Loading...

TMS5702135CPGEQQ1

Texas Instruments

TMS5702135CPGEQQ1 by Texas Instruments

TMS5702135CPGEQQ1 by Texas Instruments is a 32-bit microcontroller with 144 terminals, operating at up to 80 MHz. Ideal for automotive applications, it features 24-Ch 12-Bit ADC channels and connectivity options like CAN, I2C, SCI, and SPI. With a temperature range of -40 to 125 °C, this Cortex-R4F CPU family device offers 262144 bytes of RAM and flash ROM programmability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,029 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,029

-

-

-

-

Digiode

USA . 4,705 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,705

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 418 parts In-Stock

1+ parts

$19.463

100+ parts

-

1k+ parts

-

10k+ parts

-

418

$19.463

-

-

-

One Stop Electronics

USA . 1,005 parts In-Stock

1+ parts

$33.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,005

$33.000

-

-

-

Parana Technologies

USA . 2,014 parts In-Stock

1+ parts

$49.075

100+ parts

-

1k+ parts

-

10k+ parts

-

2,014

$49.075

-

-

-

DigiPath Technology Company

USA . 1,973 parts In-Stock

1+ parts

$54.037

100+ parts

$49.714

1k+ parts

-

10k+ parts

-

1,973

$54.037

$49.714

-

-

ChromeModa Solutions

Germany . 2,583 parts In-Stock

1+ parts

$55.140

100+ parts

$45.215

1k+ parts

-

10k+ parts

-

2,583

$55.140

$45.215

-

-

IDEA Electronic Components Group

UK . 1,219 parts In-Stock

1+ parts

$55.140

100+ parts

$52.383

1k+ parts

$49.626

10k+ parts

-

1,219

$55.140

$52.383

$49.626

-

Corphita

USA . 2,679 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,679

-

-

-

-

Microchip USA

USA . 172 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

172

-

-

-

-

Overview

Discover the power and precision of the TMS5702135CPGEQQ1 microcontroller by Texas Instruments. With a reputation for reliability and innovation, Texas Instruments delivers cutting-edge technology in the automotive industry. This microcontroller boasts advanced features like 24 ADC channels, 16 DMA channels, and a maximum clock frequency of 80 MHz, making it ideal for a wide range of applications. Experience seamless connectivity with CAN, I2C, SCI, and SPI interfaces, while enjoying the benefits of low power consumption and high performance. Trust Texas Instruments to deliver quality and value with the TMS5702135CPGEQQ1 microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto printed circuit boards, saving space and reducing production costs.

Maximum Supply Voltage: 1.32 V

The high maximum supply voltage allows for flexibility in power supply options and compatibility with different systems.

Screening Level: AEC-Q100

AEC-Q100 certification ensures that the microcontroller meets the stringent quality standards required for automotive applications, ensuring reliability and performance in harsh environments.

Package Shape: SQUARE

The square package shape is compact and enables efficient use of board space, ideal for applications where size is a constraint.

Bit Size: 32

With a 32-bit architecture, the microcontroller can handle large amounts of data and perform complex calculations with precision and speed.

Power Supplies (V): 1.2

The nominal supply voltage of 1.2V ensures low power consumption, making the microcontroller energy-efficient and suitable for battery-powered devices.

No. of Terminals: 144

The high number of terminals allows for versatile connectivity options and integration with various peripherals, expanding the functionality of the microcontroller.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style offers increased thermal performance, reduced signal distortion, and optimal board space utilization, making it suitable for compact designs.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage ensures reliable operation even in low voltage conditions, enhancing the microcontroller's versatility and compatibility with different power sources.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, the microcontroller can withstand elevated temperature environments, making it suitable for industrial and automotive applications.

CPU Family: CORTEX-R4F

Based on the Cortex-R4F CPU family, the microcontroller offers high performance, real-time processing capabilities, and efficient handling of complex control algorithms.

Minimum Operating Temperature: -40 °C

The wide operating temperature range of -40°C ensures reliable operation in extreme cold conditions, making the microcontroller suitable for a variety of environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent corrosion resistance and reliability, ensuring long-term performance and durability of the microcontroller.

ADC Channels: YES

The inclusion of ADC channels enables the microcontroller to convert analog signals into digital data, expanding its capabilities for sensor interfacing and signal processing.

