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TPS2330IPWG4

Texas Instruments

TPS2330IPWG4 by Texas Instruments

TPS2330IPWG4 by Texas Instruments is a Power Management IC with 14 terminals, supporting supply voltages of 3.3/5,3/13V. It has a small outline package style and operates in industrial temperature range (-40 to 85°C). Ideal for power supply support circuits due to its adjustable threshold feature and max output current of 500A.

Median Price

$2.120

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 55 parts In-Stock

1+ parts

-

100+ parts

$2.120

1k+ parts

$1.900

10k+ parts

$1.780

55

-

$2.120

$1.900

$1.780

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,043 parts In-Stock

1+ parts

$1.938

100+ parts

-

1k+ parts

-

10k+ parts

-

4,043

$1.938

-

-

-

Vyrian

USA . 8,346 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,346

-

-

-

-

Inventory MP

USA . 9 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9

-

-

-

-

Bristol Electronics

USA . 9 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,432 parts In-Stock

1+ parts

$1.836

100+ parts

-

1k+ parts

-

10k+ parts

-

4,432

$1.836

-

-

-

AZTECH Wire

Italy . 552 parts In-Stock

1+ parts

$12.440

100+ parts

-

1k+ parts

-

10k+ parts

-

552

$12.440

-

-

-

Parana Technologies

USA . 1,465 parts In-Stock

1+ parts

$13.609

100+ parts

-

1k+ parts

$14.110

10k+ parts

-

1,465

$13.609

-

$14.110

-

ChromeModa Solutions

Germany . 4,757 parts In-Stock

1+ parts

$15.291

100+ parts

$12.539

1k+ parts

-

10k+ parts

-

4,757

$15.291

$12.539

-

-

IDEA Electronic Components Group

UK . 1,671 parts In-Stock

1+ parts

$15.291

100+ parts

$14.526

1k+ parts

$13.762

10k+ parts

-

1,671

$15.291

$14.526

$13.762

-

Advanced Electronics

New Zealand . 30 parts In-Stock

1+ parts

$22.339

100+ parts

$20.328

1k+ parts

$18.318

10k+ parts

-

30

$22.339

$20.328

$18.318

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QUARKTWIN TECHNOLOGY LTD

USA . 4,979 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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4,979

-

-

-

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Microchip USA

USA . 4,714 parts In-Stock

1+ parts

-

100+ parts

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4,714

-

-

-

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Metaverse IC Inc.

Canada . 2,800 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,800

-

-

-

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DigiPath Technology Company

USA . 2,260 parts In-Stock

1+ parts

-

100+ parts

$13.786

1k+ parts

-

10k+ parts

-

2,260

-

$13.786

-

-

Overview

Upgrade your power management game with the TPS2330IPWG4 by Texas Instruments. This high-quality Power Management IC offers unparalleled performance and reliability, thanks to the exceptional manufacturing standards of Texas Instruments. Ideal for a wide range of applications, this product provides customers with enhanced efficiency, flexibility, and control over their power supplies. Say goodbye to power-related issues and hello to seamless operations with the TPS2330IPWG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product suitable for various applications without adding unnecessary weight.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on PCBs, saving time and space during assembly.

Nominal Supply Voltage (Vsup): 4.5 V

The nominal supply voltage of 4.5V ensures compatibility with a wide range of devices and power sources.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environments and extended use without overheating.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for reliable performance even in extremely cold conditions.

Maximum Output Current: 500 A

The high maximum output current capability makes this product suitable for powering a variety of devices and components.

Adjustable Threshold: YES

The ability to adjust the threshold allows for customization and optimization of the power management settings for specific applications.

Technical Specifications

Power Management ICs TPS2330IPWG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

REQUIRES 3V TO 5.5V SUPPLY FOR CHANNEL 2

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

500 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5,3/13

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

1 mA

Maximum Supply Voltage (Vsup):

13 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4.4 mm

Trade Compliance

TPS2330IPWG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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