicroelectronics is a 32-bit microcontroller with 176 terminals, operating at up to 48 MHz. It features 20-Ch 16-Bit ADCs, 2-Ch 12-Bit DACs, and peripherals like CAN, ETHERNET, and USB. Ideal for industrial applications requiring high-speed processing and extensive connectivity options.
Synsemi
ABS10-32.768KHZ-T
Abracon
Abracon's ABS10-32.768KHZ-T crystal oscillator offers 20 ppm frequency tolerance, 122% stability, and 70000 ohm series resistance. Ideal for applications requiring precise timing at 0.032768 MHz, such as IoT devices and wearables due to its compact size and low power consumption.
FDV304P
The Onsemi FDV304P is a P-CHANNEL FET with 25V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max Drain Current of 0.46A and an Operating Temperature range of -55 to 150 °C. The transistor comes in a PLASTIC/EPOXY package with GULL WING terminals, suitable for surface mount configurations.
2N7002
Philips Semiconductors
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Moisture Sensitivity Level (MSL): 1; Maximum Operating Temperature: 150 Cel;
CC1310F128RSMR
Texas Instruments
CC1310F128RSMR by Texas Instruments is a Cortex-M3 CPU with 28672 RAM bytes. Operating at -40 to 85 °C, it has a supply voltage range of 1.8-3.8 V and comes in a square chip carrier package style for industrial applications requiring microprocessor circuits.
CY8C4248LQI-BL543
Infineon Technologies
PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Finish: PURE TIN; Moisture Sensitivity Level (MSL): 3;
MCIMX6Q6AVT10AER
NXP Semiconductors
MCIMX6Q6AVT10AER by NXP Semiconductors is a 624-terminal SoC with CMOS technology. It operates b/w -40 to 125 °C, suitable for automotive applications. With a supply voltage range of 1.35V to 1.5V and peak reflow temp of 260C, it's ideal for various uP/uC functions in surface-mount designs.
ESP32-S3-WROOM-1-N16R2
Espressif Systems (Shanghai)
ESP32-S3-WROOM-1-N16R2 by Espressif Systems (Shanghai) is a 41-terminal SoC with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 3-3.6 V. Ideal for IoT applications due to its compact MICROELECTRONIC ASSEMBLY package and surface mount capability.
MIMXRT1061CVL5A
The NXP Semiconductors MIMXRT1061CVL5A is a SoC with CMOS technology, featuring 196 terminals in a low profile grid array package. It operates b/w -40 to 105°C, with a supply voltage range of 1.15V to 1.26V. Ideal for industrial applications requiring high performance and compact design.
STSPIN32F0601TR
MICROPROCESSOR CIRCUIT; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
CY8C6247BZI-D34
CY8C6247BZI-D34 by Infineon Technologies is a 124-terminal, programmable SoC with CMOS technology. It operates b/w -40 to 85 °C and has a supply voltage range of 1.7V to 3.6V. This IC is ideal for applications requiring a compact form factor and high performance in various electronic devices.
MCIMX6D7CVT08AD
Freescale Semiconductor
SoC; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE; Terminal Position: BOTTOM;
ATMXT224S-MAUR033
Microchip Technology
Microchip Technology's ATMXT224S-MAUR033 is a 56-terminal CMOS capacitive touch screen controller with a supply voltage range of 3-3.47V. Operating b/w -40 to 85°C, it features a square chip carrier package style suitable for surface mount applications. Ideal for various electronic devices requiring precise touch input control.
ATWINC1510-MR210UB1961
ATWINC1510-MR210UB1961 by Microchip operates at 2.7-3.6V, with a temp range of -40 to 85°C. It is a CMOS microprocessor circuit in a compact rectangular package style, suitable for industrial applications requiring reliable surface-mount peripherals with TS 16949 screening.
CY8C21434-24LFXIT
Cypress Semiconductor
CY8C21434-24LFXIT by Cypress is a 32-terminal IC with max supply voltage of 5.25V, operating temp up to 85°C. Ideal for industrial applications, it features a CMOS technology, programmable SoC type, and surface mount capability.
MCIMX6U5DVM10ACR
MCIMX6U5DVM10ACR by NXP Semiconductors is a SYSTEM ON CHIP with CMOS technology. It operates b/w 0-95 °C, with supply voltage range of 1.35-1.5 V. Ideal for applications requiring low profile and fine pitch package style in a square shape with 624 terminals.
