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TPA741DGNG4

Texas Instruments

TPA741DGNG4 by Texas Instruments

TPA741DGNG4 by Texas Instruments is an audio amplifier IC with 8 terminals, offering a nominal output power of 0.7W and gain of 36dB. With a small outline package style and operating temperature range from -40 to 85°C, it is ideal for industrial applications requiring low harmonic distortion (0.5%) and a wide bandwidth of 0.02 kHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,780 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,780

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Vyrian

USA . 2,882 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,882

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,859 parts In-Stock

1+ parts

$0.142

100+ parts

-

1k+ parts

$1.488

10k+ parts

-

1,859

$0.142

-

$1.488

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DigiPath Technology Company

USA . 1,960 parts In-Stock

1+ parts

$0.157

100+ parts

-

1k+ parts

-

10k+ parts

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1,960

$0.157

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IDEA Electronic Components Group

UK . 908 parts In-Stock

1+ parts

$0.160

100+ parts

-

1k+ parts

$0.144

10k+ parts

-

908

$0.160

-

$0.144

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ChromeModa Solutions

Germany . 230 parts In-Stock

1+ parts

$0.160

100+ parts

$0.131

1k+ parts

-

10k+ parts

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230

$0.160

$0.131

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AZTECH Wire

Italy . 693 parts In-Stock

1+ parts

$7.888

100+ parts

-

1k+ parts

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10k+ parts

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693

$7.888

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One Stop Electronics

USA . 926 parts In-Stock

1+ parts

$19.800

100+ parts

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926

$19.800

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Microchip USA

USA . 4,919 parts In-Stock

1+ parts

-

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4,919

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Corphita

USA . 1,701 parts In-Stock

1+ parts

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1,701

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Kepictronics

USA . 39 parts In-Stock

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39

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Overview

Elevate your audio experience with the TPA741DGNG4 by Texas Instruments. Crafted with precision and expertise, this audio amplifier delivers high-quality sound with minimal distortion. Whether you're enhancing your home entertainment system or upgrading your car audio, this small outline, heat sink package offers powerful performance in a compact design. With a nominal output power of 0.7W and a gain of 36dB, this industrial-grade amplifier ensures crystal-clear sound reproduction. Trust Texas Instruments to bring innovation and reliability to your audio projects. Upgrade to the TPA741DGNG4 and immerse yourself in superior audio quality like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and lightweight construction for easy portability.

Surface Mount: YES

Allows for easy installation and space-saving design.

Harmonic Distortion: 0.5%

Low harmonic distortion ensures high-quality audio output with minimal interference.

Nominal Output Power: 0.7 W

Sufficient power output for small to medium-sized audio applications.

Minimum Supply Voltage (Vsup): 2.5 V

Low minimum supply voltage requirement for energy-efficient operation.

Nominal Bandwidth: 0.02 kHz

Wide nominal bandwidth for clear and detailed sound reproduction.

Gain: 36 dB

High gain level for amplifying audio signals effectively.

Technical Specifications

Audio & Video Amplifiers TPA741DGNG4 attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

Nominal Bandwidth:

.02 kHz

General IC Type:

Gain:

36 dB

Harmonic Distortion:

.5 %

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

.7 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

2.5 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

TPA741DGNG4 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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