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V62/04648-03XE

Texas Instruments

V62/04648-03XE by Texas Instruments

V62/04648-03XE by Texas Instruments is a Power Management IC with 5 terminals, operating at -40 to 125°C. It supports supply voltages from 1.3V to 6V and has an adjustable threshold of 3.05V, making it ideal for automotive applications requiring low power consumption and compact design.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,839 parts In-Stock

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3,839

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Vyrian

USA . 3,189 parts In-Stock

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3,189

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Distributors (Availability)

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Semicontronic

India . 614 parts In-Stock

1+ parts

$2.500

100+ parts

$2.438

1k+ parts

$2.425

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614

$2.500

$2.438

$2.425

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One Stop Electronics

USA . 886 parts In-Stock

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$3.500

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886

$3.500

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Parana Technologies

USA . 571 parts In-Stock

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$4.461

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$4.894

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571

$4.461

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$4.894

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Ampacity Inc.

Singapore . 946 parts In-Stock

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$4.500

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946

$4.500

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ChromeModa Solutions

Germany . 5,124 parts In-Stock

1+ parts

$5.012

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$4.110

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5,124

$5.012

$4.110

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IDEA Electronic Components Group

UK . 45 parts In-Stock

1+ parts

$5.012

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$4.511

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45

$5.012

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$4.511

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AZTECH Wire

Italy . 462 parts In-Stock

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$19.808

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462

$19.808

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Corphita

USA . 3,663 parts In-Stock

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DigiPath Technology Company

USA . 878 parts In-Stock

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$4.519

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878

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$4.519

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Corohmni

South Africa . 186 parts In-Stock

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Overview

Elevate your power management capabilities with the V62/04648-03XE by Texas Instruments. Manufactured with precision and expertise, this Power Management IC is designed to provide efficient and reliable performance for a wide range of applications. With a package body material of PLASTIC/EPOXY and a temperature grade of AUTOMOTIVE, this IC ensures durability and resilience in any environment. Its compact design and adjustable threshold voltage offer flexibility and convenience, making it the ideal choice for automotive and industrial uses. Trust Texas Instruments to deliver quality and innovation with the V62/04648-03XE.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and reliability for the IC package, making it suitable for various applications.

Surface Mount: YES

Being surface mountable allows for easy PCB assembly, saving space and making the product suitable for compact designs.

Nominal Supply Voltage (Vsup): 3.3 V

Operates at a common and widely used supply voltage, making it compatible with a wide range of systems.

Power Supplies (V): 1.3/6

Supports a wide range of power supplies from 1.3V to 6V, offering flexibility in power input options.

No. of Terminals: 5

Having 5 terminals allows for connectivity to multiple external components, enabling versatile circuit configurations.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for applications where thermal management is crucial.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold environments, ensuring reliability in varied temperature conditions.

Terminal Finish: Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

The terminal finish provides excellent conductivity and corrosion resistance, enhancing the durability and longevity of the product.

Terminal Position: DUAL

Dual terminal position allows for better stability and connection reliability, reducing the risk of signal interference.

Adjustable Threshold: YES

Being adjustable allows for customization of threshold voltage, providing flexibility in circuit design and functionality.

Technical Specifications

Power Management ICs V62/04648-03XE attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 1.4V

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP5/6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.3/6

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.006 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

1.3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

3.05

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

1.25 mm

Trade Compliance

V62/04648-03XE Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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