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UCC29002DGKG4

Texas Instruments

UCC29002DGKG4 by Texas Instruments

UCC29002DGKG4 by Texas Instruments is a Power Management IC with 12V nominal voltage, 8 terminals, and 3.5mA max supply current. It is used in industrial applications for power supply support circuits due to its BICMOS technology and adjustable threshold feature.

Median Price

$1.490

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 26 parts In-Stock

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$1.490

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26

$1.490

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Vyrian

USA . 8,658 parts In-Stock

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8,658

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Digiode

USA . 1,749 parts In-Stock

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1,749

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Distributors (Availability)

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Continental Prestige Electronics

USA . 5,264 parts In-Stock

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$1.490

100+ parts

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$1.460

5,264

$1.490

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$1.460

Netroflash

USA . 500 parts In-Stock

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$1.490

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-

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$1.416

10k+ parts

$1.386

500

$1.490

-

$1.416

$1.386

Argo Parts USA

USA . 167 parts In-Stock

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$1.490

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167

$1.490

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One Stop Electronics

USA . 1,078 parts In-Stock

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$1.500

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1,078

$1.500

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Semicontronic

India . 645 parts In-Stock

1+ parts

$4.500

100+ parts

$4.388

1k+ parts

$4.365

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645

$4.500

$4.388

$4.365

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Ampacity Inc.

Singapore . 432 parts In-Stock

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$4.500

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432

$4.500

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Corohmni

South Africa . 244 parts In-Stock

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$6.319

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244

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AZTECH Wire

Italy . 262 parts In-Stock

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$11.776

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Parana Technologies

USA . 1,230 parts In-Stock

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$17.764

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$17.945

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$17.764

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$17.945

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DigiPath Technology Company

USA . 1,281 parts In-Stock

1+ parts

$19.561

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$17.996

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1,281

$19.561

$17.996

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ChromeModa Solutions

Germany . 5,799 parts In-Stock

1+ parts

$19.960

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$16.367

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5,799

$19.960

$16.367

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IDEA Electronic Components Group

UK . 2,005 parts In-Stock

1+ parts

$19.960

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$18.962

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$17.964

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2,005

$19.960

$18.962

$17.964

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QUARKTWIN TECHNOLOGY LTD

USA . 9,334 parts In-Stock

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Corphita

USA . 4,671 parts In-Stock

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4,671

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Perfect Parts

USA . 34 parts In-Stock

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34

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Overview

Power up your designs with the UCC29002DGKG4 by Texas Instruments, a top-tier Power Management IC that guarantees quality and reliability. Manufactured using advanced BICMOS technology, this device offers adjustable threshold levels and a nominal supply voltage of 12V, making it perfect for a wide range of industrial applications. With its compact design and low supply current, the UCC29002DGKG4 ensures efficient power management while maximizing performance. Trust Texas Instruments to deliver cutting-edge solutions for all your power supply support circuit needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for long-term use.

Surface Mount: YES

Easily mountable on a PCB, saving space and simplifying assembly.

Nominal Supply Voltage (Vsup): 12 V

Compatible with 12V power supplies, making it suitable for various applications.

Maximum Operating Temperature: 105 °C

Can operate in higher temperatures, ensuring stable performance in challenging environments.

Technology: BICMOS

Utilizes BiCMOS technology for efficient power management and high-speed operation.

Adjustable Threshold: YES

Allows customization of threshold levels for precise power management settings.

Technical Specifications

Power Management ICs UCC29002DGKG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

3.5 mA

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

UCC29002DGKG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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