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V62/03629-02YE

Texas Instruments

V62/03629-02YE by Texas Instruments

V62/03629-02YE by Texas Instruments is a Power Management IC with 3.3V nominal voltage, 2/6 power supplies, and 8 terminals. It is designed for military applications with a temperature range of -55 to 125°C and features adjustable threshold voltages of +1.25V, 2.93V, and 4.55V. The IC is ideal for power supply support circuits in compact designs requiring small outline packages with surface mount capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,437 parts In-Stock

1+ parts

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7,437

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Digiode

USA . 1,712 parts In-Stock

1+ parts

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1,712

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 915 parts In-Stock

1+ parts

$1.500

100+ parts

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915

$1.500

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One Stop Electronics

USA . 378 parts In-Stock

1+ parts

$3.500

100+ parts

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378

$3.500

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Semicontronic

India . 1,291 parts In-Stock

1+ parts

$5.500

100+ parts

$5.362

1k+ parts

$5.335

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1,291

$5.500

$5.362

$5.335

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Parana Technologies

USA . 515 parts In-Stock

1+ parts

$8.699

100+ parts

-

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$9.380

10k+ parts

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515

$8.699

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$9.380

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ChromeModa Solutions

Germany . 5,216 parts In-Stock

1+ parts

$9.774

100+ parts

$8.015

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5,216

$9.774

$8.015

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IDEA Electronic Components Group

UK . 1,931 parts In-Stock

1+ parts

$9.774

100+ parts

$9.285

1k+ parts

$8.797

10k+ parts

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1,931

$9.774

$9.285

$8.797

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AZTECH Wire

Italy . 439 parts In-Stock

1+ parts

$15.410

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439

$15.410

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Kepictronics

USA . 15,000 parts In-Stock

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15,000

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Corphita

USA . 3,610 parts In-Stock

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3,610

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Corohmni

South Africa . 57 parts In-Stock

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57

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DigiPath Technology Company

USA . 25 parts In-Stock

1+ parts

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100+ parts

$8.812

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25

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$8.812

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Overview

Elevate your power management capabilities with the V62/03629-02YE by Texas Instruments, a high-quality Power Management IC designed to meet the needs of various applications. With a robust package body material and surface mount capability, this product offers reliability and convenience. Whether you're in the military sector or require precise power supply support circuits, this IC has you covered. Trust in Texas Instruments for superior performance and unparalleled value. Empower your projects with the V62/03629-02YE today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for portable and rugged applications.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and cost in production.

Nominal Supply Voltage (Vsup): 3.3 V

Compatible with common power supply voltages, ensuring widespread usability.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for industrial environments.

Minimum Operating Temperature: -55 °C

Capable of operating in extremely low temperatures, ideal for harsh weather conditions.

Terminal Finish: NICKEL PALLADIUM GOLD SILVER

Provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Temperature Grade: MILITARY

Designed to meet strict military standards for performance and durability.

Maximum Supply Current (Isup): 0.04 mA

Low power consumption helps to conserve energy and prolong battery life.

No. of Channels: 3

Multiple channels allow for simultaneous power management of different components, improving efficiency.

Technical Specifications

Power Management ICs V62/03629-02YE attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

POWER-ON RESET GENERATOR

Adjustable Threshold:

YES

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

3

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Qualification:

Not Qualified

Maximum Seated Height:

1.07 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.04 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+1.25,2.93,4.55V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

V62/03629-02YE Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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