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TX5416PGE

Texas Instruments

TX5416PGE by Texas Instruments

TX5416PGE by Texas Instruments is a 144-terminal DSP with 23-bit address bus and 16-bit external data bus. Operating at up to 20 MHz, it features low power mode and barrel shifter, suitable for industrial applications requiring fixed-point format processing.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,588 parts In-Stock

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Digiode

USA . 2,301 parts In-Stock

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2,301

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Distributors (Availability)

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Ampacity Inc.

Singapore . 725 parts In-Stock

1+ parts

$15.000

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725

$15.000

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AZTECH Wire

Italy . 740 parts In-Stock

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$16.642

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740

$16.642

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One Stop Electronics

USA . 414 parts In-Stock

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$33.000

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414

$33.000

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Corohmni

South Africa . 2,970 parts In-Stock

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$53.255

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2,970

$53.255

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Parana Technologies

USA . 773 parts In-Stock

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$64.294

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773

$64.294

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DigiPath Technology Company

USA . 991 parts In-Stock

1+ parts

$70.796

100+ parts

$65.132

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991

$70.796

$65.132

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ChromeModa Solutions

Germany . 1,019 parts In-Stock

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$72.241

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$59.238

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1,019

$72.241

$59.238

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IDEA Electronic Components Group

UK . 222 parts In-Stock

1+ parts

$72.241

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$68.629

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$65.017

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222

$72.241

$68.629

$65.017

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Corphita

USA . 3,677 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the TX5416PGE by Texas Instruments. As a leader in digital signal processors (DSPs), Texas Instruments delivers unrivaled quality and reliability. Ideal for a wide range of applications, this product offers customers unmatched value and benefits. From its sleek design to its advanced features, the TX5416PGE is designed to exceed expectations. Experience seamless performance and exceptional results with this innovative solution. Elevate your projects with the Texas Instruments TX5416PGE today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and cost.

Address Bus Width: 23

A wide address bus width allows for efficient memory addressing and data processing capabilities.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the PCB, maximizing component density.

No. of Terminals: 144

Having a high number of terminals allows for a wide range of connectivity options and interfaces.

Maximum Operating Temperature: 100 °C

High maximum operating temperature ensures reliable performance in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for operation in cold environments without compromising performance.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold terminal finish provides excellent conductivity and corrosion resistance for long-term reliability.

Terminal Position: QUAD

Quad terminal position allows for multiple connections in a compact space, suitable for high-density PCB layouts.

Maximum Seated Height: 1.6 mm

Low maximum seated height minimizes the overall profile of the component, useful for slim device designs.

Width: 20 mm

Compact width dimension saves space on the PCB, enabling higher component density and more functionality in a limited area.

Boundary Scan: YES

Boundary scan capability aids in testing and debugging the device during manufacturing, ensuring quality control.

External Data Bus Width: 16

A wide external data bus width enables fast data transfer and processing speeds for advanced signal processing tasks.

Maximum Clock Frequency: 20 MHz

High maximum clock frequency allows for quick execution of algorithms and processing tasks, increasing overall performance.

Maximum Time At Peak Reflow Temperature (s): 30

Short time at peak reflow temperature minimizes thermal stress on the device during assembly, preserving component integrity.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper soldering and component attachment during PCB assembly.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data flow and processing efficiency within the DSP, optimizing performance.

Length: 20 mm

Compact length dimension allows for space-efficient placement on the PCB, accommodating other components and connections.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in extreme temperature conditions typically found in industrial environments.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Having a digital signal processor peripheral IC type offers advanced signal processing capabilities for various applications.

Technology: CMOS

CMOS technology provides low power consumption and high speed performance, making the DSP efficient and versatile.

Terminal Form: GULL WING

Gull wing terminal form offers secure and reliable solder connections during assembly, ensuring long-term electrical conductivity.

Terminal Pitch: 0.5 mm

Narrow terminal pitch allows for high component density and fine-pitch connections on the PCB, maximizing functionality in a small space.

Format: FIXED POINT

Fixed-point format simplifies algorithm implementation and arithmetic operations, ideal for real-time signal processing applications.

Low Power Mode: YES

Low power mode option enables energy-efficient operation, prolonging battery life and reducing power consumption.

Barrel Shifter: YES

Barrel shifter feature enhances data manipulation and processing capabilities within the DSP, improving overall performance.

Technical Specifications

Digital Signal Processors (DSPs) TX5416PGE attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

23

Barrel Shifter:

YES

Boundary Scan:

YES

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

144

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.6 mm

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Trade Compliance

TX5416PGE Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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