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UC3544NG4

Texas Instruments

UC3544NG4 by Texas Instruments

UC3544NG4 by Texas Instruments is a Power Management IC with 18 terminals, operating b/w 0-70°C. It supports supply voltages from 4.7V to 40V and has a max supply current of 15mA. Ideal for power supply support circuits in various applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,724 parts In-Stock

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3,724

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Digiode

USA . 1,548 parts In-Stock

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1,548

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One Stop Electronics

USA . 1,009 parts In-Stock

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$3.500

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$3.500

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AZTECH Wire

Italy . 304 parts In-Stock

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$5.101

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304

$5.101

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Semicontronic

India . 915 parts In-Stock

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$6.500

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$6.338

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$6.305

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915

$6.500

$6.338

$6.305

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Ampacity Inc.

Singapore . 1,186 parts In-Stock

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$7.500

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1,186

$7.500

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Parana Technologies

USA . 1,178 parts In-Stock

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$15.668

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$16.038

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1,178

$15.668

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$16.038

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DigiPath Technology Company

USA . 1,737 parts In-Stock

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$17.253

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1,737

$17.253

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ChromeModa Solutions

Germany . 6,998 parts In-Stock

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$17.605

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$14.436

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$17.605

$14.436

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IDEA Electronic Components Group

UK . 1,661 parts In-Stock

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$17.605

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$16.725

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$15.844

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1,661

$17.605

$16.725

$15.844

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Microchip USA

USA . 5,813 parts In-Stock

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Corphita

USA . 1,850 parts In-Stock

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Perfect Parts

USA . 560 parts In-Stock

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Corohmni

South Africa . 497 parts In-Stock

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Overview

Unlock the power of efficient energy management with the Texas Instruments UC3544NG4 Power Management IC. Crafted by a renowned manufacturer, this sleek rectangular package houses cutting-edge technology to optimize power supplies in various applications. With a wide voltage range and commercial-grade temperature tolerance, this IC delivers reliable performance to meet your power supply support circuit needs. Experience peace of mind knowing that your devices are powered efficiently and effectively with the UC3544NG4 from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material helps in reducing the overall weight of the product, making it more portable and easy to handle.

Nominal Supply Voltage (Vsup): 10 V

Stable nominal supply voltage ensures consistent performance and reliability of the product.

Power Supplies (V): 4.5/40

Wide range of power supplies supported makes this product versatile and compatible with various systems.

Maximum Operating Temperature: 70 °C

High maximum operating temperature allows for reliable operation even in demanding environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency of the product.

Technical Specifications

Power Management ICs UC3544NG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDIP-T18

JESD-609 Code:

e4

Length:

22.48 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

18

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP18,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

4.5/40

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

15 mA

Maximum Supply Voltage (Vsup):

40 V

Minimum Supply Voltage (Vsup):

4.7 V

Nominal Supply Voltage (Vsup):

10 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

UC3544NG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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