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W25Q32FVZPIG

Winbond Electronics

W25Q32FVZPIG by Winbond Electronics

Winbond Electronics' W25Q32FVZPIG is a 32M NOR flash memory with SPI serial bus, operating at 104 MHz. It has 100000 write/erase cycles endurance and operates in industrial temperature range (-40 to 85 °C). Ideal for applications requiring high-speed data transfer and reliable non-volatile memory storage.

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Kruse Electronics AG

Switzerland . 105,000 parts In-Stock

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Vyrian

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Connector Distribution Corp

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Right Parts Inc.

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Bristol Electronics

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Nova Conductors

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Cyclops Electronics Ltd

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Corohmni

South Africa . 157 parts In-Stock

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$2.861

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Aztec Data Supply Inc.

USA . 294 parts In-Stock

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$3.960

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AZTECH Wire

Italy . 235 parts In-Stock

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GlobX GmbH

Germany . 121,298 parts In-Stock

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Kepictronics

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Authorized Procurement Solutions

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Perfect Parts

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Argo Parts USA

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Continental Prestige Electronics

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Bastille Electronics

Australia . 100 parts In-Stock

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Overview

Unleash the power of reliable and high-quality flash memory with the W25Q32FVZPIG by Winbond Electronics. Built by a trusted manufacturer, this product offers seamless performance in a wide range of applications. With a focus on value and benefits for customers, this flash memory provides fast and efficient data storage without compromising on durability. Experience the advantage of Winbond Electronics' expertise in flash memory technology with the W25Q32FVZPIG, delivering top-notch performance that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body makes the flash memory durable and resistant to external factors, ensuring a longer lifespan.

Surface Mount: YES

With surface mount capability, this flash memory can be easily integrated into PCBs, saving space and simplifying the assembly process.

Operating Mode: SYNCHRONOUS

The synchronous operating mode allows for faster data transfer and synchronization, increasing overall performance of the flash memory.

Nominal Supply Voltage / Vsup (V): 3

The 3V supply voltage ensures compatibility with a wide range of systems and devices, making this flash memory versatile and easy to integrate.

No. of Words: 33554432 words

With a large number of words, this flash memory offers ample storage capacity for data-intensive applications, making it suitable for a variety of use cases.

Endurance: 100000 Write/Erase Cycles

The high endurance of 100,000 write/erase cycles ensures reliable performance and longevity, making this flash memory a durable and cost-effective storage solution.

Serial Bus Type: SPI

The SPI serial bus type allows for efficient communication and data transfer, making this flash memory suitable for applications that require high-speed data access.

Technical Specifications

Flash Memory W25Q32FVZPIG attributes and parameters. Explore more Flash Memory devices from Winbond Electronics

Specs

Maximum Clock Frequency (fCLK):

104 MHz

Minimum Data Retention Time:

20

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-N8

Length:

6 mm

Memory Density:

33554432 bit

Memory IC Type:

Memory Width:

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

33554432 words

No. of Words Code:

32M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32MX1

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/3.3

Programming Voltage (V):

2.7

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00002 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

20 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Type:

NOR TYPE

Width:

5 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

W25Q32FVZPIG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Winbond Electronics

Winbond was established in September 1987 and listed on Taiwan Stock Exchange in 1995, and is headquartered in Central Taiwan Science Park, Taichung, Taiwan. Winbond's 12-inch fabs, which are the factories with high levels of intelligent technology and automation, are located in Taichung and Kaohsiung Science Park. Winbond is a Specialty memory IC company. From product design, research and development, and wafer fabrication to the marketing of brand name products, Winbond endeavors to provide its global clientele with total memory solutions. Winbond's major product lines include Code Storage Flash Memory, TrustME® Secure Flash,Specialty DRAM and Mobile DRAM. The Company is the only one in Taiwan with the ability to develop DRAM and FLASH products in-house. Our advantages of technological autonomy and prudent capacity strategies enable us to build a highly flexible production system and create synergy among product lines, which allows us to meet the diverse demands of customers while building our brand image. Winbond’s products are used extensively in handheld devices, consumer electronics, and computer peripherals. We also focus on high-barrier, high-quality applications, such automotive and industrial electronics. Winbond has set up operations and distributor networks in the USA, Japan, China, Hong Kong , Israel ,and Germany to serve clients better and expand the depth and breadth of product sales. With regard to quality, Winbond pursues excellence and zero defects, and is certified in a number of quality and environmental safety management systems. It is also the first memory manufacturer in Taiwan to obtain the ISO 26262 certification, which is the highest standard for automotive functional safety. Winbond also always adheres to high standards of corporate governance; we have been evaluated by the Taiwan Stock Exchange as one of the top 20% listed corporate governance. Winbond will continue to provide customer-oriented services. Furthermore, by leveraging the strength of our advanced semiconductor design and manufacturing know-how, observing the core values of "accountability, innovation and synergy" and incorporating the corporate spirit of "execution, innovation and passion" in all operational activities, Winbond will strive towards the goal of becoming a hidden champion in providing sustainable semiconductors technology to enrich human life.

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