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UCC29002DGK/1

Texas Instruments

UCC29002DGK/1 by Texas Instruments

UCC29002DGK/1 by Texas Instruments is a Power Management IC with 12V nominal voltage and 3.5mA max supply current. It features a small outline package, suitable for industrial applications requiring power supply support circuits. With a wide operating temperature range (-40 to 105°C) and adjustable threshold, it is ideal for various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,765 parts In-Stock

1+ parts

-

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2,765

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Digiode

USA . 1,712 parts In-Stock

1+ parts

-

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1,712

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,943 parts In-Stock

1+ parts

$2.531

100+ parts

$235.057

1k+ parts

$2.278

10k+ parts

-

1,943

$2.531

$235.057

$2.278

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DigiPath Technology Company

USA . 397 parts In-Stock

1+ parts

$2.787

100+ parts

$2.564

1k+ parts

-

10k+ parts

-

397

$2.787

$2.564

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ChromeModa Solutions

Germany . 2,941 parts In-Stock

1+ parts

$2.844

100+ parts

$2.332

1k+ parts

-

10k+ parts

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2,941

$2.844

$2.332

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IDEA Electronic Components Group

UK . 1,036 parts In-Stock

1+ parts

$2.844

100+ parts

-

1k+ parts

$2.560

10k+ parts

-

1,036

$2.844

-

$2.560

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One Stop Electronics

USA . 1,432 parts In-Stock

1+ parts

$4.500

100+ parts

-

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10k+ parts

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1,432

$4.500

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Semicontronic

India . 816 parts In-Stock

1+ parts

$7.500

100+ parts

$7.312

1k+ parts

$7.275

10k+ parts

-

816

$7.500

$7.312

$7.275

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Ampacity Inc.

Singapore . 325 parts In-Stock

1+ parts

$7.500

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325

$7.500

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AZTECH Wire

Italy . 197 parts In-Stock

1+ parts

$8.521

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197

$8.521

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Corphita

USA . 2,760 parts In-Stock

1+ parts

-

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2,760

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Corohmni

South Africa . 144 parts In-Stock

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144

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Overview

Enhance the performance of your power management system with the UCC29002DGK/1 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability in their power management ICs. Ideal for a wide range of applications, this small outline, thin profile IC offers customers the value of efficient power supply support circuitry. With adjustable thresholds and industrial-grade temperature capabilities, this product provides the benefits of precise control and optimal functionality. Upgrade your power management system today with the UCC29002DGK/1 to experience enhanced performance and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, durable, and cost-effective, making the product suitable for various applications.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and labor cost.

Nominal Supply Voltage (Vsup): 12 V

Provides a stable power supply for connected devices, ensuring reliable performance.

Maximum Operating Temperature: 105 °C

Can operate in high-temperature environments, increasing the product's versatility.

Technology: BICMOS

Combines the advantages of bipolar and CMOS technologies, offering high efficiency and performance.

Technical Specifications

Power Management ICs UCC29002DGK/1 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PDSO-G8

Length:

3 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

3.5 mA

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

3 mm

Trade Compliance

UCC29002DGK/1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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