Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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XC6SLX100-3FGG676C by Xilinx is a CMOS-based FPGA with 101261 logic cells and 7911 CLBs. It operates at a max clock frequency of 862 MHz and is commonly used in applications requiring high-speed processing and programmable logic capabilities.
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Kepictronics
This product's use of plastic/epoxy as the package body material offers durability and lightweight construction, making it a cost-effective and practical choice.
With an impressive number of logic cells, this FPGA can handle complex tasks and provide high-performance computing capabilities.
The surface mount feature allows for easy installation and integration into various electronic systems, making it convenient for applications with limited space.
This FPGA operates efficiently with a maximum supply voltage of 1.26 V, minimizing power consumption and enhancing energy efficiency.
The large number of Configurable Logic Blocks (CLBs) enables flexible configurations and supports sophisticated digital designs for a wide range of applications.
Utilizing Complementary Metal-Oxide-Semiconductor (CMOS) technology ensures low power consumption, high speed, and excellent noise immunity, making this FPGA suitable for demanding applications.
With a generous number of input pins, this FPGA allows for extensive connectivity and the ability to handle diverse input signals.
The square package shape provides efficient use of board space, allowing for easier integration and improved overall system design.
The ball terminal form offers secure connections and improved electrical performance, ensuring reliable signal transmission.
This FPGA operates at a nominal supply voltage of 1.2 V, enhancing energy efficiency and reducing power consumption.
Supporting multiple power supply options (1.2V, 2.5V, and 3.3V) provides flexibility in power management and compatibility with different systems.
With a significant number of terminals, this FPGA allows for extensive external connectivity, facilitating seamless integration with other components.
The programmable nature of this IC type enables customization and adaptability, making it ideal for prototyping, testing, and various applications with changing requirements.
The grid array package style offers reliable solder connections, improved thermal performance, and efficient layout for high-density circuits, ensuring the longevity and performance of this FPGA.
The low minimum supply voltage of 1.14 V ensures stable operation even under lower power conditions, making it energy-efficient and versatile.
The high maximum operating temperature allows for reliable performance even in demanding environments with elevated temperatures.
The small terminal pitch of 1 mm provides space efficiency and allows for high pin density, making it suitable for compact designs.
The minimal combinatorial delay of 0.21 ns in each Configurable Logic Block (CLB) ensures high-speed signal processing and efficient execution of complex logic functions.
The organized structure with 7911 CLBs offers flexibility and scalability, enabling intricate digital designs with increased complexity and functionality.
The low minimum operating temperature of 0 °C ensures reliable performance even in harsh environments with low temperatures.
The terminal finishing with a combination of tin, silver, and copper provides excellent electrical conductivity, corrosion resistance, and solderability, ensuring reliable connections and robust performance.
The position of the terminals at the bottom of the package allows for space-saving mounting options and efficient heat dissipation, promoting overall system stability and thermal management.
The moisture sensitivity level of 3 ensures proper storage and handling, minimizing the risk of moisture-related failures and extending the lifespan of this FPGA.
The low maximum seated height of 2.44 mm allows for compact and low-profile designs, facilitating integration in space-constrained applications.
The moderate width dimension of 27 mm offers compatibility with standard board layouts and facilitates seamless integration into existing systems.
With a high maximum clock frequency of 862 MHz, this FPGA can handle rapid data processing and achieve real-time performance in demanding applications.
The generous number of output pins allows for extensive signal routing and facilitates flexible connectivity, enhancing versatility in system design.
With a maximum time of 30 seconds at peak reflow temperature, this FPGA can withstand soldering processes, ensuring reliable assembly and manufacturability.
The high peak reflow temperature of 250°C enables efficient soldering processes, ensuring secure connections and robust reliability.
The moderate length dimension of 27 mm allows for easy integration and compatibility with standard board layouts, facilitating seamless system design and assembly.
Field Programmable Gate Arrays (FPGA) XC6SLX100-3FGG676C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx
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XC6SLX100-3FGG676C Programmable ICs trade compliance attributes, and parameters.
