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TMS5703137CZWTQQ1

Texas Instruments

TMS5703137CZWTQQ1 by Texas Instruments

TMS5703137CZWTQQ1 by Texas Instruments is a 32-bit microcontroller with 22-bit address bus width, suitable for automotive applications. It features 24-Ch 12-Bit ADC channels, 16 DMA channels, and operates at a max clock frequency of 80 MHz. With low power mode enabled, it offers connectivity options like CAN(3), ETHERNET, I2C, SCI(2), SPI(5).

Median Price

$78.122

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Freelance Electronics

USA . 39 parts In-Stock

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$78.122

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$82.028

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$77.340

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Digiode

USA . 3,571 parts In-Stock

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Vyrian

USA . 3,045 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 859 parts In-Stock

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$5.569

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One Stop Electronics

USA . 1,273 parts In-Stock

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Ampacity Inc.

Singapore . 1,495 parts In-Stock

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Parana Technologies

USA . 648 parts In-Stock

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$32.762

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$112.152

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ChromeModa Solutions

Germany . 6,715 parts In-Stock

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$36.811

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$30.185

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IDEA Electronic Components Group

UK . 1,715 parts In-Stock

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$36.811

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$34.970

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$33.130

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Corohmni

South Africa . 131 parts In-Stock

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Continental Prestige Electronics

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Argo Parts USA

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Aranea Global

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Lixinc

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Microchip USA

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DigiPath Technology Company

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$33.189

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Overview

Unlock the power of innovation with the TMS5703137CZWTQQ1 microcontroller by Texas Instruments. Designed with cutting-edge technology and precision engineering, this automotive-grade device boasts unparalleled performance and reliability for a wide range of applications. From advanced networking capabilities to high-speed data acquisition, this microcontroller delivers exceptional value and efficiency to customers seeking seamless integration and optimal functionality. Elevate your projects to new heights with the TMS5703137CZWTQQ1 and experience the difference that superior quality and innovation can make in your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring reliable performance.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving both time and cost.

Maximum Supply Voltage: 1.32 V

Allows for flexibility in power supply options while maintaining safe operating levels.

Address Bus Width: 22

Enables efficient memory addressing for large data handling.

Screening Level: AEC-Q100

Meets automotive industry quality standards for reliable operation in demanding environments.

Package Shape: SQUARE

Optimizes PCB layout and space utilization for compact electronic designs.

Bit Size: 32

Provides high processing power for complex applications and algorithms.

Power Supplies (V): 1.2,3.3

Supports a wide range of power supply options for flexibility in system design.

No. of Terminals: 337

Provides ample connectivity options for interfacing with external components and peripherals.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Facilitates advanced PCB mounting techniques for enhanced performance and reliability.

Minimum Supply Voltage: 1.14 V

Ensures stable operation even under low voltage conditions for reliable performance.

Maximum Operating Temperature: 125 °C

Suitable for harsh operating conditions, such as automotive and industrial applications.

CPU Family: CORTEX-R4F

Utilizes a powerful and efficient processor architecture for high-performance computing.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold environments without compromising performance.

Terminal Finish: TIN SILVER COPPER

Provides excellent conductivity and corrosion resistance for reliable connections.

ADC Channels: YES

Allows for analog sensor interfacing and data acquisition for diverse applications.

DMA Channels: YES

Enables efficient data transfer between peripherals and memory for high-speed processing.

Terminal Position: BOTTOM

Facilitates easy PCB mounting and compact system design.

ROM Words: 3145728

Offers ample storage for program instructions and data processing.

Maximum Seated Height: 1.4 mm

Enables low-profile system designs for space-constrained applications.

Width: 16 mm

Compact form factor for integration into various electronic devices.

Data EEPROM Size: 64K

Stores configuration and calibration data for system customization and flexibility.

Boundary Scan: YES

Facilitates comprehensive testing and debugging of the microcontroller during production.

External Data Bus Width: 16

Efficient data transfer interface for external memory and peripherals.

Peripherals: DMA(16), POR, TIMER(45), WDT

Offers a wide range of built-in peripherals for versatile system integration and functionality.

Maximum Clock Frequency: 80 MHz

Provides high-speed processing capabilities for demanding applications.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper solder reflow during manufacturing for reliable solder joints.

Peak Reflow Temperature °C: 260

Suitable for lead-free soldering processes and high-temperature reflow profiles.

Length: 16 mm

Compact form factor for space-efficient PCB layout and system integration.

Temperature Grade: AUTOMOTIVE

Designed to withstand the temperature variations and rugged conditions of automotive environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a RISC architecture for efficient instruction execution and system performance.

RAM Bytes: 262144

Provides ample memory for data storage and processing in complex applications.

Technology: CMOS

Utilizes low-power CMOS technology for energy-efficient operation.

Terminal Form: BALL

Facilitates reliable soldering and connection to the PCB for robust system integration.

Analog To Digital Convertors: 24-Ch 12-Bit

Offers high-resolution analog-to-digital conversion for accurate sensor data acquisition.

Maximum Supply Current: 440 mA

Supports power-hungry peripherals and components for versatile system design.

Nominal Supply Voltage: 1.2 V

Ideal operating voltage for energy-efficient performance and low power consumption.

No. of DMA Channels: 16

Enables parallel data transfer for efficient processing and system performance.

Connectivity: CAN(3), ETHERNET, I2C, SCI(2), SPI(5)

Offers a wide range of communication interfaces for seamless connectivity with external devices.

ROM Programmability: FLASH

Allows for flexible and fast reprogramming of the microcontroller for system updates and enhancements.

Terminal Pitch: 0.8 mm

Optimal pitch size for reliable solder connections and PCB assembly.

Format: FLOATING POINT

Supports floating-point arithmetic for complex mathematical computations in scientific and engineering applications.

Moisture Sensitivity Level (MSL): 3

Suitable for use in environments with moderate exposure to moisture.

Speed: 180 rpm

Provides fast and efficient processing capabilities for time-critical applications.

Low Power Mode: YES

Supports energy-saving operation for extended battery life in portable devices.

On Chip Program ROM Width: 8

Efficient storage of program instructions for streamlined execution and system performance.

No. of I/O Lines: 144

Offers ample input/output options for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers TMS5703137CZWTQQ1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

22

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-R4F

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B337

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of I/O Lines:

144

No. of Terminals:

337

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA337,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

262144

ROM Words:

3145728

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.4 mm

Speed:

180 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

440 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN(3), ETHERNET, I2C, SCI(2), SPI(5)

Peripherals:

DMA(16), POR, TIMER(45), WDT

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

TMS5703137CZWTQQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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