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UCD90160ARGCR

Texas Instruments

UCD90160ARGCR by Texas Instruments

UCD90160ARGCR by Texas Instruments is a Power Management IC with a 3.3V nominal voltage and 64 terminals. It is used as a power supply management circuit in automotive applications, with a max operating temperature of 125°C and a min operating temperature of -40°C.

Median Price

$9.477

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

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Texas Instruments

USA . 10,264 parts In-Stock

1+ parts

$9.057

100+ parts

$7.911

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$5.456

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10,264

$9.057

$7.911

$5.456

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Arrow

USA . 131 parts In-Stock

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$9.477

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$6.996

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$6.996

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Verical

USA . 10 parts In-Stock

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$10.829

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10

$10.829

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Mouser Electronics

USA . 749 parts In-Stock

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$23.930

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$15.980

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$14.000

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749

$23.930

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Chip1Stop

Japan . 2,740 parts In-Stock

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$6.377

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Digiode

USA . 645 parts In-Stock

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$7.970

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Chip Stock

USA . 21,500 parts In-Stock

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Vyrian

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Cyclops Electronics Ltd

UK . 2,500 parts In-Stock

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Component Sense

UK . 2,351 parts In-Stock

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Nova Conductors

Japan . 51 parts In-Stock

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Ampacity Inc.

Singapore . 3,103 parts In-Stock

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$5.420

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$5.420

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Semicontronic

India . 2,984 parts In-Stock

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$5.420

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$5.284

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$5.257

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2,984

$5.420

$5.284

$5.257

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Advanced Electronics

New Zealand . 18 parts In-Stock

1+ parts

$6.317

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$6.001

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$6.001

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18

$6.317

$6.001

$6.001

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Corphita

USA . 2,778 parts In-Stock

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$7.550

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AZTECH Wire

Italy . 557 parts In-Stock

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$9.260

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$9.260

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Parana Technologies

USA . 2,023 parts In-Stock

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$11.906

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$12.303

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$11.906

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IDEA Electronic Components Group

UK . 712 parts In-Stock

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$13.377

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$12.708

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$12.039

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712

$13.377

$12.708

$12.039

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ChromeModa Solutions

Germany . 446 parts In-Stock

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$13.377

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$10.969

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446

$13.377

$10.969

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Corohmni

South Africa . 304 parts In-Stock

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$24.251

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Lixinc

USA . 12,371 parts In-Stock

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GreenTree Electronics

Israel . 10,000 parts In-Stock

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Kepictronics

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Alle Elektronik GmbH

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Continental Prestige Electronics

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DigiPath Technology Company

USA . 2,126 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 1,954 parts In-Stock

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Argo Parts USA

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Bastille Electronics

Australia . 40 parts In-Stock

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Overview

Discover the UCD90160ARGCR by Texas Instruments, a high-quality Power Management IC that offers unmatched value and benefits. With its advanced manufacturing techniques and expertise, Texas Instruments ensures reliable performance and durability. This versatile chip is perfect for various applications in automotive and power supply management circuits. Experience the advantages of its square package shape, very thin profile, and surface mount capabilities. Trust Texas Instruments to deliver exceptional quality and innovation, providing you with the best solutions for your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides excellent protection for the power management IC, ensuring durability and reliability.

Surface Mount: YES

With surface mount capability, this power management IC can be easily mounted onto circuit boards, saving space and simplifying the production process.

No. of Functions: 1

This power management IC offers a single function, providing efficiency and simplicity in power management applications.

Package Shape: SQUARE

The square package shape allows for efficient utilization of space on circuit boards, making it ideal for compact designs.

Nominal Supply Voltage (Vsup): 3.3 V

With a nominal supply voltage of 3.3V, this power management IC is compatible with a wide range of devices, making it a versatile choice.

No. of Terminals: 64

With 64 terminals, this power management IC provides sufficient connectivity options for various power management tasks.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The chip carrier, heat sink/slug, and very thin profile package style enables efficient heat dissipation and perfect for space-constrained applications.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this power management IC can withstand harsh operating conditions, ensuring reliable performance in demanding environments.

Minimum Operating Temperature: -40 °C

The ability to operate in temperatures as low as -40°C makes this power management IC suitable for a wide range of environments, including extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish offers exceptional corrosion resistance and superior solderability, improving the overall reliability and lifespan of the product.

Terminal Position: QUAD

The quad terminal position simplifies the installation process, offering ease of use and enhanced connectivity.

Maximum Seated Height: 1 mm

With a maximum seated height of 1mm, this power management IC is suitable for compact designs where space is limited.

Width (mm): 9 mm

Measuring 9mm in width, this power management IC can be easily integrated into various electronic devices without occupying excessive space.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

Representing the power supply management circuit IC type, this product is specifically designed to efficiently manage power supply, making it ideal for power-sensitive applications.

Minimum Supply Voltage (Vsup): 3 V

The minimum supply voltage of 3V ensures compatibility with a wide range of power sources, providing flexibility in power management design.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, this power management IC simplifies assembly processes while reducing the risk of damage.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures efficient soldering during manufacturing, guaranteeing reliable connections.

Length: 9 mm

Measuring 9mm in length, this power management IC offers a compact form factor suitable for various electronic devices.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive-grade standards, this power management IC is capable of withstanding the demanding temperature and environmental conditions of automotive applications.

No. of Channels: 1

With one channel, this power management IC provides an effective solution for single-channel power management requirements.

Terminal Form: NO LEAD

The no-lead terminal form enhances reliability and simplifies the manufacturing process by eliminating the need for lead-based solder.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch allows for precise connections, making this power management IC suitable for high-density and fine-pitch applications.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this power management IC possesses moderate resistance to moisture, ensuring its longevity and performance.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage of 3.6V provides compatibility with a wide range of power sources, making this power management IC versatile in power management applications.

Adjustable Threshold: YES

The ability to adjust the threshold allows for customization and fine-tuning, providing flexibility in power management settings.

Technical Specifications

Power Management ICs UCD90160ARGCR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

9 mm

Trade Compliance

UCD90160ARGCR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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