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V62/04604-03XE

Texas Instruments

V62/04604-03XE by Texas Instruments

V62/04604-03XE by Texas Instruments is a Power Management IC with 2.7V nominal voltage, 8 terminals, and -40 to 125°C operating temperature range. Ideal for automotive applications, it features a small outline package with thin profile and shrink pitch design for surface mount assembly.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,904 parts In-Stock

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Digiode

USA . 2,245 parts In-Stock

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2,245

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Distributors (Availability)

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Semicontronic

India . 749 parts In-Stock

1+ parts

$1.500

100+ parts

$1.462

1k+ parts

$1.455

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749

$1.500

$1.462

$1.455

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One Stop Electronics

USA . 1,038 parts In-Stock

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$3.500

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$3.500

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Ampacity Inc.

Singapore . 598 parts In-Stock

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$4.500

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598

$4.500

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Parana Technologies

USA . 1,582 parts In-Stock

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$14.595

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$15.035

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1,582

$14.595

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$15.035

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AZTECH Wire

Italy . 495 parts In-Stock

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$15.518

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495

$15.518

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ChromeModa Solutions

Germany . 5,605 parts In-Stock

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$16.399

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$13.447

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5,605

$16.399

$13.447

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IDEA Electronic Components Group

UK . 1,252 parts In-Stock

1+ parts

$16.399

100+ parts

$15.579

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$14.759

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1,252

$16.399

$15.579

$14.759

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Corphita

USA . 2,381 parts In-Stock

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DigiPath Technology Company

USA . 883 parts In-Stock

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$14.785

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883

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$14.785

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Corohmni

South Africa . 239 parts In-Stock

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Overview

Experience the unparalleled quality and reliability of Texas Instruments with the V62/04604-03XE Power Management IC. Designed for automotive applications, this small outline, thin profile IC offers a wide supply voltage range of 2-6V, making it ideal for various power supply support circuits. With dual terminal position and nickel palladium gold finish, this IC ensures optimal performance even in extreme temperatures. Trust Texas Instruments to deliver cutting-edge technology that exceeds your expectations. Unlock a world of possibilities with the V62/04604-03XE.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and reliability to the package, ensuring the safety and longevity of the power management IC.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 2.7 V

Optimal nominal supply voltage ensures efficient power management and performance of the IC.

No. of Terminals: 8

Having multiple terminals allows for versatile connections and interfaces with other components, expanding the functionality and usability of the IC.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliability and stability of the IC even in harsh environmental conditions, making it suitable for a wide range of applications.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures that the IC can function effectively even in cold environments, enhancing its versatility and usability.

Width (mm): 3 mm

Small width allows for compact and space-saving design, making it ideal for applications with limited physical space.

Terminal Form: GULL WING

Gull wing terminal form provides secure and reliable connections to the circuit board, reducing the risk of connectivity issues and improving overall performance.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade ensures that the IC is designed to withstand the temperature fluctuations and demands of automotive applications, making it a reliable choice for automotive power management systems.

Technical Specifications

Power Management ICs V62/04604-03XE attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

POWER-ON RESET GENERATOR

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.4 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.15 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.93V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

V62/04604-03XE Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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