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XC7A75T-1FGG484I

Xilinx

XC7A75T-1FGG484I by Xilinx

Xilinx XC7A75T-1FGG484I FPGA features 75520 logic cells, 5900 CLBs, and a max clock frequency of 1098 MHz. Ideal for applications requiring high-speed processing and programmable ICs in a compact grid array package with a low supply voltage range from 0.95V to 1.05V.

Median Price

$173.550

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Farnell

UK . 130 parts In-Stock

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Mouser Electronics

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DigiKey

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Element14

Singapore . 130 parts In-Stock

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Digiode

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VNN

France . 137 parts In-Stock

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Nova Conductors

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Vyrian

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AZTECH Wire

Italy . 460 parts In-Stock

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$14.538

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Corohmni

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Modulus Dynamics

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Texas Native Microelectronics

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Ampacity Inc.

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Corphita

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Kenton Components

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Vigor

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Continental Prestige Electronics

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Netroflash

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Aztec Data Supply Inc.

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Argo Parts USA

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Supply Digital

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MARBEL Systems

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RC Electronics

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Perfect Parts

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Qasali Group International

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Overview

Unleash the power of innovation with the XC7A75T-1FGG484I from Xilinx. As a leading manufacturer in the field programmable gate arrays (FPGA) category, Xilinx delivers high-quality products that offer unmatched performance and versatility. Whether you're looking to enhance your data processing capabilities or streamline your system design, this FPGA is the ultimate solution. With its advanced technology, reliability, and flexibility, the XC7A75T-1FGG484I provides customers with endless possibilities for customization and optimization. Elevate your projects to new heights with Xilinx's cutting-edge FPGA technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this FPGA lightweight and durable, ideal for portable and rugged applications.

No. of Logic Cells: 75520

With a large number of logic cells, this FPGA offers high flexibility and processing power for complex digital designs.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

Maximum Supply Voltage: 1.05 V

The low maximum supply voltage helps in reducing power consumption, making this FPGA energy efficient.

No. of CLBs: 5900

The high number of Configurable Logic Blocks (CLBs) provides ample resources for implementing digital logic functions.

Technology Used: CMOS

The CMOS technology ensures low power consumption, high noise immunity, and fast switching speeds, enhancing the overall performance.

No. of Inputs: 285

With a large number of inputs, this FPGA can interface with multiple external devices or sensors, expanding its versatility.

Package Shape: SQUARE

The square package shape makes it easier to place and route on a PCB, optimizing board space utilization.

Form Of Terminal: BALL

The use of ball terminals simplifies the soldering process and ensures a reliable electrical connection.

No. of Terminals: 484

The high number of terminals provides ample connectivity options for interfacing with external components or peripherals.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

As an FPGA, this chip offers reconfigurable logic, allowing for rapid prototyping and customization of digital circuits.

Package Style (Meter): GRID ARRAY

The grid array package style facilitates high-density mounting, enabling compact designs in space-constrained applications.

Minimum Supply Voltage: 0.95 V

The low minimum supply voltage allows for operation in low-power environments, making this FPGA suitable for battery-operated devices.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this FPGA can withstand elevated heat conditions, ensuring reliability in demanding environments.

Pitch Of Terminal: 1 mm

The tight pitch of the terminals enables high-density integration, making this FPGA ideal for applications requiring a small form factor.

Maximum Combinatorial Delay of a CLB: 1.27 ns

The low combinatorial delay ensures fast signal propagation within the CLBs, contributing to high-speed performance.

Organization: 5900 CLBS

The organized structure of 5900 Configurable Logic Blocks offers a systematic and efficient layout for implementing complex digital designs.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, this FPGA can function reliably in cold environments without compromising performance.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of tin, silver, and copper finishing on the terminals enhances solderability and electrical conductivity, ensuring robust connections.

Position Of Terminal: BOTTOM

The bottom position of the terminals simplifies PCB layout and routing, providing ease of integration into the overall system design.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates that this FPGA has a moderate resistance to moisture ingress, suitable for various operating environments.

Maximum Seated Height: 2.6 mm

The low maximum seated height enables a slim profile for the overall system, ideal for applications with space constraints.

Width: 23 mm

The compact width of 23 mm allows for efficient use of board space, making this FPGA suitable for small form factor designs.

Maximum Clock Frequency: 1098 MHz

With a high maximum clock frequency, this FPGA can process data at high speeds, ideal for real-time applications requiring rapid signal processing.

No. of Outputs: 285

The numerous outputs offer flexibility for driving multiple external devices, enabling diverse functional capabilities in the design.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time allowed at peak reflow temperature of 30 seconds ensures safe and reliable soldering during PCB assembly.

Peak Reflow Temperature °C: 250

The high peak reflow temperature of 250°C enables the FPGA to withstand the soldering process, ensuring robust mechanical connections.

Length: 23 mm

The compact length of 23 mm contributes to a smaller footprint on the PCB, optimizing space utilization and allowing for compact system designs.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC7A75T-1FGG484I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

75520

No. of Inputs:

285

No. of Outputs:

285

No. of CLBs:

5900

Maximum Clock Frequency:

1098 MHz

CLB Maximum Delay:

1.27 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

5900 CLBS

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.95 V

Maximum Supply Voltage:

1.05 V

Power Supplies:

1 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

23 mm

Width:

23 mm

Maximum Seated Height:

2.6 mm

Package Equivalence Code:

BGA484,22X22,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC7A75T-1FGG484I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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