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UCC2946DTRG4

Texas Instruments

UCC2946DTRG4 by Texas Instruments

UCC2946DTRG4 by Texas Instruments is a Power Management IC with 8 terminals, operating voltage of 2.5/5V, and adjustable threshold at +1.235V. It is used in power supply management circuits for industrial applications, featuring a small outline package shape and surface mount capability for compact designs. With a wide temperature range from -40 to 85°C, it offers reliable performance in various environments.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Chip Stock

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USA . 5,453 parts In-Stock

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USA . 2,422 parts In-Stock

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Nova Conductors

Japan . 95 parts In-Stock

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Corohmni

South Africa . 38 parts In-Stock

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$3.274

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Ampacity Inc.

Singapore . 654 parts In-Stock

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$6.500

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One Stop Electronics

USA . 527 parts In-Stock

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AZTECH Wire

Italy . 581 parts In-Stock

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Parana Technologies

USA . 974 parts In-Stock

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$14.804

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$15.233

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DigiPath Technology Company

USA . 1,202 parts In-Stock

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$16.301

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ChromeModa Solutions

Germany . 2,423 parts In-Stock

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IDEA Electronic Components Group

UK . 366 parts In-Stock

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Component Stockers USA

USA . 727 parts In-Stock

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Continental Prestige Electronics

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Microchip USA

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Overview

Enhance your power management solutions with the UCC2946DTRG4 by Texas Instruments. Crafted with precision and expertise, this Power Management IC offers unparalleled quality and reliability. Ideal for industrial applications, this small outline package delivers a wide operating temperature range and minimal supply voltage requirements. Trust in Texas Instruments to provide cutting-edge technology that maximizes efficiency and performance. Upgrade your power supply management circuit with the UCC2946DTRG4 and experience the difference.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the IC.

Surface Mount: YES

Allows for easy installation on PCBs, saving time and effort during assembly.

Power Supplies (V): 2.5/5

Offers flexibility in power supply options, catering to a wider range of applications.

No. of Terminals: 8

Sufficient number of terminals for connectivity and functionality.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Functions reliably in low-temperature conditions, ensuring consistent performance.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Provides excellent conductivity and prevents corrosion for long-term use.

Width (mm): 3.9 mm

Compact size saves space on the PCB and allows for efficient layout designs.

Minimum Supply Voltage (Vsup): 2.1 V

Operates efficiently even at low supply voltages, maximizing power utilization.

Terminal Form: GULL WING

Enables secure soldering and strong mechanical connection during assembly.

Maximum Supply Voltage (Vsup): 5.5 V

Can handle high supply voltages without risk of damage, ensuring reliability.

Adjustable Threshold: YES

Allows for customizing threshold voltage as per application requirements, enhancing flexibility.

Technical Specifications

Power Management ICs UCC2946DTRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 1.235V

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.018 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.1 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+1.235V

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3.9 mm

Trade Compliance

UCC2946DTRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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