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XC7A50T-1CSG324C

Xilinx

XC7A50T-1CSG324C by Xilinx

Xilinx XC7A50T-1CSG324C is a FPGA with 52160 logic cells, 4075 CLBs, and 250 inputs/outputs. Operating at up to 1098 MHz, it's ideal for high-speed applications like signal processing and networking due to its low profile grid array package and fine pitch terminals.

Median Price

$86.160

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Farnell

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Newark

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Mouser Electronics

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DigiKey

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Element14

Singapore . 126 parts In-Stock

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Digiode

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Nova Conductors

Japan . 50 parts In-Stock

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AZTECH Wire

Italy . 754 parts In-Stock

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Corohmni

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MARBEL Systems

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Texas Native Microelectronics

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Modulus Dynamics

Lithuania . 1,696 parts In-Stock

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Kenton Components

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Ampacity Inc.

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Corphita

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Vigor

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Continental Prestige Electronics

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Microchip USA

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Netroflash

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Advanced Electronics

New Zealand . 900 parts In-Stock

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Qasali Group International

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Semicontronic

India . 97 parts In-Stock

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Aztec Data Supply Inc.

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Overview

Unleash the power of innovation with the XC7A50T-1CSG324C by Xilinx, a leading manufacturer in Field Programmable Gate Arrays (FPGA). With 52160 logic cells and 4075 CLBs, this cutting-edge technology offers unparalleled flexibility and performance for a wide range of applications. From aerospace to telecommunications, this FPGA delivers high-quality results with a maximum clock frequency of 1098 MHz and a low profile design. Embrace the future of technology with the XC7A50T-1CSG324C and elevate your projects to new heights of success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring reliability and longevity of the product.

No. of Logic Cells: 52160

Large number of logic cells allow for complex programmable logic designs to be implemented effectively.

Surface Mount: YES

Easy integration into circuit boards, saving space and simplifying assembly processes.

Maximum Supply Voltage: 1.05 V

Low power consumption and reduced heat generation for energy-efficient operation.

No. of CLBs: 4075

Abundance of Configurable Logic Blocks provides flexibility in design and implementation of functions.

No. of Inputs: 250

Sufficient input ports for receiving external signals and data, enhancing connectivity and versatility.

Package Shape: SQUARE

Uniform shape makes handling and installation easier, ensuring compatibility with standardized mounting methods.

Form Of Terminal: BALL

Ball terminals offer secure connections and facilitate efficient electrical contact within the system.

No. of Terminals: 324

Adequate number of terminals for interfacing with other components and circuitry, enabling seamless integration.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

FPGA technology allows for flexibility in reprogramming the device for different tasks, making it versatile for various applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Compact and efficient package style enhances space utilization and facilitates high-density circuit designs.

Minimum Supply Voltage: 0.95 V

Low minimum supply voltage requirement allows for operation in power-constrained environments.

Maximum Operating Temperature: 85 °C

Wide operating temperature range ensures performance in varying environmental conditions.

Pitch Of Terminal: 0.8 mm

Fine pitch terminals enable high-density connections and efficient signal routing within the system.

Maximum Combinatorial Delay of a CLB: 1.27 ns

Low combinational delay ensures fast signal propagation and processing, enhancing performance.

Organization: 4075 CLBS

Organized structure of Configurable Logic Blocks simplifies design and implementation of complex logic functions.

Minimum Operating Temperature: 0 °C

Operational at low temperatures, suitable for applications in cold environments or industrial settings.

Finishing Of Terminal Used: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Durable terminal finish ensures reliable connections and minimizes corrosion, extending product lifespan.

Position Of Terminal: BOTTOM

Bottom placement of terminals simplifies installation and facilitates efficient heat dissipation for improved thermal management.

Moisture Sensitivity Level (MSL): 3

Moderate moisture sensitivity level allows for safe handling and storage in typical manufacturing environments.

Maximum Seated Height: 1.5 mm

Low profile design minimizes space requirements and enables compact system designs.

Width: 15 mm

Optimal width dimension for compatibility with standard circuit board sizes and mounting configurations.

Maximum Clock Frequency: 1098 MHz

High clock frequency capability enables fast data processing and efficient operation of the device.

No. of Outputs: 250

Sufficient output ports for transmitting processed data and signals, enhancing usability and functionality.

Maximum Time At Peak Reflow Temperature (s): 30

Adequate time allowance at peak reflow temperature for efficient soldering and secure mounting during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures reliable solder joints and robust connections for long-term performance.

Length: 15 mm

Optimal length dimension for compatibility with standard circuit board sizes and mounting configurations.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC7A50T-1CSG324C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

52160

No. of Inputs:

250

No. of Outputs:

250

No. of CLBs:

4075

Maximum Clock Frequency:

1098 MHz

CLB Maximum Delay:

1.27 ns

Sub-Category:

Field Programmable Gate Arrays

Organization:

4075 CLBS

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.95 V

Maximum Supply Voltage:

1.05 V

Power Supplies:

1 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

15 mm

Width:

15 mm

Maximum Seated Height:

1.5 mm

Package Equivalence Code:

BGA324,18X18,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Pitch:

.8 mm

No. of Terminals:

324

Standards

JESD-30 Code:

S-PBGA-B324

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC7A50T-1CSG324C Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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