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UCC2946PWTRG4

Texas Instruments

UCC2946PWTRG4 by Texas Instruments

UCC2946PWTRG4 by Texas Instruments is a Power Management IC with 2.5/5V power supplies, 8 terminals, and BICMOS technology. It is used in industrial applications for power supply management circuits due to its adjustable threshold voltage and small outline package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 4,507 parts In-Stock

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Digiode

USA . 2,579 parts In-Stock

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Nova Conductors

Japan . 650 parts In-Stock

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650

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One Stop Electronics

USA . 610 parts In-Stock

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$3.500

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610

$3.500

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Semicontronic

India . 948 parts In-Stock

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$5.500

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$5.362

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$5.335

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948

$5.500

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$5.335

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Ampacity Inc.

Singapore . 324 parts In-Stock

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$6.500

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$6.500

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Parana Technologies

USA . 2,126 parts In-Stock

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$9.406

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$10.022

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$9.406

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DigiPath Technology Company

USA . 673 parts In-Stock

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$10.357

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$9.528

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$9.528

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ChromeModa Solutions

Germany . 4,573 parts In-Stock

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$10.568

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$8.666

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IDEA Electronic Components Group

UK . 545 parts In-Stock

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$10.568

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$10.040

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$9.511

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545

$10.568

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AZTECH Wire

Italy . 630 parts In-Stock

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$15.959

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Corohmni

South Africa . 978 parts In-Stock

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Kepictronics

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A-Z Elektronik GmbH

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Argo Parts USA

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Continental Prestige Electronics

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Corphita

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Microchip USA

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Bastille Electronics

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Overview

Get ready to experience superior power management with the UCC2946PWTRG4 by Texas Instruments. This cutting-edge Power Management IC boasts top-notch quality and reliability that Texas Instruments is known for. Ideal for a wide range of applications, this product offers unmatched value and benefits to customers looking for efficient and reliable power supply management solutions. Say goodbye to power issues and hello to seamless performance with the UCC2946PWTRG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product durable and lightweight, ideal for various applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation, saving time and space in circuit design.

Package Shape: RECTANGULAR

The rectangular shape of the package provides a compact and space-saving design for better integration in electronic devices.

Power Supplies (V): 2.5/5

With multiple power supply options of 2.5V and 5V, this product offers flexibility and compatibility with different systems.

No. of Terminals: 8

The eight terminals provide ample connections for power and data transmission, enhancing the versatility of this product.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style ensures efficient heat dissipation and optimal performance in compact designs.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C allows for stable and reliable operation even in harsh environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures the product can function effectively in extreme cold conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel, palladium, and gold terminal finish provides excellent conductivity and corrosion resistance for long-lasting performance.

Terminal Position: DUAL

The dual terminal position allows for easy and secure connections, ensuring stable power distribution in the system.

Maximum Seated Height: 1.2 mm

The low maximum seated height of 1.2mm makes this product suitable for compact designs with limited space constraints.

Width (mm): 3 mm

The narrow width of 3mm enables easy integration into tight spaces and densely packed circuit boards.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

With power supply management circuit capability, this product offers enhanced control and efficiency in power distribution applications.

Minimum Supply Voltage (Vsup): 2.1 V

The low minimum supply voltage requirement of 2.1V enables operation in low power scenarios, conserving energy and extending battery life.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance of 260°C ensures reliable solder connections during assembly and maintenance processes.

Length: 4.4 mm

The compact length of 4.4mm makes this product suitable for tight layouts and space-constrained applications.

Nominal Threshold Voltage (V): +1.235V

The precise nominal threshold voltage of +1.235V ensures accurate voltage detection and regulation, critical for proper device performance.

Temperature Grade: INDUSTRIAL

The industrial temperature grade certification guarantees reliable operation in rugged industrial environments, making this product suitable for a wide range of applications.

Maximum Supply Current (Isup): 0.018 mA

The low maximum supply current of 0.018mA minimizes power consumption, making this product energy-efficient and cost-effective.

Technology: BICMOS

The BICMOS technology combines the advantages of both bipolar and CMOS technologies, offering high-speed operation and low power consumption.

Terminal Form: GULL WING

The gull wing terminal form provides secure connections and easy soldering, ensuring reliable performance in various operating conditions.

Terminal Pitch: 0.65 mm

The narrow terminal pitch of 0.65mm allows for high-density mounting and space-saving designs in electronic circuits.

Moisture Sensitivity Level (MSL): 2

The moisture sensitivity level of 2 indicates that this product is suitable for reflow soldering processes, ensuring proper device functionality and longevity.

Maximum Supply Voltage (Vsup): 5.5 V

With a high maximum supply voltage of 5.5V, this product can accommodate a wide range of power sources and voltage requirements.

Adjustable Threshold: YES

The ability to adjust the threshold voltage offers customizable settings for specific applications, providing greater flexibility and control.

Technical Specifications

Power Management ICs UCC2946PWTRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 1.235V

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.4 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.018 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.1 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+1.235V

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3 mm

Trade Compliance

UCC2946PWTRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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