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TPS2216ADBRG4

Texas Instruments

TPS2216ADBRG4 by Texas Instruments

TPS2216ADBRG4 by Texas Instruments is a Power Management IC with 3.3V nominal voltage, suitable for power supply support circuits. It features 30 terminals, operates b/w -40 to 70°C, and supports both 3.3V and 5V power supplies. The package style is small outline with shrink pitch, making it ideal for surface mount applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,307 parts In-Stock

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Vyrian

USA . 2,558 parts In-Stock

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2,558

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Distributors (Availability)

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Ampacity Inc.

Singapore . 612 parts In-Stock

1+ parts

$1.500

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612

$1.500

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Parana Technologies

USA . 2,002 parts In-Stock

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$2.480

100+ parts

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$2.973

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2,002

$2.480

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$2.973

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ChromeModa Solutions

Germany . 2,872 parts In-Stock

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$2.787

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$2.285

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$2.787

$2.285

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IDEA Electronic Components Group

UK . 681 parts In-Stock

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$2.787

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$2.508

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681

$2.787

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$2.508

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Semicontronic

India . 663 parts In-Stock

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$5.500

100+ parts

$5.362

1k+ parts

$5.335

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663

$5.500

$5.362

$5.335

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AZTECH Wire

Italy . 594 parts In-Stock

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$6.323

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$6.323

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One Stop Electronics

USA . 1,273 parts In-Stock

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$7.500

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Corphita

USA . 4,580 parts In-Stock

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Microchip USA

USA . 406 parts In-Stock

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406

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DigiPath Technology Company

USA . 179 parts In-Stock

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$2.513

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$2.513

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Corohmni

South Africa . 129 parts In-Stock

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Overview

Enhance efficiency and reliability in your power management systems with the TPS2216ADBRG4 by Texas Instruments. This high-quality Power Management IC offers exceptional performance, thanks to its innovative design and superior manufacturing standards. Ideal for a wide range of applications, this product delivers consistent power supplies and ensures optimal functionality. Experience the value and benefits of Texas Instruments products with the TPS2216ADBRG4, providing customers with top-notch quality and unparalleled advantages in power management solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for the product.

Surface Mount: YES

Surface mount capability makes it easy to integrate into circuit boards for efficient assembly.

Nominal Supply Voltage (Vsup): 3.3 V

Operates at a standard voltage level of 3.3V, suitable for many electronic applications.

No. of Terminals: 30

Having 30 terminals allows for versatile connectivity options and functionalities.

Maximum Operating Temperature: 70 °C

Can withstand high temperatures up to 70°C, ensuring stable performance even in harsh conditions.

Minimum Operating Temperature: -40 °C

Capable of operating at low temperatures down to -40°C, ideal for a wide range of environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold finish offers excellent conductivity and corrosion resistance for long-term reliability.

Width (mm): 5.3 mm

Compact width of 5.3mm saves space on the circuit board and allows for more efficient layout designs.

Minimum Supply Voltage (Vsup): 2.7 V

Supports a minimum voltage of 2.7V, ensuring compatibility with a wide range of power sources.

Peak Reflow Temperature °C: 260

Capable of withstanding high reflow temperatures up to 260°C during assembly processes.

Technical Specifications

Power Management ICs TPS2216ADBRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 5V AND 12V SUPPLY

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G30

JESD-609 Code:

e4

Length:

10.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

3

No. of Functions:

1

No. of Terminals:

30

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP30,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Power Management Circuits

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

5.3 mm

Trade Compliance

TPS2216ADBRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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