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UCC2919DG4

Texas Instruments

UCC2919DG4 by Texas Instruments

UCC2919DG4 by Texas Instruments is a Power Management IC with 16 terminals, operating at -40 to 85°C. It has a supply voltage range of 3-8V and supports power supplies up to 5V. This BICMOS technology IC is ideal for industrial applications requiring adjustable threshold power supply support circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,720 parts In-Stock

1+ parts

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7,720

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Digiode

USA . 4,812 parts In-Stock

1+ parts

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4,812

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 556 parts In-Stock

1+ parts

$0.500

100+ parts

-

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556

$0.500

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Semicontronic

India . 819 parts In-Stock

1+ parts

$2.500

100+ parts

$2.438

1k+ parts

$2.425

10k+ parts

-

819

$2.500

$2.438

$2.425

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One Stop Electronics

USA . 378 parts In-Stock

1+ parts

$2.500

100+ parts

-

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378

$2.500

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AZTECH Wire

Italy . 244 parts In-Stock

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$18.132

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244

$18.132

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Parana Technologies

USA . 2,234 parts In-Stock

1+ parts

$18.731

100+ parts

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$18.823

10k+ parts

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2,234

$18.731

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$18.823

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DigiPath Technology Company

USA . 1,746 parts In-Stock

1+ parts

$20.625

100+ parts

$18.975

1k+ parts

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1,746

$20.625

$18.975

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IDEA Electronic Components Group

UK . 1,620 parts In-Stock

1+ parts

$21.046

100+ parts

$19.994

1k+ parts

$18.941

10k+ parts

-

1,620

$21.046

$19.994

$18.941

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ChromeModa Solutions

Germany . 785 parts In-Stock

1+ parts

$21.046

100+ parts

$17.258

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785

$21.046

$17.258

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Component Stockers USA

USA . 674 parts In-Stock

1+ parts

$99.990

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674

$99.990

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Corphita

USA . 1,679 parts In-Stock

1+ parts

-

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1,679

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Corohmni

South Africa . 413 parts In-Stock

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413

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Microchip USA

USA . 260 parts In-Stock

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260

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Overview

Enhance the efficiency and reliability of your power management systems with the UCC2919DG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Power Management ICs that are perfect for a wide range of applications. With its small outline package style and adjustable threshold feature, this product offers unmatched value and versatility to customers. Trust Texas Instruments to provide innovative solutions that will elevate your power management capabilities to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and reliable, ensuring the product can withstand various environmental conditions.

Nominal Supply Voltage (Vsup): 5 V

A common and widely compatible supply voltage, making it suitable for a wide range of applications.

Maximum Operating Temperature: 85 °C

Can operate efficiently even in high-temperature environments, increasing the product's reliability.

Technology: BICMOS

Utilizing BiCMOS technology provides a good balance between low power consumption and high-speed operation.

Adjustable Threshold: YES

Allows for flexibility in setting thresholds, making it customizable for different use cases.

Technical Specifications

Power Management ICs UCC2919DG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

1.5 mA

Maximum Supply Voltage (Vsup):

8 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

UCC2919DG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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