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UCD90124ARGCR

Texas Instruments

UCD90124ARGCR by Texas Instruments

UCD90124ARGCR by Texas Instruments is a Power Management IC with 1 function. It has a nominal voltage of 3.3V and operates in temperatures ranging from -40 to 125°C. This IC is commonly used in automotive applications for power supply management circuits.

Median Price

$9.422

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 103,826 parts In-Stock

1+ parts

$9.422

100+ parts

$8.230

1k+ parts

$5.676

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103,826

$9.422

$8.230

$5.676

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Distributors (In-Stock)

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$7.203

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50

$7.203

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Digiode

USA . 3,263 parts In-Stock

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$8.951

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3,263

$8.951

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Vyrian

USA . 8,353 parts In-Stock

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8,353

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Component Sense

UK . 7,040 parts In-Stock

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7,040

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Chip Stock

USA . 2,577 parts In-Stock

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2,577

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Distributors (Availability)

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Continental Prestige Electronics

USA . 5,550 parts In-Stock

1+ parts

$7.203

100+ parts

-

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$7.059

5,550

$7.203

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-

$7.059

Netroflash

USA . 100 parts In-Stock

1+ parts

$7.203

100+ parts

-

1k+ parts

$6.843

10k+ parts

$6.699

100

$7.203

-

$6.843

$6.699

Ampacity Inc.

Singapore . 103,756 parts In-Stock

1+ parts

$8.010

100+ parts

-

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103,756

$8.010

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Corphita

USA . 1,293 parts In-Stock

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$8.480

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$8.480

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Parana Technologies

USA . 1,339 parts In-Stock

1+ parts

$13.845

100+ parts

$1,285.703

1k+ parts

$12.460

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1,339

$13.845

$1,285.703

$12.460

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DigiPath Technology Company

USA . 508 parts In-Stock

1+ parts

$15.245

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508

$15.245

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ChromeModa Solutions

Germany . 6,614 parts In-Stock

1+ parts

$15.556

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$12.756

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6,614

$15.556

$12.756

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IDEA Electronic Components Group

UK . 1,478 parts In-Stock

1+ parts

$15.556

100+ parts

$14.778

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$14.000

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1,478

$15.556

$14.778

$14.000

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Corohmni

South Africa . 181 parts In-Stock

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$19.002

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$19.002

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AZTECH Wire

Italy . 1,153 parts In-Stock

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$21.420

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Lixinc

USA . 11,659 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,907 parts In-Stock

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Kepictronics

USA . 6,000 parts In-Stock

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Argo Parts USA

USA . 1,440 parts In-Stock

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Futuretech Components

Singapore . 1,000 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Overview

The UCD90124ARGCR by Texas Instruments is a high-quality Power Management IC that offers numerous advantages. Manufactured by Texas Instruments, a trusted industry leader, this IC guarantees reliability and durability. It falls under the category of Power Management ICs and has applications in various industries. With its compact size and surface mount capability, it is suitable for any space-constrained design. Operating at a nominal supply voltage of 3.3V, this IC provides efficient power management solutions. Its adjustable threshold feature gives customers flexibility and control. Experience the value, benefits, and advantages this product offers today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body ensures durability and a lightweight design, making it ideal for portable power management applications.

Surface Mount: YES

With surface mount capabilities, this power management IC offers easy and efficient PCB assembly, saving valuable production time and cost.

No. of Functions: 1

This power management IC integrates multiple functions into a single chip, reducing component count and PCB space, simplifying system design and improving overall efficiency.

Package Shape: SQUARE

The square package shape enables compact and space-saving installation, making it suitable for applications with limited board space constraints.

Nominal Supply Voltage (Vsup): 3.3 V

The 3.3V nominal supply voltage ensures compatibility with a wide range of power sources, offering flexibility and ease of integration into various systems.

Power Supplies (V): 3.3

Supporting power supplies at 3.3V, this IC is suitable for applications requiring low voltage power management, such as battery-powered devices.

No. of Terminals: 64

With 64 terminals, this power management IC provides ample connectivity options, allowing for seamless integration and connection with other components in the system.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The chip carrier package style, along with heat sink/slug, and a very thin profile, ensures efficient heat dissipation and optimal thermal management, improving overall performance and reliability.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this power management IC can withstand harsh environmental conditions, making it suitable for automotive and industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows this power management IC to operate reliably in extreme cold environments, expanding its range of application possibilities.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel/palladium/gold as the terminal finish provides excellent corrosion resistance and reliable electrical connections, ensuring long-term performance and durability.

Terminal Position: QUAD

The quad-terminal position allows for easy and efficient PCB soldering and assembly, simplifying the manufacturing process and improving overall productivity.

Maximum Seated Height: 1 mm

With a maximum seated height of only 1mm, this power management IC offers a low-profile design, enabling compact and slim device designs.

Width (mm): 9 mm

The 9mm width ensures compatibility with standard board layouts and spacing requirements, facilitating seamless integration into existing designs.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

This power management IC belongs to the power supply management circuit type, providing comprehensive and efficient control over power distribution, voltage regulation, and energy management in various applications.

Minimum Supply Voltage (Vsup): 3 V

With a minimum supply voltage of 3V, this IC enables power management in systems with lower voltage requirements.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures reliable soldering during the production process, increasing the product's manufacturing yield and overall quality.

Length: 9 mm

The 9mm length makes this power management IC compatible with standard board layouts, allowing for easy integration into existing designs.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this power management IC meets the stringent requirements and reliability standards necessary for automotive environments, ensuring optimal performance and durability in vehicles.

Maximum Supply Current (Isup): 50 mA

With a maximum supply current of 50mA, this power management IC is capable of providing sufficient power to support various components and subsystems within the system.

No. of Channels: 1

Featuring a single channel, this power management IC is suited for applications requiring power management for a single power source or load.

Terminal Form: NO LEAD

The no lead terminal form, such as surface mount technology (SMT), allows for compact and reliable solder connections, reducing space consumption and facilitating automated assembly processes.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5mm, this power management IC provides fine pitch connections, ensuring precise and secure electrical connections, particularly for high-density applications.

Moisture Sensitivity Level (MSL): 3

This power management IC has a moisture sensitivity level of 3, indicating a moderate sensitivity to moisture exposure during storage or reflow soldering.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage of 3.6V allows this power management IC to accommodate a wide range of power input requirements, enhancing system compatibility and flexibility.

Adjustable Threshold: YES

The presence of adjustable thresholds in this power management IC allows for customization and fine-tuning of voltage and current limits, enabling greater control and optimization of power management within the system.

Technical Specifications

Power Management ICs UCD90124ARGCR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

50 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

9 mm

Trade Compliance

UCD90124ARGCR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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