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TSB43AA22PDT

Texas Instruments

TSB43AA22PDT by Texas Instruments

TSB43AA22PDT by Texas Instruments is a Serial Communication Controller with 32-bit address and data bus width. It operates at up to 24.576 MHz clock frequency, supporting a max data transfer rate of 50 MBps. Ideal for PCI bus compatibility applications requiring low power mode and two serial I/Os.

Median Price

$4.500

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 29 parts In-Stock

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$4.500

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$4.030

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$3.790

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$4.030

$3.790

Distributors (In-Stock)

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Digiode

USA . 4,707 parts In-Stock

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$4.760

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Vyrian

USA . 6,254 parts In-Stock

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PC Components Company LLC

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Bristol Electronics

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ComSIT Distribution GmbH

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ComSIT USA

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LWI Electronics Inc

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Distributors (Availability)

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Corphita

USA . 1,322 parts In-Stock

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$4.509

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$4.509

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Vigor

Singapore . 9,800 parts In-Stock

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$4.800

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$4.800

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Component Stockers USA

USA . 26 parts In-Stock

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$5.190

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AZTECH Wire

Italy . 885 parts In-Stock

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$14.060

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Parana Technologies

USA . 291 parts In-Stock

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$54.851

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DigiPath Technology Company

USA . 356 parts In-Stock

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$60.397

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$55.566

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$60.397

$55.566

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ChromeModa Solutions

Germany . 5,823 parts In-Stock

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$61.630

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$50.537

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$61.630

$50.537

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IDEA Electronic Components Group

UK . 160 parts In-Stock

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$61.630

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$58.548

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$55.467

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$55.467

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Kepictronics

USA . 52,220 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,376 parts In-Stock

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Authorized Procurement Solutions

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Microchip USA

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Perfect Parts

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Overview

Elevate your communication capabilities with the TSB43AA22PDT by Texas Instruments. Crafted with precision and expertise, this Serial Communication Controller offers unparalleled quality and reliability. From fast data transfer rates to low power consumption, this product is designed to exceed expectations. Whether you're in need of seamless connectivity for PCI bus compatibility or high-speed serial I/Os, this versatile controller has you covered. Trust Texas Instruments to deliver top-notch technology that enhances your performance and productivity. Elevate your communication game with the TSB43AA22PDT today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internals of the product, ensuring longevity and reliability.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 3.6 V

Support for a maximum supply voltage of 3.6V allows for flexibility in power requirements, making it compatible with a wide range of systems.

Address Bus Width: 32

With a wide address bus width of 32, this product can handle large amounts of data efficiently, enabling high-performance communication.

Package Shape: SQUARE

Square package shape offers a compact footprint, ideal for applications where space is limited.

No. of Terminals: 128

Having 128 terminals allows for multiple connections and interfaces, making it versatile for various communication setups.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

The flatpack, thin profile, and fine pitch package style enhances compatibility with modern circuit board designs and assembly processes.

Minimum Supply Voltage: 3 V

Support for a minimum supply voltage of 3V ensures efficient power consumption, making it suitable for low-power applications.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can withstand harsh environmental conditions, ensuring reliability in various settings.

Maximum Data Transfer Rate: 50 MBps

A high data transfer rate of 50 MBps allows for quick and efficient communication, essential for high-speed data processing applications.

Minimum Operating Temperature: 0 °C

Operating at a minimum temperature of 0°C ensures the product can function in cold environments without performance issues.

Terminal Position: QUAD

Quad terminal position provides stable connections and facilitates compatibility with different interface options, enhancing versatility.

Maximum Seated Height: 1.2 mm

With a maximum seated height of 1.2 mm, the product is slim and space-saving, suitable for compact device designs.

Width: 14 mm

Width of 14mm allows for easy integration into various circuit board layouts, offering flexibility in design and placement.

External Data Bus Width: 32

Wide external data bus width of 32 facilitates high-speed data transfer and processing capabilities, critical for efficient communication.

Maximum Clock Frequency: 24.576 MHz

Support for a maximum clock frequency of 24.576 MHz enables fast and accurate timing operations, enhancing overall performance.

Length: 14 mm

Length of 14mm complements the compact square package shape, making it suitable for applications with limited space constraints.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliable performance in standard operating conditions, making it suitable for a wide range of commercial applications.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

Being a serial IO/communication controller allows for seamless integration with serial interfaces, ensuring compatibility and efficient data transmission.

Technology: CMOS

CMOS technology offers low power consumption and high speed, contributing to energy efficiency and performance optimization.

Terminal Form: GULL WING

Gull wing terminal form provides secure soldering connections, reducing the risk of disconnection and ensuring stability during operation.

Nominal Supply Voltage: 3.3 V

Support for a nominal supply voltage of 3.3V ensures consistent and stable power delivery, enabling reliable operation under varying load conditions.

No. of Serial I/Os: 2

Having 2 serial IOs enhances the product's connectivity options, allowing for multiple data transfer channels and versatile communication setups.

Bus Compatibility: PCI

PCI bus compatibility ensures seamless integration with a common interface standard, enabling easy connectivity with various computer systems and devices.

Terminal Pitch: 0.4 mm

A terminal pitch of 0.4mm offers high-density connection points, facilitating compact design layouts and enabling efficient signal routing.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates robust moisture resistance, making the product suitable for use in humid or damp environments.

Low Power Mode: YES

Support for a low power mode enhances energy efficiency, prolonging battery life and reducing overall power consumption during idle or standby periods.

Technical Specifications

Serial Communication Controllers TSB43AA22PDT attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Address Bus Width:

32

Boundary Scan:

NO

Bus Compatibility:

PCI

Maximum Clock Frequency:

24.576 MHz

Maximum Data Transfer Rate:

50 MBps

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G128

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Serial I/Os:

2

No. of Terminals:

128

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

TSB43AA22PDT Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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