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XC6SLX100-3FGG676C

Xilinx

XC6SLX100-3FGG676C by Xilinx

XC6SLX100-3FGG676C by Xilinx is a CMOS-based FPGA with 101261 logic cells and 7911 CLBs. It operates at a max clock frequency of 862 MHz and is commonly used in applications requiring high-speed processing and programmable logic capabilities.

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Overview

Discover the power of the XC6SLX100-3FGG676C by Xilinx, a leader in FPGA technology. With over 101,000 logic cells and 7,911 CLBs, this field programmable gate array offers unmatched performance and versatility. Whether you're designing advanced telecommunications systems or high-speed data processing applications, the XC6SLX100-3FGG676C delivers exceptional results. With a maximum clock frequency of 862 MHz and a wide range of power supplies, this FPGA is built to handle even the most demanding tasks. Trust Xilinx for quality and reliability, and unlock endless possibilities with the XC6SLX100-3FGG676C.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product's use of plastic/epoxy as the package body material offers durability and lightweight construction, making it a cost-effective and practical choice.

No. of Logic Cells: 101261

With an impressive number of logic cells, this FPGA can handle complex tasks and provide high-performance computing capabilities.

Surface Mount: YES

The surface mount feature allows for easy installation and integration into various electronic systems, making it convenient for applications with limited space.

Maximum Supply Voltage: 1.26 V

This FPGA operates efficiently with a maximum supply voltage of 1.26 V, minimizing power consumption and enhancing energy efficiency.

No. of CLBs: 7911

The large number of Configurable Logic Blocks (CLBs) enables flexible configurations and supports sophisticated digital designs for a wide range of applications.

Technology Used: CMOS

Utilizing Complementary Metal-Oxide-Semiconductor (CMOS) technology ensures low power consumption, high speed, and excellent noise immunity, making this FPGA suitable for demanding applications.

No. of Inputs: 480

With a generous number of input pins, this FPGA allows for extensive connectivity and the ability to handle diverse input signals.

Package Shape: SQUARE

The square package shape provides efficient use of board space, allowing for easier integration and improved overall system design.

Form of Terminal: BALL

The ball terminal form offers secure connections and improved electrical performance, ensuring reliable signal transmission.

Nominal Supply Voltage (V): 1.2

This FPGA operates at a nominal supply voltage of 1.2 V, enhancing energy efficiency and reducing power consumption.

Power Supplies (V): 1.2, 2.5/3.3

Supporting multiple power supply options (1.2V, 2.5V, and 3.3V) provides flexibility in power management and compatibility with different systems.

No. of Terminals: 676

With a significant number of terminals, this FPGA allows for extensive external connectivity, facilitating seamless integration with other components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

The programmable nature of this IC type enables customization and adaptability, making it ideal for prototyping, testing, and various applications with changing requirements.

Package Style (Meter): GRID ARRAY

The grid array package style offers reliable solder connections, improved thermal performance, and efficient layout for high-density circuits, ensuring the longevity and performance of this FPGA.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage of 1.14 V ensures stable operation even under lower power conditions, making it energy-efficient and versatile.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows for reliable performance even in demanding environments with elevated temperatures.

Pitch Of Terminal: 1 mm

The small terminal pitch of 1 mm provides space efficiency and allows for high pin density, making it suitable for compact designs.

Maximum Combinatorial Delay of a CLB: 0.21 ns

The minimal combinatorial delay of 0.21 ns in each Configurable Logic Block (CLB) ensures high-speed signal processing and efficient execution of complex logic functions.

Organization: 7911 CLBS

The organized structure with 7911 CLBs offers flexibility and scalability, enabling intricate digital designs with increased complexity and functionality.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0 °C ensures reliable performance even in harsh environments with low temperatures.

Finishing Of Terminal Used: TIN SILVER COPPER

The terminal finishing with a combination of tin, silver, and copper provides excellent electrical conductivity, corrosion resistance, and solderability, ensuring reliable connections and robust performance.

Position Of Terminal: BOTTOM

The position of the terminals at the bottom of the package allows for space-saving mounting options and efficient heat dissipation, promoting overall system stability and thermal management.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 ensures proper storage and handling, minimizing the risk of moisture-related failures and extending the lifespan of this FPGA.

Maximum Seated Height: 2.44 mm

The low maximum seated height of 2.44 mm allows for compact and low-profile designs, facilitating integration in space-constrained applications.

Width: 27 mm

The moderate width dimension of 27 mm offers compatibility with standard board layouts and facilitates seamless integration into existing systems.

Maximum Clock Frequency: 862 MHz

With a high maximum clock frequency of 862 MHz, this FPGA can handle rapid data processing and achieve real-time performance in demanding applications.

No. of Outputs: 480

The generous number of output pins allows for extensive signal routing and facilitates flexible connectivity, enhancing versatility in system design.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, this FPGA can withstand soldering processes, ensuring reliable assembly and manufacturability.

Peak Reflow Temperature °C: 250

The high peak reflow temperature of 250°C enables efficient soldering processes, ensuring secure connections and robust reliability.

Length: 27 mm

The moderate length dimension of 27 mm allows for easy integration and compatibility with standard board layouts, facilitating seamless system design and assembly.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC6SLX100-3FGG676C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

101261

No. of Inputs:

480

No. of Outputs:

480

No. of CLBs:

7911

Maximum Clock Frequency:

862 MHz

CLB Maximum Delay:

0.21 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

7911 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2,2.5/3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

27 mm

Width:

27 mm

Maximum Seated Height:

2.44 mm

Package Equivalence Code:

BGA676,26X26,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

676

Standards

JESD-30 Code:

S-PBGA-B676

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC6SLX100-3FGG676C Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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