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UC3544DWG4

Texas Instruments

UC3544DWG4 by Texas Instruments

UC3544DWG4 by Texas Instruments is a Power Management IC with 18 terminals in a small outline package. It operates b/w 0-70°C, supporting supply voltages from 4.7V to 40V, making it ideal for power supply support circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,202 parts In-Stock

1+ parts

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5,202

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Digiode

USA . 4,869 parts In-Stock

1+ parts

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4,869

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,520 parts In-Stock

1+ parts

$1.500

100+ parts

$1.462

1k+ parts

$1.455

10k+ parts

-

1,520

$1.500

$1.462

$1.455

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One Stop Electronics

USA . 771 parts In-Stock

1+ parts

$4.500

100+ parts

-

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771

$4.500

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Parana Technologies

USA . 126 parts In-Stock

1+ parts

$11.242

100+ parts

-

1k+ parts

$11.678

10k+ parts

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126

$11.242

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$11.678

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DigiPath Technology Company

USA . 1,985 parts In-Stock

1+ parts

$12.378

100+ parts

$11.388

1k+ parts

-

10k+ parts

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1,985

$12.378

$11.388

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ChromeModa Solutions

Germany . 4,612 parts In-Stock

1+ parts

$12.631

100+ parts

$10.357

1k+ parts

-

10k+ parts

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4,612

$12.631

$10.357

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IDEA Electronic Components Group

UK . 527 parts In-Stock

1+ parts

$12.631

100+ parts

$11.999

1k+ parts

$11.368

10k+ parts

-

527

$12.631

$11.999

$11.368

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AZTECH Wire

Italy . 397 parts In-Stock

1+ parts

$16.846

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397

$16.846

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Corphita

USA . 4,907 parts In-Stock

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4,907

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Corohmni

South Africa . 416 parts In-Stock

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416

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Overview

Enhance your power management solutions with the UC3544DWG4 by Texas Instruments. Known for their high-quality products, Texas Instruments delivers top-notch Power Management ICs like no other. With a wide range of applications in various industries, this small outline package offers customers exceptional value and benefits. Say goodbye to power supply issues with the reliable performance and efficiency of the UC3544DWG4. Upgrade your systems today and experience the advantages that Texas Instruments brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package durable and lightweight, ideal for portable electronic devices.

Surface Mount: YES

Surface mount technology allows for easy and efficient soldering onto circuit boards, saving space and reducing assembly time.

Nominal Supply Voltage (Vsup): 10 V

Operating at a nominal supply voltage of 10V provides a stable power source for the device, ensuring reliable performance.

No. of Terminals: 18

Having 18 terminals allows for multiple connections and functionality, making it versatile for various power management applications.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this power management IC can withstand high-temperature environments and maintain functionality.

Minimum Operating Temperature: 0 °C

Operating at a minimum temperature of 0°C ensures reliability even in cold climates or environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the IC efficient and reliable for power management tasks.

Maximum Supply Voltage (Vsup): 40 V

With a maximum supply voltage of 40V, this power management IC can handle a wide range of input voltages, suitable for various applications.

Technical Specifications

Power Management ICs UC3544DWG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G18

Length:

11.55 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

18

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP18,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

4.5/40

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

15 mA

Maximum Supply Voltage (Vsup):

40 V

Minimum Supply Voltage (Vsup):

4.7 V

Nominal Supply Voltage (Vsup):

10 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

7.5 mm

Trade Compliance

UC3544DWG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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