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TMS5702135CZWTQQ1

Texas Instruments

TMS5702135CZWTQQ1 by Texas Instruments

TMS5702135CZWTQQ1 by Texas Instruments is a 32-bit microcontroller with 22-bit address bus width, operating at up to 80 MHz. Ideal for automotive applications, it features 24-Ch 12-Bit ADC channels, DMA(16), and connectivity options like CAN(3) and SPI(5).

Median Price

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1k+

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Vyrian

USA . 2,863 parts In-Stock

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Digiode

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AZTECH Wire

Italy . 428 parts In-Stock

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$9.184

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One Stop Electronics

USA . 944 parts In-Stock

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Parana Technologies

USA . 1,488 parts In-Stock

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ChromeModa Solutions

Germany . 2,489 parts In-Stock

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IDEA Electronic Components Group

UK . 267 parts In-Stock

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$52.045

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$49.443

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$46.840

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A-Z Elektronik GmbH

Germany . 5,208 parts In-Stock

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Lixinc

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Corphita

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DigiPath Technology Company

USA . 2,325 parts In-Stock

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Microchip USA

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Overview

Unlock unparalleled performance and reliability with the TMS5702135CZWTQQ1 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality microcontrollers that are perfect for a wide range of applications. With cutting-edge technology and innovative features, this product offers customers exceptional value, seamless connectivity, and advanced functionality. Experience the benefits of superior performance and efficiency with the TMS5702135CZWTQQ1, setting new standards in the world of microcontrollers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable and rugged applications.

Surface Mount: YES

Surface mount design allows for easy integration onto PCBs, saving space and simplifying assembly processes.

Maximum Supply Voltage: 1.32 V

Efficient operation at a relatively low supply voltage helps in reducing power consumption and heat generation.

Address Bus Width: 22

A wider address bus allows for accessing a larger memory space, enabling more complex and feature-rich applications to be developed.

Screening Level: AEC-Q100

AEC-Q100 certification ensures that the product meets automotive industry standards for reliability and performance, making it suitable for automotive applications.

Package Shape: SQUARE

Square package shape provides a compact footprint, optimizing space utilization on the PCB.

Bit Size: 32

32-bit architecture allows for processing larger data chunks in a single instruction cycle, enhancing the performance of the product.

Power Supplies (V): 1.2

Operating at a low power supply voltage of 1.2V results in energy-efficient operation, making it suitable for battery-powered devices.

No. of Terminals: 337

A high number of terminals provide extensive connectivity options and interfaces, enabling versatile and diverse system integration.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array package style with low profile and fine pitch design enhances PCB layout flexibility and allows for higher component density.

Minimum Supply Voltage: 1.14 V

The ability to operate at low supply voltage range provides flexibility in power management and extends battery life in portable applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can withstand extreme environmental conditions without compromising performance.

CPU Family: CORTEX-R4F

Utilizing a powerful Cortex-R4F CPU family ensures high performance, real-time processing capabilities suitable for demanding applications.

Minimum Operating Temperature: -40 °C

Ability to operate in sub-zero temperatures enables reliable performance in cold environments or automotive applications exposed to harsh weather conditions.

Terminal Finish: TIN SILVER COPPER

Terminal finish with a combination of tin, silver, and copper provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

ADC Channels: YES

Integrated ADC channels allow for analog signal conversion, enabling the product to interface with various sensors and acquire real-world data precisely.

DMA Channels: YES

DMA channels facilitate efficient data transfer between peripherals and memory, enhancing system performance by offloading CPU tasks.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB design and assembly, leading to a more streamlined manufacturing process.

ROM Words: 2097152

Large ROM capacity of 2097152 words ensures ample storage space for program code and data, allowing for complex algorithm implementation.

Maximum Seated Height: 1.4 mm

Low maximum seated height facilitates compact device design, beneficial for space-constrained applications.

Width: 16 mm

Narrow width of 16mm enables tight integration on the PCB, contributing to a more efficient use of available space.

Data EEPROM Size: 64K

Large EEPROM size of 64K provides non-volatile memory storage for critical data, configuration settings, and user preferences.

External Data Bus Width: 16

Wide external data bus width of 16 bits enables faster data transfer speeds between the microcontroller and external memory devices.

Peripherals: DMA(16), POR, TIMER(45), WDT

Rich set of peripherals including DMA controllers, timers, and watchdog timers enhance system capabilities and support a wide range of applications.

Maximum Clock Frequency: 80 MHz

High maximum clock frequency of 80 MHz allows for rapid execution of instructions, improving overall system performance.

Maximum Time At Peak Reflow Temperature (s): 30

Extended time at peak reflow temperature of 30 seconds ensures proper soldering and reliable connections during manufacturing processes.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C supports lead-free soldering processes, meeting environmental regulations and industry standards.

Length: 16 mm

Compact length of 16mm allows for efficient use of board space and facilitates system miniaturization.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature tolerance ensures reliable operation in automotive environments with varying temperature conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with RISC architecture offers high performance, low power consumption, and efficient code execution, ideal for embedded applications.

RAM Bytes: 262144

Generous RAM size of 262144 bytes provides ample memory for data storage and manipulation, supporting multitasking and real-time processing requirements.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making the microcontroller energy-efficient and reliable.

Terminal Form: BALL

Ball terminal form simplifies soldering and ensures secure mechanical connections, contributing to robust PCB assembly.

Analog To Digital Convertors: 24-Ch 12-Bit

Multiple ADC channels with 12-bit resolution provide accurate analog-to-digital conversion, enabling precise measurement and control in sensor-based applications.

Maximum Supply Current: 375 mA

With a maximum supply current of 375mA, the microcontroller operates efficiently without overloading power sources, ensuring stable performance.

Nominal Supply Voltage: 1.2 V

Stable nominal supply voltage of 1.2V ensures consistent and reliable operation, minimizing voltage fluctuations and enhancing system integrity.

Connectivity: CAN(3), I2C, SCI(2), SPI(5)

Diverse connectivity options including CAN, I2C, SCI, and SPI interfaces enable seamless communication with external devices, expanding system compatibility.

ROM Programmability: FLASH

Flash ROM programmability allows for efficient program storage, easy firmware updates, and flexible configuration options, enhancing product versatility.

Terminal Pitch: 0.8 mm

Fine terminal pitch of 0.8mm enables high-density mounting on the PCB, optimizing space utilization and enhancing electrical performance.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates moderate sensitivity to moisture, requiring standard handling and storage procedures to maintain component reliability.

Speed: 180 rpm

Operating speed of 180 rotations per minute ensures efficient data processing, quick response times, and smooth operation of the microcontroller.

On Chip Program ROM Width: 8

On-chip program ROM width of 8 bits allows for storing and executing instructions directly from the ROM, improving system performance and responsiveness.

No. of I/O Lines: 144

Abundance of I/O lines provides extensive interfacing capabilities, enabling versatile connectivity with external devices and peripherals.

Technical Specifications

Microcontrollers TMS5702135CZWTQQ1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

22

Bit Size:

32

CPU Family:

CORTEX-R4F

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

JESD-30 Code:

S-PBGA-B337

JESD-609 Code:

e1

Length:

16 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

144

No. of Terminals:

337

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA337,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2

Qualification:

Not Qualified

RAM Bytes:

262144

ROM Words:

2097152

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.4 mm

Speed:

180 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

375 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN(3), I2C, SCI(2), SPI(5)

Peripherals:

DMA(16), POR, TIMER(45), WDT

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

TMS5702135CZWTQQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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