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W25Q32JVTCIM

Winbond Electronics

W25Q32JVTCIM by Winbond Electronics

Winbond Electronics' W25Q32JVTCIM is a 32Mb Flash Memory with 133MHz clock frequency, operating at 3V. It has a compact rectangular package and is suitable for industrial applications requiring high-speed synchronous operation. With 4Mx8 organization, it offers reliable performance in a wide temperature range from -40 to 85°C.

Median Price

$0.306

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 754 parts In-Stock

1+ parts

$0.306

100+ parts

$0.306

1k+ parts

$0.306

10k+ parts

$0.306

754

$0.306

$0.306

$0.306

$0.306

Verical

USA . 754 parts In-Stock

1+ parts

-

100+ parts

$0.306

1k+ parts

$0.306

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$0.306

754

-

$0.306

$0.306

$0.306

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 29 parts In-Stock

1+ parts

$0.360

100+ parts

-

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29

$0.360

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Vyrian

USA . 559 parts In-Stock

1+ parts

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559

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 6,512 parts In-Stock

1+ parts

$0.360

100+ parts

-

1k+ parts

-

10k+ parts

$0.353

6,512

$0.360

-

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$0.353

Argo Parts USA

USA . 1,927 parts In-Stock

1+ parts

$0.360

100+ parts

-

1k+ parts

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10k+ parts

$0.350

1,927

$0.360

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$0.350

Corohmni

South Africa . 39 parts In-Stock

1+ parts

$4.646

100+ parts

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39

$4.646

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Aztec Data Supply Inc.

USA . 4,948 parts In-Stock

1+ parts

$4.720

100+ parts

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4,948

$4.720

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AZTECH Wire

Italy . 790 parts In-Stock

1+ parts

$8.950

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790

$8.950

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Overview

Experience the next level of performance and reliability with the W25Q32JVTCIM by Winbond Electronics. As a trusted manufacturer in the industry, Winbond Electronics delivers top-notch quality flash memory products that are perfect for a wide range of applications. Whether you're looking to enhance your electronic devices or streamline your data storage solutions, this product offers unparalleled value, benefits, and advantages. Upgrade to Winbond Electronics and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a cost-effective and durable solution for the package body, making it suitable for various applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on circuit boards, saving space and simplifying assembly.

Package Shape: RECTANGULAR

The rectangular shape of the package offers a standardized design that is compatible with most circuit board layouts.

Operating Mode: SYNCHRONOUS

The synchronous operation ensures reliable and coordinated communication between the memory and the system, optimizing performance.

Nominal Supply Voltage: 3V

The 3V supply voltage offers a balance between power consumption and performance, making it ideal for a wide range of applications.

No. of Terminals: 24

The 24 terminals provide ample connectivity options for interfacing with other components, enhancing flexibility in system design.

Package Style (Meter): GRID ARRAY, THIN PROFILE

The grid array and thin profile design enable high-density storage and efficient use of space in compact devices.

Maximum Operating Temperature: 85°C

The high maximum operating temperature tolerance ensures reliable performance even in demanding environments with elevated temperatures.

Organization: 4MX8

The 4MX8 organization offers a balance between capacity and speed, making it suitable for a variety of memory-intensive applications.

Minimum Operating Temperature: -40°C

The low minimum operating temperature tolerance allows for reliable operation in cold environments, expanding the range of use cases.

Terminal Position: BOTTOM

The bottom terminal position simplifies installation and connection processes, contributing to ease of use and maintenance.

Maximum Seated Height: 1.2 mm

The low seated height helps reduce overall profile and space requirements in compact designs, improving system efficiency.

Maximum Clock Frequency (fCLK): 133 MHz

The high clock frequency capability supports fast data transfer rates, enhancing system performance and responsiveness.

Width: 6 mm

The 6mm width offers a compact form factor suitable for space-constrained applications without compromising on functionality.

Minimum Supply Voltage (Vsup): 2.7V

The 2.7V minimum supply voltage ensures compatibility with a wide range of power sources, increasing versatility.

