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UCD90124RGCR

Texas Instruments

UCD90124RGCR by Texas Instruments

UCD90124RGCR by Texas Instruments is a Power Management IC with 64 terminals, operating temperature range of -40 to 125 °C. It has a supply voltage range of 3-3.6 V and is suitable for automotive applications due to its compact size and adjustable threshold feature.

Median Price

$12.436

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,500 parts In-Stock

1+ parts

$11.934

100+ parts

$10.424

1k+ parts

$7.189

10k+ parts

-

3,500

$11.934

$10.424

$7.189

-

Rochester

USA . 1,374 parts In-Stock

1+ parts

-

100+ parts

$10.350

1k+ parts

$9.260

10k+ parts

$8.710

1,374

-

$10.350

$9.260

$8.710

DigiKey

USA . 1,374 parts In-Stock

1+ parts

-

100+ parts

$13.610

1k+ parts

-

10k+ parts

-

1,374

-

$13.610

-

-

Verical

USA . 1,374 parts In-Stock

1+ parts

-

100+ parts

$12.938

1k+ parts

$11.575

10k+ parts

$10.887

1,374

-

$12.938

$11.575

$10.887

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$7.189

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$7.189

-

-

-

Digiode

USA . 1,522 parts In-Stock

1+ parts

$9.481

100+ parts

-

1k+ parts

-

10k+ parts

-

1,522

$9.481

-

-

-

Vyrian

USA . 2,014 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,014

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 337 parts In-Stock

1+ parts

$7.189

100+ parts

-

1k+ parts

-

10k+ parts

-

337

$7.189

-

-

-

Continental Prestige Electronics

USA . 6,014 parts In-Stock

1+ parts

$7.189

100+ parts

-

1k+ parts

-

10k+ parts

$7.045

6,014

$7.189

-

-

$7.045

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$7.189

100+ parts

-

1k+ parts

$6.830

10k+ parts

$6.686

2,000

$7.189

-

$6.830

$6.686

Semicontronic

India . 1,774 parts In-Stock

1+ parts

$8.480

100+ parts

$8.268

1k+ parts

$8.226

10k+ parts

-

1,774

$8.480

$8.268

$8.226

-

Ampacity Inc.

Singapore . 1,762 parts In-Stock

1+ parts

$8.480

100+ parts

-

1k+ parts

-

10k+ parts

-

1,762

$8.480

-

-

-

Corphita

USA . 2,700 parts In-Stock

1+ parts

$8.982

100+ parts

-

1k+ parts

-

10k+ parts

-

2,700

$8.982

-

-

-

Parana Technologies

USA . 345 parts In-Stock

1+ parts

$9.594

100+ parts

$890.967

1k+ parts

$8.635

10k+ parts

-

345

$9.594

$890.967

$8.635

-

DigiPath Technology Company

USA . 1,484 parts In-Stock

1+ parts

$10.564

100+ parts

-

1k+ parts

-

10k+ parts

-

1,484

$10.564

-

-

-

ChromeModa Solutions

Germany . 3,472 parts In-Stock

1+ parts

$10.780

100+ parts

$8.840

1k+ parts

-

10k+ parts

-

3,472

$10.780

$8.840

-

-

IDEA Electronic Components Group

UK . 17 parts In-Stock

1+ parts

$10.780

100+ parts

$10.241

1k+ parts

$9.702

10k+ parts

-

17

$10.780

$10.241

$9.702

-

QUARKTWIN TECHNOLOGY LTD

USA . 15,914 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

15,914

-

-

-

-

Argo Parts USA

USA . 2,458 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,458

-

-

-

-

Overview

Enhance your power management solutions with the UCD90124RGCR from Texas Instruments. Known for their superior quality and innovative technology, Texas Instruments delivers reliable products that meet the demands of various applications in the Power Management ICs category. This versatile chip carrier with a very thin profile offers customers the value of adjustable thresholds, high reliability, and efficient performance in automotive environments. Trust Texas Instruments to provide the advantages and benefits you need for your power supply management circuit needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Using plastic/epoxy as the package body material helps in reducing the overall weight of the product, making it more suitable for portable applications.

Surface Mount: YES

Surface mount capability makes the installation process easier and more efficient, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 3.3 V

The nominal supply voltage of 3.3V ensures compatibility with a wide range of electronic devices, making it a versatile power management IC.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this power management IC can withstand harsh environmental conditions, ensuring reliability and longevity.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C makes this IC suitable for use in a variety of temperature conditions, including extreme cold environments.

Maximum Seated Height: 1 mm

The low maximum seated height of 1mm allows for a compact and slim design, making it ideal for applications where space is limited.

Temperature Grade: AUTOMOTIVE

Being automotive-grade ensures that this power management IC meets the stringent quality and reliability standards required for automotive applications.

Moisture Sensitivity Level (MSL): 3

With an MSL level of 3, this IC is less susceptible to moisture-related damage during storage and handling, improving its overall reliability.

Technical Specifications

Power Management ICs UCD90124RGCR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

9 mm

Trade Compliance

UCD90124RGCR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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