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XC7K325T-2FBG676C

Xilinx

XC7K325T-2FBG676C by Xilinx

Xilinx XC7K325T-2FBG676C FPGA features 326080 logic cells, 25475 CLBs, and operates at a max clock frequency of 1818 MHz. Ideal for applications requiring high-speed processing and programmable ICs in a compact grid array package style.

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Overview

Unleash the power of cutting-edge technology with the XC7K325T-2FBG676C by Xilinx. As a leading manufacturer in the field programmable gate arrays (FPGA) category, Xilinx delivers unparalleled quality and reliability. With over 326,000 logic cells and a maximum clock frequency of 1818 MHz, this FPGA offers endless possibilities for applications in a wide range of industries. Experience seamless integration, optimized performance, and enhanced efficiency with the XC7K325T-2FBG676C. Upgrade your projects today and unlock a world of innovation with Xilinx.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the FPGA lightweight and cost-effective, ideal for portable and budget-friendly applications.

No. of Logic Cells: 326080

With a high number of logic cells, this FPGA offers a large capacity for intricate designs and complex operations.

Surface Mount: YES

Being surface mountable allows for easy integration onto PCBs, saving space and simplifying the assembly process.

Maximum Supply Voltage: 1.03 V

The low maximum supply voltage reduces power consumption and heat generation, making this FPGA energy-efficient.

No. of CLBs: 25475

The large number of Configurable Logic Blocks (CLBs) provides flexibility in design implementation, accommodating various functionalities.

Technology Used: CMOS

Built with CMOS technology, this FPGA offers high-speed performance and low power consumption, suitable for a wide range of applications.

No. of Inputs: 400

With 400 inputs, this FPGA can handle a substantial amount of data input, making it suitable for data-intensive tasks.

Package Shape: SQUARE

The square package shape enables efficient use of space on a PCB, optimizing the layout and design of the overall system.

Form Of Terminal: BALL

The ball terminal form simplifies the soldering process and enhances the reliability of connections, ensuring a secure and durable installation.

Power Supplies (V): 1,1.8,3.3

Supporting multiple power supply voltages allows for compatibility with a variety of systems and peripherals, enhancing versatility.

No. of Terminals: 676

The large number of terminals provides ample connectivity options, facilitating integration with other components and devices.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

As a Field Programmable Gate Array, this IC offers the flexibility of reprogramming and reconfiguring functionality, allowing for customizable designs and rapid prototyping.

Package Style (Meter): GRID ARRAY

The grid array package style provides robust mechanical support and thermal dissipation, ensuring durability and reliability in various operating conditions.

Minimum Supply Voltage: 0.97 V

The low minimum supply voltage enables operation in low-power environments and enhances energy efficiency, making this FPGA suitable for battery-powered applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this FPGA can withstand demanding thermal conditions, ensuring reliability in harsh environments.

Pitch Of Terminal: 1 mm

The tight terminal pitch allows for a high-density layout, optimizing space usage on the PCB and facilitating compact designs.

Maximum Combinatorial Delay of a CLB: 0.61 ns

The low combinatorial delay of a Configurable Logic Block ensures fast processing and minimal latency, ideal for time-critical applications.

Organization: 25475 CLBS

The organized structure of 25475 Configurable Logic Blocks facilitates efficient design implementation and modularity, simplifying system development and maintenance.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures allows for versatility in deployment, making this FPGA suitable for use in a wide range of environments.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of tin, silver, and copper finishing on the terminals enhances conductivity and corrosion resistance, ensuring reliable and stable connections.

Position Of Terminal: BOTTOM

The bottom position of terminals enhances PCB layout flexibility and simplifies routing, making it easier to integrate the FPGA into the overall system design.

Moisture Sensitivity Level (MSL): 4

With MSL 4, this FPGA can withstand moderate moisture exposure during storage and handling, ensuring operational reliability and longevity.

Maximum Seated Height: 2.54 mm

The low seated height allows for a compact and slim profile, enabling the FPGA to be used in space-constrained applications.

Width: 27 mm

The moderate width makes this FPGA suitable for a range of PCB sizes and layouts, providing flexibility in design and integration.

Maximum Clock Frequency: 1818 MHz

With a high maximum clock frequency, this FPGA can process data at high speeds, enabling rapid computation and real-time performance.

No. of Outputs: 400

Offering 400 outputs, this FPGA can drive multiple external devices and interfaces, making it suitable for applications requiring extensive output capabilities.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature facilitates quick and efficient soldering, reducing assembly time and improving manufacturing throughput.

Peak Reflow Temperature °C: 250

With a high peak reflow temperature, this FPGA can withstand the rigors of the soldering process, ensuring robustness and reliability in manufacturing.

Length: 27 mm

The moderate length of this FPGA accommodates various PCB form factors and layouts, providing versatility in system design and integration.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC7K325T-2FBG676C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

326080

No. of Inputs:

400

No. of Outputs:

400

No. of CLBs:

25475

Maximum Clock Frequency:

1818 MHz

CLB Maximum Delay:

0.61 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

25475 CLBS

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.97 V

Maximum Supply Voltage:

1.03 V

Power Supplies:

1,1.8,3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

27 mm

Width:

27 mm

Maximum Seated Height:

2.54 mm

Package Equivalence Code:

BGA676,26X26,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

676

Standards

JESD-30 Code:

S-PBGA-B676

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC7K325T-2FBG676C Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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