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V62/04604-01XE

Texas Instruments

V62/04604-01XE by Texas Instruments

V62/04604-01XE by Texas Instruments is a Power Management IC with 2.7V nominal voltage, 8 terminals, and -40 to 125°C operating temperature range. It is used in automotive applications for power supply support circuits due to its small outline package and surface mount capability.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,722 parts In-Stock

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Digiode

USA . 3,698 parts In-Stock

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3,698

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Distributors (Availability)

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One Stop Electronics

USA . 442 parts In-Stock

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$2.500

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442

$2.500

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Semicontronic

India . 919 parts In-Stock

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$3.500

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$3.412

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$3.395

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919

$3.500

$3.412

$3.395

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Ampacity Inc.

Singapore . 1,133 parts In-Stock

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$4.500

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$4.500

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AZTECH Wire

Italy . 853 parts In-Stock

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$12.393

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853

$12.393

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Parana Technologies

USA . 342 parts In-Stock

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$16.947

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$17.178

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342

$16.947

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$17.178

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DigiPath Technology Company

USA . 1,784 parts In-Stock

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$18.661

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$17.168

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1,784

$18.661

$17.168

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ChromeModa Solutions

Germany . 5,050 parts In-Stock

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$19.042

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$15.614

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$19.042

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IDEA Electronic Components Group

UK . 1,718 parts In-Stock

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$19.042

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$18.090

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$17.138

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1,718

$19.042

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$17.138

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Corphita

USA . 2,199 parts In-Stock

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Corohmni

South Africa . 496 parts In-Stock

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Overview

Enhance your power management solutions with the V62/04604-01XE by Texas Instruments. Known for their high-quality products, Texas Instruments delivers reliable Power Management ICs that are perfect for automotive applications. This small outline, thin profile IC offers a wide supply voltage range, dual terminals, and excellent temperature grades. With its advanced features and durable materials, this IC provides optimal performance and efficiency, making it the ideal choice for your power management needs. Upgrade your systems with the V62/04604-01XE and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable electronic devices.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Nominal Supply Voltage (Vsup): 2.7 V

The nominal supply voltage of 2.7V ensures efficient power management within the specified operating range, contributing to overall energy efficiency.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, the power management IC can withstand harsh environmental conditions and maintain stable performance.

Temperature Grade: AUTOMOTIVE

Being automotive-grade means the IC is designed to meet stringent requirements for reliability and performance in automotive applications, ensuring safe and consistent operation in vehicles.

Technical Specifications

Power Management ICs V62/04604-01XE attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

POWER-ON RESET GENERATOR

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.4 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.15 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+1.1V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

V62/04604-01XE Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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