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TRF1216IRGPRG3

Texas Instruments

TRF1216IRGPRG3 by Texas Instruments

TRF1216IRGPRG3 by Texas Instruments is a RF/Microwave DOWN CONVERTER with 27 dB Min. Down Conversion Gain, 5V Power Supply, and -40 to 85°C Operating Temp Range. It has LO Tunable feature for frequencies b/w 3300-3800 MHz and IF range of 400-500 MHz. Ideal for applications requiring high-performance RF signal conversion in compact setups.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,758 parts In-Stock

1+ parts

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5,758

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Digiode

USA . 528 parts In-Stock

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528

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 889 parts In-Stock

1+ parts

$2.637

100+ parts

-

1k+ parts

$3.126

10k+ parts

-

889

$2.637

-

$3.126

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DigiPath Technology Company

USA . 913 parts In-Stock

1+ parts

$2.904

100+ parts

$2.671

1k+ parts

-

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913

$2.904

$2.671

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IDEA Electronic Components Group

UK . 2,019 parts In-Stock

1+ parts

$2.963

100+ parts

-

1k+ parts

$2.667

10k+ parts

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2,019

$2.963

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$2.667

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ChromeModa Solutions

Germany . 277 parts In-Stock

1+ parts

$2.963

100+ parts

$2.430

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-

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277

$2.963

$2.430

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AZTECH Wire

Italy . 655 parts In-Stock

1+ parts

$9.377

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655

$9.377

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Semicontronic

India . 1,180 parts In-Stock

1+ parts

$13.000

100+ parts

$12.675

1k+ parts

$12.610

10k+ parts

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1,180

$13.000

$12.675

$12.610

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Ampacity Inc.

Singapore . 853 parts In-Stock

1+ parts

$16.000

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853

$16.000

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One Stop Electronics

USA . 1,428 parts In-Stock

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$40.000

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1,428

$40.000

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Corphita

USA . 1,965 parts In-Stock

1+ parts

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1,965

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Corohmni

South Africa . 101 parts In-Stock

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101

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Overview

Unleash the power of cutting-edge RF/Microwave technology with the TRF1216IRGPRG3 by Texas Instruments. Crafted with precision and expertise, this component offers unparalleled quality and reliability. Whether you're in the aerospace, defense, or telecommunications industry, this down converter will elevate your operations with its seamless performance and superior functionality. Experience the value and benefits that Texas Instruments brings to the table, and take your projects to new heights with the TRF1216IRGPRG3.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and reliability, making the product suitable for a variety of environments.

Power Supplies (V): 5

Low power supply requirement of 5V makes the product energy efficient and cost-effective to operate.

Minimum Down Conversion Gain: 27 dB

High down conversion gain ensures efficient signal conversion with minimal loss, improving overall performance.

Minimum Operating Temperature: -40 °C

Wide operating temperature range from -40°C ensures the product can function effectively in extreme environmental conditions.

Terminal Finish: Matte Tin (Sn)

Matte tin finish on terminals provides good conductivity and corrosion resistance, enhancing the product's longevity.

LO Tunable: YES

Having a tunable local oscillator allows for flexibility in frequency selection and tuning, making the product versatile for various applications.

Maximum Supply Current: 200 mA

Low supply current requirement of 200mA helps in reducing power consumption and operating costs.

Minimum RF Input Frequency: 3300 MHz

Capable of handling RF input frequencies as low as 3300 MHz, making it suitable for a wide range of RF signals.

Minimum Intermediate Frequency (IF): 400 MHz

Supports an intermediate frequency as low as 400 MHz, allowing for effective signal processing and filtering.

Maximum RF Input Frequency: 3800 MHz

Can handle RF input frequencies up to 3800 MHz, making it suitable for a variety of RF applications.

Minimum Input Power (CW): 10 dBm

Capable of handling input power levels as low as 10 dBm, ensuring efficient signal reception and conversion.

Maximum Intermediate Frequency (IF): 500 MHz

Supports an intermediate frequency as high as 500 MHz, allowing for effective signal processing and filtering.

Mounting Feature: SURFACE MOUNT

Surface mount design allows for easy installation and integration into existing systems, saving time and effort in deployment.

Technical Specifications

RF/Microwave Up/Down Converters TRF1216IRGPRG3 attributes and parameters. Explore more RF/Microwave Up/Down Converters devices from Texas Instruments

Specs

Characteristic Impedance:

50 ohm

Construction:

COMPONENT

Minimum Down Conversion Gain:

27 dB

Maximum Intermediate Frequency (IF):

500 MHz

Minimum Intermediate Frequency (IF):

400 MHz

Minimum Input Power (CW):

10 dBm

JESD-609 Code:

e3

LO Tunable:

YES

Mounting Feature:

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

Package Equivalence Code:

LCC20,.16SQ,20

Power Supplies (V):

5

Maximum RF Input Frequency:

3800 MHz

Minimum RF Input Frequency:

3300 MHz

RF or Microwave Device Type:

Sub-Category:

RF/Microwave Up/Down Converters

Maximum Supply Current:

200 mA

Terminal Finish:

Matte Tin (Sn)

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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