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XC6SLX45T-N3CSG324I

Xilinx

XC6SLX45T-N3CSG324I by Xilinx

Xilinx XC6SLX45T-N3CSG324I FPGA features 43661 logic cells, 3411 CLBs, and max clock frequency of 806 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package with low profile design.

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Overview

Unlock the power of cutting-edge technology with the XC6SLX45T-N3CSG324I by Xilinx, a leading manufacturer in the field of Field Programmable Gate Arrays (FPGA). This versatile and high-quality product offers a wide range of applications, from industrial automation to telecommunications, providing customers with unmatched flexibility and performance. Experience seamless integration, reliable operation, and innovative solutions tailored to your specific needs. Elevate your projects to new heights with the XC6SLX45T-N3CSG324I, where quality meets value for exceptional results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for the package, ensuring the product can withstand various environmental conditions.

Maximum Operating Temperature: 100 °C

A high maximum operating temperature allows the FPGA to function effectively in demanding industrial environments without overheating.

Maximum Clock Frequency: 806 MHz

High clock frequency enables fast processing and high-speed data transfer, making this FPGA suitable for applications requiring quick computational tasks.

No. of Logic Cells: 43661

Large number of logic cells provide ample resources for complex logic designs and implementations, making this FPGA versatile for a wide range of applications.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, making this FPGA energy-efficient and reliable for long-term operation.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC6SLX45T-N3CSG324I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

43661

No. of Inputs:

190

No. of Outputs:

190

No. of CLBs:

3411

Maximum Clock Frequency:

806 MHz

CLB Maximum Delay:

0.26 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

3411 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2,1.2/3.3,2.5/3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

15 mm

Width:

15 mm

Maximum Seated Height:

1.5 mm

Package Equivalence Code:

BGA324,18X18,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

.8 mm

No. of Terminals:

324

Standards

JESD-30 Code:

S-PBGA-B324

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC6SLX45T-N3CSG324I Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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