NRF52810-QFAA-R7
Nordic Semiconductor Asa
NRF52810-QFAA-R7 by Nordic Semiconductor Asa is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 85 °C and supports supply voltage range of 1.7V to 3.6V. Ideal for industrial applications requiring low-profile, square-shaped chips with 48 terminals in a QUAD position.
MCIMX6S5DVM10AB
SoC; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE; Maximum Seated Height: 1.5 mm;
CSR8675C-IBBH-R
Qualcomm
Qualcomm's CSR8675C-IBBH-R is a CMOS microprocessor circuit in a plastic grid array package. It features surface mount capability with bottom terminal position for easy integration. Ideal for applications requiring high-performance processing in compact form factors.
XC7Z045-1FBG676I
Xilinx
The Xilinx XC7Z045-1FBG676I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. With 676 terminals in a grid array package, it's ideal for applications requiring high-performance processing in compact spaces.
CY8C4127LQI-BL453
Infineon's CY8C4127LQI-BL453 is an Industrial-grade Programmable SoC with Pure Tin finish. It can withstand peak reflow temp of 260°C for 30s. Ideal for applications requiring versatile peripheral ICs in harsh environments.
XCZU7EG-2FFVF1517I
XCZU7EG-2FFVF1517I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.825V to 0.876V. This GRID ARRAY package is ideal for industrial applications requiring high performance uPs/uCs.
MIMXRT117FCVM8A
The NXP Semiconductors MIMXRT117FCVM8A is a low-profile, fine-pitch SoC with CMOS technology. It operates b/w -40°C to 105°C and has a supply voltage range of 1.1V to 1.15V. With 289 terminals in a grid array package, it's ideal for applications requiring high-performance microcontrollers in compact designs.
ATWINC1500B-MU-Y
Microchip Technology's ATWINC1500B-MU-Y is a 40-terminal chip carrier with a clock frequency of 48 MHz. Ideal for industrial applications, it operates b/w -40 to 85 °C and supports network controller technology. With a supply voltage range of 2.7V to 3.6V, this CMOS device is surface mountable and has a terminal pitch of 0.4 mm.
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XCVP1702-3DSEVSVA3340
MICROPROCESSOR CIRCUIT;
XCVP1802-1HSELSVC4072
XCVP1202-2MSEVSVA2785
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2785; Package Code: HBGA; Package Shape: SQUARE; Package Equivalence Code: BGA2785,53X53,36;
XCVP1502-1GSIVSVA2785
XCVP1502-3HSEVSVA2785
XCVP1202-1MSEVSVA2785
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2785; Package Code: HBGA; Package Shape: SQUARE; Width: 50 mm;
XCVP1202-2MLEVSVA2785
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2785; Package Code: HBGA; Package Shape: SQUARE; Minimum Supply Voltage: .775 V;
XCVP1402-1MSEVSVA2785
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2785; Package Code: HBGA; Package Shape: SQUARE; Terminal Pitch: .92 mm;
XCVP1402-2DSEVSVA2785
XCVP1502-2MSEVSVA2785
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2785; Package Code: HBGA; Package Shape: SQUARE; Surface Mount: YES;
XCVP1702-1MSIVSVA3340
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 3340; Package Code: HBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
XCVP1802-2MLEVSVA5601
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 5601; Package Code: HBGA; Package Shape: SQUARE; Nominal Supply Voltage: .8 V;
XCVP1802-3DLILSVC4072
XCVP1002-1MSINFVI1369
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: BGA; Package Shape: RECTANGULAR; Nominal Supply Voltage: .8 V;
XCVP1002-1LSIVFVF1760
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE; Technology: CMOS;
XCVP1002-1MSIVFVF1760
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
XCVP1002-1MSIVSVC2021
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2021; Package Code: BGA; Package Shape: SQUARE; Nominal Supply Voltage: .8 V;
XCVP1002-1LSENFVI1369
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: BGA; Package Shape: RECTANGULAR; Maximum Operating Temperature: 100 Cel;
XCVP1002-1LSIVSVC2021
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 2021; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: .724 V;
XCVP1002-2HSINFVI1369
MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 1369; Package Code: BGA; Package Shape: RECTANGULAR; Maximum Supply Voltage: .906 V;
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