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XC6SLX75-2FG676I

Xilinx

XC6SLX75-2FG676I by Xilinx

Xilinx XC6SLX75-2FG676I FPGA offers 74637 logic cells, 5831 CLBs, and 400 inputs/outputs. Ideal for industrial applications with a max clock frequency of 667 MHz and operating temperature range from -40 to 100°C. Package style is grid array with a square shape and ball terminals.

Median Price

$284.630

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Overview

Looking for a versatile and high-quality Field Programmable Gate Array (FPGA) solution? Look no further than the XC6SLX75-2FG676I by Xilinx. With 74637 logic cells and 5831 CLBs, this FPGA is perfect for a wide range of applications in industrial settings. Xilinx, known for their cutting-edge technology and reliability, delivers a product that offers customers exceptional value and performance. Whether you're designing telecommunications equipment or industrial automation systems, the XC6SLX75-2FG676I provides the flexibility and power you need to bring your projects to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FPGA.

No. of Logic Cells: 74637

Allows for complex logic operations to be implemented efficiently.

Maximum Supply Voltage: 1.26 V

Ensures stable and reliable operation within specified voltage limits.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity.

Nominal Supply Voltage (V): 1.2

Optimal voltage level for consistent performance.

Maximum Operating Temperature: 100 °C

Can withstand high temperature environments without compromising functionality.

Maximum Clock Frequency: 667 MHz

High clock frequency allows for fast processing and response times.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC6SLX75-2FG676I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

74637

No. of Inputs:

400

No. of Outputs:

400

No. of CLBs:

5831

Maximum Clock Frequency:

667 MHz

CLB Maximum Delay:

0.26 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

5831 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2,2.5/3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

225 °C (437 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

27 mm

Width:

27 mm

Maximum Seated Height:

2.44 mm

Package Equivalence Code:

BGA676,26X26,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Lead

Terminal Pitch:

1 mm

No. of Terminals:

676

Standards

JESD-30 Code:

S-PBGA-B676

JESD-609 Code:

e0

Qualified:

No

Trade Compliance

XC6SLX75-2FG676I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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