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V62/04604-04YE

Texas Instruments

V62/04604-04YE by Texas Instruments

V62/04604-04YE by Texas Instruments is a Power Management IC with 2.7V nominal voltage, 8 terminals, and MILITARY temperature grade. It is used in POWER SUPPLY SUPPORT CIRCUITS for applications requiring a compact SMALL OUTLINE package with surface mount capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,109 parts In-Stock

1+ parts

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100+ parts

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3,109

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Digiode

USA . 2,524 parts In-Stock

1+ parts

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2,524

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 132 parts In-Stock

1+ parts

$2.500

100+ parts

-

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132

$2.500

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Ampacity Inc.

Singapore . 1,470 parts In-Stock

1+ parts

$3.500

100+ parts

-

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1,470

$3.500

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Parana Technologies

USA . 390 parts In-Stock

1+ parts

$5.538

100+ parts

-

1k+ parts

$6.305

10k+ parts

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390

$5.538

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$6.305

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DigiPath Technology Company

USA . 1,508 parts In-Stock

1+ parts

$6.099

100+ parts

$5.611

1k+ parts

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1,508

$6.099

$5.611

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IDEA Electronic Components Group

UK . 673 parts In-Stock

1+ parts

$6.223

100+ parts

-

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$5.601

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673

$6.223

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$5.601

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ChromeModa Solutions

Germany . 106 parts In-Stock

1+ parts

$6.223

100+ parts

$5.103

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106

$6.223

$5.103

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Semicontronic

India . 166 parts In-Stock

1+ parts

$6.500

100+ parts

$6.338

1k+ parts

$6.305

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166

$6.500

$6.338

$6.305

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AZTECH Wire

Italy . 275 parts In-Stock

1+ parts

$14.301

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275

$14.301

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Corphita

USA . 3,470 parts In-Stock

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3,470

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Corohmni

South Africa . 394 parts In-Stock

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394

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Overview

Discover the cutting-edge V62/04604-04YE by Texas Instruments, a high-quality Power Management IC designed to meet the demands of various applications. With a MILITARY-grade temperature grade and a small outline package style, this IC offers reliability and efficiency like no other. Perfect for power supply support circuits, this IC boasts a wide voltage range, dual terminal position, and superior nickel palladium gold finish. Experience superior performance and value with the V62/04604-04YE, setting new standards in power management technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material that can withstand various environmental conditions, increasing product longevity.

Surface Mount: YES

Allows for easy and efficient installation on PCBs, saving time and effort during manufacturing.

Nominal Supply Voltage (Vsup): 2.7 V

Optimal supply voltage for efficient power management, ensuring stable performance.

No. of Terminals: 8

Provides flexibility for connecting various components, enhancing functionality and compatibility.

Maximum Operating Temperature: 125 °C

Can operate effectively in high-temperature environments, suitable for a wide range of applications.

Temperature Grade: MILITARY

Meets strict military standards for reliability and ruggedness, making it ideal for demanding environments.

Technical Specifications

Power Management ICs V62/04604-04YE attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

POWER-ON RESET GENERATOR

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.016 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+1.1V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

V62/04604-04YE Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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