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UC3544DWTRG4

Texas Instruments

UC3544DWTRG4 by Texas Instruments

UC3544DWTRG4 by Texas Instruments is a Power Management IC with 18 terminals in a small outline package. It operates b/w 0-70°C, with power supplies ranging from 4.5V to 40V. This bipolar technology device features adjustable threshold and is ideal for commercial applications requiring precise power management.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,883 parts In-Stock

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Digiode

USA . 679 parts In-Stock

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679

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,478 parts In-Stock

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$3.500

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1,478

$3.500

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Parana Technologies

USA . 2,230 parts In-Stock

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$4.918

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$5.449

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2,230

$4.918

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$5.449

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DigiPath Technology Company

USA . 928 parts In-Stock

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$5.415

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$4.982

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928

$5.415

$4.982

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One Stop Electronics

USA . 1,180 parts In-Stock

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$5.500

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1,180

$5.500

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ChromeModa Solutions

Germany . 4,818 parts In-Stock

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$5.526

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$4.531

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$5.526

$4.531

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IDEA Electronic Components Group

UK . 1,682 parts In-Stock

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$5.526

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$4.973

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1,682

$5.526

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$4.973

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Semicontronic

India . 131 parts In-Stock

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$6.500

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$6.338

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$6.305

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131

$6.500

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$6.305

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AZTECH Wire

Italy . 549 parts In-Stock

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$12.115

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549

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Corphita

USA . 4,971 parts In-Stock

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Corohmni

South Africa . 112 parts In-Stock

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Overview

Elevate your power management solutions with the UC3544DWTRG4 by Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers top-notch Power Management ICs that meet the demands of various applications. The UC3544DWTRG4 offers unmatched value with its adjustable threshold feature, ensuring optimal performance tailored to your specific needs. Whether you're in the automotive, industrial, or consumer electronics industry, this product provides the advantages you need to stay ahead of the competition. Choose Texas Instruments for cutting-edge technology and exceptional results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and resistance to environmental factors, making the product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving on PCBs, making it convenient for compact electronic designs.

Power Supplies (V): 4.5/40

Wide range of power supply voltage (4.5V to 40V) allows the product to be compatible with various types of electronic devices and applications.

No. of Terminals: 18

Having 18 terminals enables the product to provide multiple connectivity options, increasing flexibility in circuit design.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the product can perform reliably even under demanding operating conditions.

Minimum Operating Temperature: 0 °C

Ability to operate at low temperatures down to 0°C makes the product suitable for use in various environments and applications.

Maximum Supply Current (Isup): 15 mA

Having a maximum supply current of 15mA ensures efficient power consumption and prevents the risk of overloading the circuit.

Technology: BIPOLAR

Bipolar technology offers high performance and precise control over power management functions, enhancing the overall efficiency of the product.

Adjustable Threshold: YES

The ability to adjust the threshold allows for customization and fine-tuning of power management settings, catering to different requirements and applications.

Technical Specifications

Power Management ICs UC3544DWTRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G18

No. of Terminals:

18

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP18,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

4.5/40

Qualification:

Not Qualified

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

15 mA

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

UC3544DWTRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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