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TUSB8043RGCR

Texas Instruments

TUSB8043RGCR by Texas Instruments

TUSB8043RGCR by Texas Instruments is a 64-terminal chip carrier with a data transfer rate of 625 MBps. It operates b/w 0-70°C, compatible with I2C, SMBUS, and VBUS buses. Ideal for commercial applications requiring a universal serial bus controller in compact spaces.

Median Price

$6.631

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,533 parts In-Stock

1+ parts

$6.631

100+ parts

$5.406

1k+ parts

$3.604

10k+ parts

-

3,533

$6.631

$5.406

$3.604

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,901 parts In-Stock

1+ parts

$6.299

100+ parts

-

1k+ parts

-

10k+ parts

-

3,901

$6.299

-

-

-

Vyrian

USA . 6,200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,200

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 692 parts In-Stock

1+ parts

$5.968

100+ parts

-

1k+ parts

-

10k+ parts

-

692

$5.968

-

-

-

AZTECH Wire

Italy . 808 parts In-Stock

1+ parts

$16.330

100+ parts

-

1k+ parts

-

10k+ parts

-

808

$16.330

-

-

-

Parana Technologies

USA . 322 parts In-Stock

1+ parts

$38.076

100+ parts

-

1k+ parts

-

10k+ parts

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322

$38.076

-

-

-

Corohmni

South Africa . 2,948 parts In-Stock

1+ parts

$41.131

100+ parts

-

1k+ parts

-

10k+ parts

-

2,948

$41.131

-

-

-

IDEA Electronic Components Group

UK . 1,589 parts In-Stock

1+ parts

$42.782

100+ parts

$40.643

1k+ parts

$38.504

10k+ parts

-

1,589

$42.782

$40.643

$38.504

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ChromeModa Solutions

Germany . 1,230 parts In-Stock

1+ parts

$42.782

100+ parts

$35.081

1k+ parts

-

10k+ parts

-

1,230

$42.782

$35.081

-

-

DigiPath Technology Company

USA . 672 parts In-Stock

1+ parts

-

100+ parts

$38.572

1k+ parts

-

10k+ parts

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672

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$38.572

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Overview

Elevate your connectivity experience with the TUSB8043RGCR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability in their products. The TUSB8043RGCR falls under the category of Bus Controllers, offering seamless data transfer rates of up to 625 MBps. With a package style that includes chip carrier and very thin profile, this versatile product is perfect for a wide range of applications. From I2C to SMBus to VBUS compatibility, this bus controller ensures smooth operation and high performance. Upgrade your devices today with the TUSB8043RGCR and enjoy the unparalleled benefits it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material makes this product lightweight and durable, ideal for use in various applications.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation onto a PCB, saving space and reducing assembly time.

Maximum Supply Voltage: 1.26 V

The high maximum supply voltage ensures compatibility with various power sources, making this bus controller versatile and reliable.

Package Shape: SQUARE

The square package shape provides a compact form factor, allowing for efficient use of space on a circuit board.

No. of Terminals: 64

With 64 terminals, this bus controller can support multiple connections and peripherals, making it suitable for complex systems.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The chip carrier, heat sink/slug, and very thin profile package styles provide effective thermal management and space-saving benefits for better performance.

Minimum Supply Voltage: 0.99 V

The low minimum supply voltage ensures efficient power consumption and operation at lower power levels, making this product energy-efficient.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature allows for reliable performance in various environmental conditions, enhancing the product's durability and reliability.

Maximum Data Transfer Rate: 625 MBps

The high data transfer rate of 625 MBps enables fast and efficient communication between devices, improving overall system performance.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures ensures that this bus controller remains functional even in cold environments, making it suitable for a wide range of applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability and performance.

Terminal Position: QUAD

The quad terminal position allows for secure and stable connections, reducing the risk of signal interference and ensuring data integrity.

Maximum Seated Height: 1 mm

The low maximum seated height enables a compact and space-efficient design, ideal for applications where height constraints are a concern.

Width: 9 mm

The 9mm width offers a slim profile, making this bus controller suitable for applications with limited space availability.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature ensures proper soldering and assembly, contributing to the product's overall reliability and performance.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures effective soldering and assembly, enhancing the product's durability and longevity.

Length: 9 mm

The 9mm length offers a compact form factor, allowing for easy integration into tight spaces or densely populated PCBs.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures reliable operation within standard temperature ranges, making this bus controller suitable for typical commercial applications.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

The peripheral IC type of bus controller for universal serial bus ensures compatibility with various devices and systems, making this product versatile and widely applicable.

Technology: CMOS

The CMOS technology offers low power consumption, high speed, and noise immunity, making this bus controller highly efficient and reliable.

Terminal Form: NO LEAD

The no-lead terminal form provides a reliable and environmentally friendly connection, ensuring long-term durability and sustainability.

Nominal Supply Voltage: 1.1 V

The nominal supply voltage of 1.1V provides stable and consistent power delivery, ensuring reliable performance and compatibility with various systems.

Bus Compatibility: I2C; SMBUS; VBUS

The bus compatibility with I2C, SMBus, and VBus allows for versatile connectivity and interoperability with a wide range of devices and systems.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch enables high-density mounting and efficient use of PCB space, making this bus controller suitable for compact and complex designs.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates that this bus controller can withstand exposure to moderate levels of moisture during handling and assembly, ensuring product integrity and reliability.

Technical Specifications

Bus Controllers TUSB8043RGCR attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Additional Features:

ALSO HAVING SECONDARY DIGITAL SUPPLY 3.3V(TYP), 24 MHZ CRYSTAL INPUT

Address Bus Width:

0

Bus Compatibility:

I2C; SMBUS; VBUS

Maximum Data Transfer Rate:

625 MBps

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

.99 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Trade Compliance

TUSB8043RGCR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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