DMA Channels: YES

DMA channels allow for direct memory access and efficient data transfer between peripherals and memory, enhancing the microcontroller's performance and multitasking abilities.

Terminal Position: QUAD

The quad terminal position offers convenient accessibility and ease of connections, facilitating the integration of the microcontroller into different systems and devices.

ROM Words: 2097152

With a large ROM capacity of 2097152 words, the microcontroller can store extensive program code and data, enabling complex applications and firmware updates.

Maximum Seated Height: 1.6 mm

The low maximum seated height allows for slim and compact designs, making the microcontroller suitable for space-constrained applications.

Width: 20 mm

The compact width of 20mm enables the microcontroller to fit into tight spaces without compromising on functionality, making it suitable for compact device designs.

Data EEPROM Size: 64K

The 64K data EEPROM size provides non-volatile memory storage for critical data, settings, and parameters, ensuring data integrity and retention even during power loss.

Peripherals: DMA(16), POR, TIMER(41), WDT

The microcontroller includes a variety of peripherals such as DMA controllers, power-on reset circuitry, timers, and watchdog timers, enhancing its functionality and versatility for diverse applications.

Maximum Clock Frequency: 80 MHz

With a high maximum clock frequency of 80MHz, the microcontroller can execute instructions quickly and accurately, enabling high-speed operation and real-time processing tasks.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature of 260°C ensures proper soldering and reliable connections during the manufacturing process, guaranteeing the quality and durability of the microcontroller.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for solder reflow processes with lead-free soldering techniques, meeting environmental regulations and ensuring robust solder joints.

Length: 20 mm

The compact length of 20mm provides a space-saving solution for device designs, allowing for efficient integration of the microcontroller into small form factor products.

Temperature Grade: AUTOMOTIVE

The automotive-grade temperature rating ensures reliable operation in harsh automotive environments, making the microcontroller suitable for automotive applications that require high temperature resilience.

Peripheral IC Type: MICROCONTROLLER, RISC

As a microcontroller with a RISC architecture, the device offers reduced instruction set computing for efficient processing, low power consumption, and high performance in embedded applications.

RAM Bytes: 262144

The 262144 bytes of RAM provide ample memory for data storage and processing, enabling efficient multitasking, data manipulation, and application execution.

Technology: CMOS

The CMOS technology used in the microcontroller offers low power consumption, high noise immunity, and reliable operation, making it suitable for battery-powered devices and portable applications.

Terminal Form: GULL WING

The gull wing terminal form provides secure solder joints and ease of soldering during assembly, ensuring reliable connections and robust mechanical strength in the final product.

Analog To Digital Convertors: 24-Ch 12-Bit

The 24-channel 12-bit ADCs enable precise and accurate conversion of analog signals to digital data, facilitating sensor interfacing, data acquisition, and control in various applications.

Maximum Supply Current: 350 mA

The maximum supply current of 350mA allows for adequate power delivery to the microcontroller and its peripherals, ensuring stable operation and performance under varying load conditions.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage of 1.2V provides a stable and efficient power source for the microcontroller, supporting reliable operation and low power consumption.

Connectivity: CAN(3), I2C, SCI(2), SPI(4)

The microcontroller offers multiple connectivity options such as CAN, I2C, SPI, and SCI interfaces, enabling seamless communication with external devices, sensors, and networks in a wide range of applications.

ROM Programmability: FLASH

The use of FLASH memory for ROM programmability allows for easy and fast reprogramming of firmware and data, enabling quick updates and modifications without the need for external programming tools.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch enables high-density mounting and precise connections, reducing signal interference and improving the overall reliability of the microcontroller in demanding applications.

Moisture Sensitivity Level (MSL): 3

The MSL-3 rating indicates the microcontroller's resistance to moisture and humidity, ensuring reliable performance and longevity in environments with varying moisture levels.

Speed: 160 rpm

With a speed rating of 160rpm, the microcontroller can process instructions and data at a rapid pace, enabling real-time control and responsive performance in dynamic applications.

Technical Specifications

Microcontrollers TMS5702135CPGEQQ1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-R4F

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

58

No. of Terminals:

144

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2

Qualification:

Not Qualified

RAM Bytes:

262144

ROM Words:

2097152

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

160 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

350 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN(3), I2C, SCI(2), SPI(4)

Peripherals:

DMA(16), POR, TIMER(41), WDT

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

TMS5702135CPGEQQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20