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UC3544J

Texas Instruments

UC3544J by Texas Instruments

UC3544J by Texas Instruments is a Power Management IC with 18 terminals, CMOS technology, and Vsup ranging from 4.7V to 40V. It is ideal for power supply support circuits in commercial-grade applications with operating temperatures from 0°C to 70°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,880 parts In-Stock

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Digiode

USA . 4,244 parts In-Stock

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Electronic Expediters

USA . 17 parts In-Stock

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NAC Semi

USA . 6 parts In-Stock

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Electronics Depot

USA . 5 parts In-Stock

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5

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One Stop Electronics

USA . 141 parts In-Stock

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$1.500

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141

$1.500

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AZTECH Wire

Italy . 869 parts In-Stock

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$7.780

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869

$7.780

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Parana Technologies

USA . 1,202 parts In-Stock

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$10.779

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$11.261

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$10.779

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DigiPath Technology Company

USA . 166 parts In-Stock

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$11.869

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$10.919

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166

$11.869

$10.919

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IDEA Electronic Components Group

UK . 988 parts In-Stock

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$12.111

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$11.505

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$10.900

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988

$12.111

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$10.900

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ChromeModa Solutions

Germany . 172 parts In-Stock

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$12.111

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$9.931

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172

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Corphita

USA . 4,124 parts In-Stock

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Kepictronics

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Overview

Enhance your power management solutions with the Texas Instruments UC3544J. Known for its top-notch quality and reliability, Texas Instruments delivers cutting-edge Power Management ICs that cater to a wide range of applications. The UC3544J offers unmatched value and benefits, providing customers with efficient power supply support circuitry in a compact and durable package. Trust Texas Instruments to deliver innovative solutions that meet your power management needs seamlessly.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The use of ceramic and glass-sealed material ensures durability and reliability, making this product suitable for harsh environments.

Nominal Supply Voltage (Vsup): 10 V

With a higher nominal supply voltage, this product can handle a wider range of input voltages, providing flexibility in different applications.

No. of Terminals: 18

Having a higher number of terminals allows for more connections and functionality, making this power management IC versatile in various circuit designs.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures that this power management IC can operate efficiently even in high-temperature environments.

Technology: CMOS

The CMOS technology used in this IC provides low power consumption and high noise immunity, making it energy-efficient and reliable.

Technical Specifications

Power Management ICs UC3544J attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-GDIP-T18

Length:

22.48 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

18

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP18,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

4.5/40

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

15 mA

Maximum Supply Voltage (Vsup):

40 V

Minimum Supply Voltage (Vsup):

4.7 V

Nominal Supply Voltage (Vsup):

10 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

7.62 mm

Trade Compliance

UC3544J Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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