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UC3543DWTRG4

Texas Instruments

UC3543DWTRG4 by Texas Instruments

UC3543DWTRG4 by Texas Instruments is a Power Management IC with 16 terminals in a small outline package. It operates b/w 0-70°C, with power supplies ranging from 4.5V to 40V. This IC is ideal for commercial applications requiring adjustable threshold and low supply current of 15mA.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,028 parts In-Stock

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8,028

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Digiode

USA . 911 parts In-Stock

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911

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Semicontronic

India . 913 parts In-Stock

1+ parts

$3.500

100+ parts

$3.412

1k+ parts

$3.395

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913

$3.500

$3.412

$3.395

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One Stop Electronics

USA . 733 parts In-Stock

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$5.500

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733

$5.500

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Ampacity Inc.

Singapore . 895 parts In-Stock

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$6.500

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895

$6.500

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Parana Technologies

USA . 1,073 parts In-Stock

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$6.649

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$7.362

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1,073

$6.649

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$7.362

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ChromeModa Solutions

Germany . 3,008 parts In-Stock

1+ parts

$7.471

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$6.126

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3,008

$7.471

$6.126

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IDEA Electronic Components Group

UK . 2,132 parts In-Stock

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$7.471

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$6.724

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2,132

$7.471

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$6.724

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AZTECH Wire

Italy . 759 parts In-Stock

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$8.203

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759

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Corphita

USA . 3,370 parts In-Stock

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3,370

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DigiPath Technology Company

USA . 1,781 parts In-Stock

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$6.736

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1,781

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$6.736

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Corohmni

South Africa . 234 parts In-Stock

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Overview

Enhance your power management solutions with the UC3543DWTRG4 from Texas Instruments. Known for their top-quality products, Texas Instruments delivers reliable Power Management ICs that cater to a wide range of applications. With its durable plastic/epoxy package body and small outline style, this IC offers easy installation and long-lasting performance. Whether you're looking to optimize voltage regulation or improve energy efficiency, the UC3543DWTRG4 provides exceptional value and benefits to customers seeking dependable power solutions. Upgrade your power management system today with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is known for its durability and reliability, making the product sturdy and long-lasting.

Surface Mount: YES

Surface mount technology allows for easy and quick installation, saving time and effort during assembly.

Power Supplies (V): 4.5/40

Wide range of power supplies supported, providing flexibility for different applications and requirements.

No. of Terminals: 16

Having multiple terminals allows for versatile connectivity options, making the product adaptable to various configurations.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures reliable performance even in harsh conditions or environments.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature allows for operation in a wide range of temperature settings, offering flexibility in usage.

Terminal Position: DUAL

Dual terminal position provides redundancy and increases reliability, ensuring continuous operation in case of one terminal failure.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures performance in standard operating conditions, suitable for most commercial applications.

Maximum Supply Current (Isup): 15 mA

Support for high supply current ensures efficient power management and distribution within the system.

Technology: BIPOLAR

Bipolar technology offers high precision and accuracy in power management, making the product ideal for sensitive electronic devices.

Terminal Form: GULL WING

Gull wing terminal form provides easy and secure soldering, ensuring a strong connection between the component and the circuit board.

Terminal Pitch: 1.27 mm

Narrow terminal pitch allows for compact design and efficient use of space on the circuit board.

Adjustable Threshold: YES

Adjustable threshold feature enables customization of power management settings, catering to specific requirements and preferences.

Technical Specifications

Power Management ICs UC3543DWTRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G16

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

4.5/40

Qualification:

Not Qualified

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

15 mA

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

UC3543DWTRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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