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V62/06636-03XE

Texas Instruments

V62/06636-03XE by Texas Instruments

V62/06636-03XE by Texas Instruments is a Power Management IC with 5V nominal voltage, 2/6 power supplies, and MILITARY temperature grade. It is used in POWER SUPPLY SUPPORT CIRCUITS for applications requiring small outline, low profile packages with dual terminal position.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,551 parts In-Stock

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7,551

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Digiode

USA . 1,029 parts In-Stock

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1,029

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Distributors (Availability)

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Semicontronic

India . 199 parts In-Stock

1+ parts

$0.500

100+ parts

$0.488

1k+ parts

$0.485

10k+ parts

-

199

$0.500

$0.488

$0.485

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AZTECH Wire

Italy . 411 parts In-Stock

1+ parts

$5.308

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411

$5.308

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Ampacity Inc.

Singapore . 1,515 parts In-Stock

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$5.500

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1,515

$5.500

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One Stop Electronics

USA . 1,470 parts In-Stock

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$6.500

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1,470

$6.500

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Parana Technologies

USA . 2,259 parts In-Stock

1+ parts

$19.406

100+ parts

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$19.424

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2,259

$19.406

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$19.424

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DigiPath Technology Company

USA . 430 parts In-Stock

1+ parts

$21.369

100+ parts

$19.659

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430

$21.369

$19.659

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ChromeModa Solutions

Germany . 4,431 parts In-Stock

1+ parts

$21.805

100+ parts

$17.880

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4,431

$21.805

$17.880

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IDEA Electronic Components Group

UK . 1,134 parts In-Stock

1+ parts

$21.805

100+ parts

$20.715

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$19.624

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1,134

$21.805

$20.715

$19.624

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Corphita

USA . 2,278 parts In-Stock

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2,278

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Corohmni

South Africa . 457 parts In-Stock

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Overview

Experience superior power management with the V62/06636-03XE by Texas Instruments. As a trusted manufacturer in the industry, Texas Instruments delivers high-quality Power Management ICs that provide reliable performance in a wide range of applications. This small outline, low profile package offers dual terminals and a military-grade temperature grade, ensuring durability and efficiency. Benefit from a nominal supply voltage of 5V, peak reflow temperature of 260°C, and a compact design that maximizes space utilization. Trust Texas Instruments to meet your power supply support circuit needs with the V62/06636-03XE.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the Power Management IC, ensuring a longer lifespan.

Surface Mount: YES

The surface mount capability allows for easy integration onto circuit boards, saving space and simplifying the assembly process.

Nominal Supply Voltage (Vsup): 5 V

The 5V supply voltage is a common and widely available power source in many electronic devices, making this IC compatible with a variety of applications.

Power Supplies (V): 2/6

Having 2/6 power supplies allows for flexibility in connecting to different power sources, improving compatibility with various systems.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures that the Power Management IC can function reliably in a wide range of environmental conditions.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature makes this IC suitable for use in extreme cold environments without sacrificing performance.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish of Nickel/Palladium/Gold provides excellent conductivity and corrosion resistance, ensuring reliable electrical connections.

Temperature Grade: MILITARY

The military-grade temperature rating ensures that this Power Management IC meets stringent reliability and performance standards for mission-critical applications.

Technical Specifications

Power Management ICs V62/06636-03XE attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 4.55V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e4

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TO-236

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.025 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4.55V

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

1.6 mm

Trade Compliance

V62/06636-03XE Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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