ECCN
3A991.D
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD
LM107H/883
Linear Technology
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Technology: BIPOLAR;
1N4148WS
Dc Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Surface Mount: NO; Config: SINGLE; Peak Reflow Temperature (C): 260; No. of Phases: 1; Diode Element Material: SILICON;
SMBJ18CA
Secos
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
EU2B-YS3203C
Idec
ROTARY SWITCH;
LM358AN
Signetics
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
2N7002,215
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Time At Peak Reflow Temperature (s): 30; Transistor Application: SWITCHING; Package Body Material: PLASTIC/EPOXY;
1N4148WSF-7
Diodes Incorporated
1N4148WSF-7 by Diodes Inc. is a single silicon rectifier diode with max output current of 0.25A and max reverse voltage of 100V. It operates b/w -55 to 150°C, has a small outline package style, and is suitable for surface mount applications in various electronic circuits.
DS18B20U+
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: SQUARE; Housing: PLASTIC; Minimum Supply Voltage: 3 V;
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
ULN2003ADR
Texas Instruments
ULN2003ADR by Texas Instruments is a NPN BJT with 7 elements, max IC of 0.5A, and VCEsat of 1.6V. Ideal for switching applications in small outline packages with Gull Wing terminals.
NC7WZ17P6X
Onsemi
The Onsemi NC7WZ17P6X is a logic gate with 2 functions, featuring a propagation delay of 13.1 ns at 1.8V supply voltage. Ideal for industrial applications, it operates b/w -40 to 85°C and has a max power supply current of 100mA. With Schmitt Trigger technology and small outline packaging, it suits compact electronic designs requiring fast signal processing.
M24308/2-1F
Bel Fuse
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Dielectric Withstanding Voltage (V): 1750VAC; No. of Connectors: ONE; Mixed Contacts: NO;
CRCW080510K0FKEA
Vishay Intertechnology
Vishay Intertechnology's CRCW080510K0FKEA is a fixed resistor with 10000 ohm resistance, 1% tolerance, and 0.125 W power dissipation. Ideal for surface mount applications in automotive electronics due to AEC-Q200 reference standard compliance and -55 to 155 °C operating temperature range.
2N2222A
Continental Device India
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BAV99
Electronic Devices
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Kec
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
261
Mercury Systems
Other Interface ICs; Temperature Grade: MILITARY; Terminal Form: FLAT; No. of Terminals: 14; Package Code: DFP; Package Shape: SQUARE;
Weitronic Enterprise
SS14
Forward International Electronics
RECTIFIER DIODE; Surface Mount: YES; Maximum Operating Temperature: 150 Cel; No. of Elements: 1; No. of Phases: 1; Maximum Output Current: 1 A;
ICE5LP4K-SG48ITR
Lattice Semiconductor
FIELD PROGRAMMABLE GATE ARRAY; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;
A3P1000-FG144I
Microchip Technology
A3P1000-FG144I by Microchip is a CMOS FPGA with 24576 CLBs and 1000000 gates. It operates at a max frequency of 350 MHz, suitable for industrial applications requiring high-speed processing. With a low profile grid array package, it offers flexibility for various design requirements.
XC6SLX45-2CSG324I
Xilinx
The Xilinx XC6SLX45-2CSG324I is a FPGA with 43661 logic cells, 3411 CLBs, and max clock frequency of 667 MHz. It operates at temperatures ranging from -40 to 100 °C and is suitable for industrial applications requiring high-speed processing in compact form factors.
A3P1000-FGG256I
Microsemi
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
XC7A35T-L1CSG324I
The Xilinx XC7A35T-L1CSG324I is a FPGA with 33280 logic cells, 2600 CLBs, and max clock frequency of 1098 MHz. It is used in industrial applications for high-speed processing tasks due to its low profile package style and fine pitch grid array design.
EP4CE10E22C7N
Intel
EP4CE10E22C7N by Intel is a FPGA with 10320 logic cells, 645 CLBs, and max clock frequency of 472.5 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems. With a package style including flatpack and low profile options, it offers versatility in design integration.
