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UCD90240ZRBT

Texas Instruments

UCD90240ZRBT by Texas Instruments

UCD90240ZRBT by Texas Instruments is a Power Management IC with 157 terminals, operating at -40 to 85°C. It has a supply voltage range of 2.97V to 3.63V and features 24 channels for power supply management circuits. The IC is designed for industrial applications requiring precise power control in a compact grid array package.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Inland Empire Components Inc.

USA . 7,700 parts In-Stock

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7,700

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Vyrian

USA . 7,024 parts In-Stock

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7,024

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Digiode

USA . 423 parts In-Stock

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423

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Bristol Electronics

USA . 60 parts In-Stock

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60

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Distributors (Availability)

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Parana Technologies

USA . 1,498 parts In-Stock

1+ parts

$1.669

100+ parts

-

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$2.276

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1,498

$1.669

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$2.276

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DigiPath Technology Company

USA . 2,358 parts In-Stock

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$1.838

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2,358

$1.838

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IDEA Electronic Components Group

UK . 504 parts In-Stock

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$1.875

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$1.688

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504

$1.875

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$1.688

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ChromeModa Solutions

Germany . 425 parts In-Stock

1+ parts

$1.875

100+ parts

$1.538

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425

$1.875

$1.538

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Ampacity Inc.

Singapore . 1,604 parts In-Stock

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$4.500

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1,604

$4.500

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One Stop Electronics

USA . 848 parts In-Stock

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$5.500

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848

$5.500

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Semicontronic

India . 333 parts In-Stock

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$6.500

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$6.338

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$6.305

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333

$6.500

$6.338

$6.305

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AZTECH Wire

Italy . 883 parts In-Stock

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$19.050

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883

$19.050

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Component Stockers USA

USA . 763 parts In-Stock

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$99.990

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763

$99.990

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Corphita

USA . 2,944 parts In-Stock

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2,944

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Corohmni

South Africa . 447 parts In-Stock

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447

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Microchip USA

USA . 415 parts In-Stock

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415

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Overview

Experience the cutting-edge technology of Texas Instruments with the UCD90240ZRBT Power Management IC. Designed for industrial-grade applications, this high-quality product offers 24 channels for efficient power supply management. With a compact package style and top-notch materials, this IC ensures reliable performance in a wide range of temperatures. Say goodbye to power supply issues and experience seamless operations with the UCD90240ZRBT by Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for the package, ensuring long-term performance.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards, saving time and effort during production.

Nominal Supply Voltage (Vsup): 3.3 V

3.3V supply voltage is common and widely available, making it compatible with a variety of systems and applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures stable performance even in challenging environments or under heavy load conditions.

No. of Channels: 24

Having 24 channels allows for a higher level of control and flexibility in managing power distribution within a system.

Technical Specifications

Power Management ICs UCD90240ZRBT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PBGA-B157

JESD-609 Code:

e1

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

24

No. of Functions:

1

No. of Terminals:

157

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA157,13X13,25

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

54.9 mA

Maximum Supply Voltage (Vsup):

3.63 V

Minimum Supply Voltage (Vsup):

2.97 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

BALL

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

9 mm

Trade Compliance

UCD90240ZRBT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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