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UCC29002DG4

Texas Instruments

UCC29002DG4 by Texas Instruments

UCC29002DG4 by Texas Instruments is a Power Management IC with 12V nominal voltage, 2.5A max output current, and BUCK-BOOST switcher config. It is used in industrial applications for power supply support circuits due to its current-mode control mode and adjustable threshold feature.

Median Price

$2.210

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 27 parts In-Stock

1+ parts

$2.210

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27

$2.210

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Vyrian

USA . 6,361 parts In-Stock

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6,361

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Digiode

USA . 306 parts In-Stock

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306

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 2,948 parts In-Stock

1+ parts

$2.210

100+ parts

-

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2,948

$2.210

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$2.210

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2,000

$2.210

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Continental Prestige Electronics

USA . 1,882 parts In-Stock

1+ parts

$2.210

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$2.166

1,882

$2.210

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$2.166

Corohmni

South Africa . 189 parts In-Stock

1+ parts

$2.674

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189

$2.674

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Ampacity Inc.

Singapore . 1,406 parts In-Stock

1+ parts

$3.500

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1,406

$3.500

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One Stop Electronics

USA . 197 parts In-Stock

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$4.500

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197

$4.500

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Parana Technologies

USA . 979 parts In-Stock

1+ parts

$6.821

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$7.460

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979

$6.821

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$7.460

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Semicontronic

India . 1,039 parts In-Stock

1+ parts

$7.500

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$7.312

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$7.275

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1,039

$7.500

$7.312

$7.275

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IDEA Electronic Components Group

UK . 1,708 parts In-Stock

1+ parts

$7.664

100+ parts

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1k+ parts

$6.898

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1,708

$7.664

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$6.898

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ChromeModa Solutions

Germany . 610 parts In-Stock

1+ parts

$7.664

100+ parts

$6.284

1k+ parts

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610

$7.664

$6.284

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AZTECH Wire

Italy . 316 parts In-Stock

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$11.408

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316

$11.408

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Microchip USA

USA . 3,435 parts In-Stock

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3,435

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Corphita

USA . 2,152 parts In-Stock

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2,152

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DigiPath Technology Company

USA . 1,385 parts In-Stock

1+ parts

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100+ parts

$6.910

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1,385

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$6.910

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Overview

Enhance your power management solutions with the UCC29002DG4 by Texas Instruments. As a trusted manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability. The UCC29002DG4 falls under the Power Management ICs category, offering versatile applications and exceptional performance. With a nominal supply voltage of 12V and a maximum output current of 2.5A, this compact and efficient IC is designed to meet your power supply circuit needs with ease. Experience the value and benefits this product brings to your projects, ensuring optimal functionality and seamless operation every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight yet durable, ideal for portable devices.

Surface Mount: YES

With surface mount capability, this IC can be easily integrated into compact PCB designs for space-saving applications.

Nominal Supply Voltage (Vsup): 12 V

Operates efficiently at a nominal supply voltage of 12V, suitable for a wide range of electronic systems.

Power Supplies (V): 12

Supports power supplies up to 12V, providing reliable power management for various devices.

No. of Terminals: 8

Eight terminals allow for versatile connectivity options, enhancing the flexibility of this power management IC.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves PCB space and enhances thermal performance for efficient power management.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature of 105°C, this IC can withstand heat-intensive environments.

Control Mode: CURRENT-MODE

The current-mode control ensures precise regulation of output current, improving overall power efficiency.

Minimum Operating Temperature: -40 °C

Functions reliably even in extremely cold temperatures down to -40°C, making it suitable for harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish of nickel palladium gold provides excellent conductivity and corrosion resistance for long-term reliability.

Maximum Seated Height: 1.75 mm

The low seated height allows for a compact design, ideal for slim devices with space constraints.

Width (mm): 3.9 mm

The narrow width of 3.9mm enables easy integration into tight layouts, optimizing PCB space usage.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

As a power supply support circuit, this IC enhances the stability and efficiency of the overall power management system.

Minimum Supply Voltage (Vsup): 4.375 V

Can function effectively even at low supply voltages of 4.375V, ensuring consistent performance in various operating conditions.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for up to 30 seconds, facilitating smooth soldering processes during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C allows for reliable soldering and prevents damage to the IC during manufacturing.

Length: 4.9 mm

The moderate length of 4.9mm strikes a balance between compactness and accessibility, suitable for various PCB layouts.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature ranges, ensuring reliable operation in demanding environments.

Maximum Supply Current (Isup): 3.5 mA

The maximum supply current of 3.5mA guarantees stable power delivery without exceeding the specified limit.

Maximum Output Current: 2.5 A

Capable of handling high output currents of up to 2.5A, making it suitable for powering a wide range of electronic devices.

Technology: BICMOS

Utilizes Bipolar-CMOS technology for efficient power management and signal processing, ensuring optimum performance.

Terminal Form: GULL WING

The gull wing terminal form simplifies the soldering process for easy assembly on the PCB.

Switcher Config: BUCK-BOOST

Features a buck-boost switcher configuration for versatile voltage regulation, catering to different power supply requirements.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27mm, this IC offers precise and secure connections for seamless integration into the circuit.

Maximum Supply Voltage (Vsup): 13.5 V

Can handle supply voltages up to 13.5V, accommodating a wide range of power sources for enhanced compatibility.

Adjustable Threshold: YES

The adjustable threshold feature allows for customization of trigger points, enabling fine-tuning of the power management parameters.

Technical Specifications

Power Management ICs UCC29002DG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

Control Mode:

CURRENT-MODE

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

2.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

3.5 mA

Maximum Supply Voltage (Vsup):

13.5 V

Minimum Supply Voltage (Vsup):

4.375 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Switcher Config:

BUCK-BOOST

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

UCC29002DG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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