XC6SLX25-2FTG256I
Xilinx XC6SLX25-2FTG256I FPGA features 24051 logic cells, 1879 CLBs, and max clock frequency of 667MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor with low power consumption. Package style: Grid Array, Low Profile.
ICE5LP1K-SG48ITR
FIELD PROGRAMMABLE GATE ARRAY; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30;
M1A3P1000-FG256I
M1A3P1000-FG256I by Microchip Technology is a FPGA with 24576 CLBs and 1000000 gates, operating at max frequency of 350 MHz. It has a supply voltage range of 1.425V to 1.575V, suitable for industrial applications requiring high gate count and clock speed in a compact grid array package.
10M08DCF256C8G
Altera
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
EP4CE115F23I7N
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 260;
XC7A50T-L1CPG236I
Xilinx XC7A50T-L1CPG236I is a FPGA with 52160 logic cells, 4075 CLBs, and max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact package. With a wide operating temperature range (-40 to 100°C) and fine pitch grid array style, it suits various electronic designs.
LFE5U-25F-7BG256I
FIELD PROGRAMMABLE GATE ARRAY; Maximum Time At Peak Reflow Temperature (s): 30; Finishing Of Terminal Used: TIN SILVER COPPER; JESD-609 Code: e1; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
EP2C20F484I8N
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; JESD-609 Code: e1;
10CX150YF672E6G
Intel's 10CX150YF672E6G FPGA boasts 150,000 logic cells and 54,770 CLBs. Operating b/w 0-100°C with a supply voltage range of 0.87-0.93V, it offers 236 inputs/outputs for various applications requiring high-performance programmable ICs in a square grid array package.
M1AGL250V5-FGG144I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: LBGA; Package Shape: SQUARE;
MPF100T-FCVG484I
MPF100T-FCVG484I by Microchip is a CMOS FPGA with 284 inputs/outputs, operating temp range of -40 to 100°C. It features a grid array package with 0.8mm terminal pitch, suitable for industrial applications requiring high-density programmable logic solutions.
XC7S6-1CPGA196I
Xilinx XC7S6-1CPGA196I FPGA features 6000 logic cells, 469 CLBs, and a max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor with a grid array package style.
LCMXO2-256HC-4TG100I
LCMXO2-256HC-4TG100I by Lattice Semiconductor is a 256 Logic Cell FPGA with 55 inputs/outputs, operating at 2.5V nominal voltage. It comes in a square package with Gull Wing terminals, suitable for applications requiring high-speed processing and programmable logic capabilities.
XC7A200T-2SBG484C
Xilinx XC7A200T-2SBG484C FPGA offers 215360 logic cells, 16825 CLBs, and a max clock frequency of 1286 MHz. Ideal for high-performance applications requiring advanced programmable IC technology in a compact grid array package with fine pitch terminals.
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XC6SLX9-2TQG144I
The Xilinx XC6SLX9-2TQG144I is a FPGA with 9152 logic cells, 715 CLBs, and max clock frequency of 667 MHz. It operates at temperatures ranging from -40 to 100°C and is ideal for industrial applications requiring high-speed processing and programmable ICs.
XC6SLX9-2TQG144C
The Xilinx XC6SLX9-2TQG144C is a FPGA with 9152 logic cells, 715 CLBs, and 102 inputs/outputs. It operates at max frequency of 667 MHz and supports supply voltages of 1.2V. Ideal for applications requiring high-speed processing in compact designs like telecommunications equipment or industrial automation systems.
XC6SLX9-3TQG144I
The Xilinx XC6SLX9-3TQG144I is a FPGA with 9152 logic cells, 715 CLBs, and 102 inputs/outputs. It operates at max frequency of 862 MHz and supports supply voltages of 1.2V, 2.5/3.3V. Ideal for industrial applications requiring high-speed processing in compact form factors with low power consumption.
