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TPS650944A0RSKR

Texas Instruments

TPS650944A0RSKR by Texas Instruments

TPS650944A0RSKR by Texas Instruments is a Power Management IC with 12 channels, 21 A max output current, and 3100 kHz max switching frequency. Ideal for industrial applications requiring a supply voltage range of 5.6 V to 21 V and operating temperatures from -40°C to 85°C in a compact chip carrier package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,637 parts In-Stock

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Digiode

USA . 2,503 parts In-Stock

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2,503

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Distributors (Availability)

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One Stop Electronics

USA . 582 parts In-Stock

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$2.500

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582

$2.500

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Semicontronic

India . 381 parts In-Stock

1+ parts

$7.500

100+ parts

$7.312

1k+ parts

$7.275

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381

$7.500

$7.312

$7.275

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Parana Technologies

USA . 1,240 parts In-Stock

1+ parts

$7.957

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$8.531

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1,240

$7.957

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$8.531

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ChromeModa Solutions

Germany . 3,384 parts In-Stock

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$8.941

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$7.332

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3,384

$8.941

$7.332

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IDEA Electronic Components Group

UK . 2,152 parts In-Stock

1+ parts

$8.941

100+ parts

$8.494

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$8.047

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2,152

$8.941

$8.494

$8.047

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AZTECH Wire

Italy . 446 parts In-Stock

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$10.842

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446

$10.842

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Lixinc

USA . 17,548 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,000 parts In-Stock

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6,000

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GreenTree Electronics

Israel . 2,000 parts In-Stock

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Corphita

USA . 1,667 parts In-Stock

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DigiPath Technology Company

USA . 547 parts In-Stock

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$8.061

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547

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$8.061

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Technoshack Inc. (Excess)

Canada . 400 parts In-Stock

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Corohmni

South Africa . 145 parts In-Stock

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145

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Overview

Unlock the power of reliable and efficient energy management with the TPS650944A0RSKR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Power Management ICs that cater to a wide range of applications. With its innovative design and superior performance, this product ensures optimal power supply support for various electronic devices. Experience the seamless integration and enhanced functionality that this chip carrier offers, providing customers with unparalleled value and benefits. Trust Texas Instruments to bring you cutting-edge solutions for all your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures the product is lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Surface mount capability allows for easier and more efficient PCB assembly, saving on manufacturing costs and space.

Nominal Supply Voltage (Vsup): 13 V

The 13V nominal supply voltage provides a suitable power source for various electronic devices and systems.

No. of Terminals: 64

Having 64 terminals allows for a higher level of connectivity and functionality, making the product versatile and compatible with different components.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the product can withstand high temperatures, making it reliable in demanding environmental conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel/palladium/gold terminal finish ensures excellent conductivity and corrosion resistance for long-term performance.

Maximum Output Voltage: 3.575 V

The maximum output voltage of 3.575V provides stable and regulated power supply for connected devices, ensuring optimal performance.

Maximum Output Current: 21 A

With a high maximum output current of 21A, the product can support power-hungry devices and systems, making it suitable for various applications.

No. of Channels: 12

Having 12 channels allows for multiple outputs and power distribution options, making the product versatile and suitable for complex power management requirements.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the product can operate in harsh industrial environments with reliability and stability.

Technical Specifications

Power Management ICs TPS650944A0RSKR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

12

No. of Functions:

1

No. of Outputs:

12

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

21 A

Maximum Output Voltage:

3.575 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

21 V

Minimum Supply Voltage (Vsup):

5.6 V

Nominal Supply Voltage (Vsup):

13 V

Surface Mount:

YES

Maximum Switching Frequency:

3100 kHz

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

NO LEAD

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

8 mm

Trade Compliance

TPS650944A0RSKR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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