Length: 8 mm

The 8mm length provides a balanced footprint for the memory module, enabling easy integration into various device designs.

Programming Voltage (V): 3V

The 3V programming voltage simplifies the memory configuration process, ensuring ease of use and setup.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature tolerance allows for reliable operation in harsh industrial environments, enhancing durability and longevity.

Technology: CMOS

The CMOS technology used in the memory module offers low power consumption and high-speed operation, optimizing energy efficiency.

Parallel or Serial: SERIAL

The serial interface enables efficient data transmission and simplifies communication protocols, enhancing compatibility with modern systems.

Terminal Form: BALL

The ball terminal form facilitates secure and reliable connections, minimizing signal interference and ensuring data integrity.

No. of Words: 4194304 words

The large number of words provides ample storage capacity for data-intensive applications, supporting extensive data storage and retrieval.

Memory Width: 8

The 8-bit memory width offers a versatile data processing capability, suitable for a wide range of computational tasks.

Terminal Pitch: 1 mm

The 1mm terminal pitch allows for precise and efficient connection to other components, ensuring reliable signal transmission.

No. of Words Code: 4M

The 4M words code simplifies memory addressing and access, streamlining data management processes and enhancing efficiency.

Maximum Supply Voltage (Vsup): 3.6V

The 3.6V maximum supply voltage tolerance ensures robust performance and protection against voltage fluctuations, enhancing reliability.

Memory Density: 33554432 bit

The high memory density offers ample storage capacity for storing large datasets, enabling efficient data processing and management.

Memory IC Type: FLASH

The Flash memory IC type provides fast read and write speeds, supporting quick data access and retrieval for enhanced system performance.

Technical Specifications

Flash Memory W25Q32JVTCIM attributes and parameters. Explore more Flash Memory devices from Winbond Electronics

Specs

Maximum Clock Frequency (fCLK):

133 MHz

JESD-30 Code:

R-PBGA-B24

Length:

8 mm

Memory Density:

33554432 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

24

No. of Words:

4194304 words

No. of Words Code:

4M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

4MX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Programming Voltage (V):

3

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6 mm

Trade Compliance

W25Q32JVTCIM Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Winbond Electronics

Winbond was established in September 1987 and listed on Taiwan Stock Exchange in 1995, and is headquartered in Central Taiwan Science Park, Taichung, Taiwan. Winbond's 12-inch fabs, which are the factories with high levels of intelligent technology and automation, are located in Taichung and Kaohsiung Science Park. Winbond is a Specialty memory IC company. From product design, research and development, and wafer fabrication to the marketing of brand name products, Winbond endeavors to provide its global clientele with total memory solutions. Winbond's major product lines include Code Storage Flash Memory, TrustME® Secure Flash,Specialty DRAM and Mobile DRAM. The Company is the only one in Taiwan with the ability to develop DRAM and FLASH products in-house. Our advantages of technological autonomy and prudent capacity strategies enable us to build a highly flexible production system and create synergy among product lines, which allows us to meet the diverse demands of customers while building our brand image. Winbond’s products are used extensively in handheld devices, consumer electronics, and computer peripherals. We also focus on high-barrier, high-quality applications, such automotive and industrial electronics. Winbond has set up operations and distributor networks in the USA, Japan, China, Hong Kong , Israel ,and Germany to serve clients better and expand the depth and breadth of product sales. With regard to quality, Winbond pursues excellence and zero defects, and is certified in a number of quality and environmental safety management systems. It is also the first memory manufacturer in Taiwan to obtain the ISO 26262 certification, which is the highest standard for automotive functional safety. Winbond also always adheres to high standards of corporate governance; we have been evaluated by the Taiwan Stock Exchange as one of the top 20% listed corporate governance. Winbond will continue to provide customer-oriented services. Furthermore, by leveraging the strength of our advanced semiconductor design and manufacturing know-how, observing the core values of "accountability, innovation and synergy" and incorporating the corporate spirit of "execution, innovation and passion" in all operational activities, Winbond will strive towards the goal of becoming a hidden champion in providing sustainable semiconductors technology to enrich human life.

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