XC6SLX9-2FTG256C
XC6SLX9-2FTG256C by Xilinx is a CMOS-based FPGA with 9152 logic cells and 715 CLBs. It operates at a max clock frequency of 667 MHz and is commonly used in applications requiring programmable ICs for high-speed data processing.
XC6SLX4-2TQG144C
Xilinx XC6SLX4-2TQG144C is a FPGA with 3840 logic cells, 300 CLBs, and max clock frequency of 667 MHz. It operates at 1.2V nominal voltage and is used in applications requiring high-speed processing like telecommunications and industrial automation.
XC6SLX45T-2CSG324I
Xilinx XC6SLX45T-2CSG324I is a FPGA with 43661 logic cells, 3411 CLBs, and max clock frequency of 667 MHz. It operates at -40 to 100°C, suitable for industrial applications requiring high-speed processing and programmable ICs in compact form factors.
XC6SLX9-3TQG144C
The Xilinx XC6SLX9-3TQG144C is a FPGA with 9152 logic cells, 715 CLBs, and max clock frequency of 862 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.
XC6SLX9-2CSG225C
Xilinx XC6SLX9-2CSG225C is a FPGA with 9152 logic cells, 715 CLBs, and max clock frequency of 667 MHz. Ideal for applications requiring high-speed processing like telecommunications equipment and industrial automation systems.
XC6SLX45-2FGG484C
Xilinx XC6SLX45-2FGG484C FPGA features 43661 logic cells, 3411 CLBs, and a max clock frequency of 667 MHz. Ideal for applications requiring high-speed processing such as telecommunications equipment and industrial automation systems.
XC6SLX9-2FTG256I
Xilinx XC6SLX9-2FTG256I FPGA features 9152 logic cells, 715 CLBs, and a max clock frequency of 667 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package with low profile design.
XC6SLX16-2FTG256I
The Xilinx XC6SLX16-2FTG256I is a FPGA with 14579 logic cells, 1139 CLBs, and 186 inputs/outputs. It operates at max frequency of 667 MHz, suitable for industrial applications requiring high-speed processing. With a package style of grid array and low profile, it offers flexibility in design while maintaining a compact form factor.
XC6SLX45-2CSG324C
The Xilinx XC6SLX45-2CSG324C is a FPGA with 43661 logic cells, 3411 CLBs, and 218 inputs/outputs. Operating at up to 667 MHz, it's ideal for applications requiring high-speed processing like telecommunications equipment and industrial automation systems. With a low profile grid array package style, it offers flexibility in design while maintaining reliability.
XC6SLX25-2FTG256C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;
XC6SLX75-3CSG484I
The Xilinx XC6SLX75-3CSG484I is a FPGA with 74637 logic cells, 5831 CLBs, and 328 inputs/outputs. It operates at max frequency of 862 MHz and supports supply voltages of 1.2V, 2.5/3.3V. Ideal for industrial applications requiring high-speed processing in compact form factors due to its advanced CMOS technology and fine pitch grid array package style.
XC6SLX4-2TQG144I
The Xilinx XC6SLX4-2TQG144I is a FPGA with 3840 logic cells, 300 CLBs, and max clock frequency of 667 MHz. It operates at temperatures ranging from -40 to 100 °C and is ideal for industrial applications requiring high-speed processing in compact designs.
XC6SLX16-2FTG256C
XC6SLX16-2CSG324I
Xilinx XC6SLX16-2CSG324I FPGA features 14579 logic cells, 1139 CLBs, and 232 inputs/outputs. Operating at a max frequency of 667 MHz, it is ideal for industrial applications requiring high-speed processing in a compact form factor. With a wide supply voltage range and low combinatorial delay, this FPGA offers versatile programmability for various electronic systems.
XC6SLX25T-2CSG324C
XC6SLX25T-2CSG324C by Xilinx is a FPGA with 24051 logic cells, 1879 CLBs, and 190 inputs/outputs. Operating at 667 MHz max clock frequency, it's ideal for applications requiring high-speed processing like telecommunications equipment and industrial automation systems.
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