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TMS5702134CZWTQQ1

Texas Instruments

TMS5702134CZWTQQ1 by Texas Instruments

TMS5702134CZWTQQ1 by Texas Instruments is a 32-bit microcontroller with 22-bit address bus, operating at max 80 MHz. Ideal for automotive applications, it features 24-Ch ADCs, 64K Data EEPROM, and connectivity options like CAN, I2C, SCI, SPI.

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1k+

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Vyrian

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Digiode

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One Stop Electronics

USA . 1,095 parts In-Stock

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AZTECH Wire

Italy . 484 parts In-Stock

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Parana Technologies

USA . 918 parts In-Stock

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DigiPath Technology Company

USA . 1,953 parts In-Stock

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IDEA Electronic Components Group

UK . 2,261 parts In-Stock

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$32.626

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$30.995

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$29.363

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ChromeModa Solutions

Germany . 2,053 parts In-Stock

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$32.626

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$26.753

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Corphita

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Microchip USA

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Overview

Unlock the power of cutting-edge technology with the TMS5702134CZWTQQ1 microcontroller from Texas Instruments. Designed with precision and reliability in mind, this innovative device is perfect for a wide range of applications in the automotive industry. With its advanced features and high-performance capabilities, customers can expect seamless operation and enhanced functionality. Trust in Texas Instruments' reputation for excellence and choose the TMS5702134CZWTQQ1 for your next project. Elevate your designs and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for applications where weight and durability are important factors.

Surface Mount: YES

Being surface mountable allows for easy and convenient assembly on circuit boards, saving space and reducing manufacturing complexity.

Maximum Supply Voltage: 1.32 V

The low maximum supply voltage helps in reducing power consumption and heat dissipation, improving overall energy efficiency of the product.

Address Bus Width: 22

A wider address bus allows for efficient memory addressing and data manipulation, enabling faster processing and data transfer speeds.

Screening Level: AEC-Q100

Compliance with the AEC-Q100 standard ensures reliability and ruggedness, making it suitable for automotive applications where durability and quality are critical.

Package Shape: SQUARE

The square package shape offers better space utilization on PCBs, allowing for compact and efficient board layout designs.

Bit Size: 32

Having a 32-bit architecture enables the microcontroller to process larger chunks of data at a time, increasing performance and efficiency in handling complex tasks.

Power Supplies (V): 1.2, 3.3

Support for multiple power supply voltages provides flexibility in voltage selection based on the specific requirements of the application, optimizing power efficiency and performance.

No. of Terminals: 337

The high number of terminals allows for a greater number of input/output connections, supporting a wide range of peripherals and external devices for enhanced functionality.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The combination of grid array, low profile, and fine pitch package styles offers high-density mounting and interconnection capabilities, suitable for space-constrained applications.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage ensures operation at lower power levels, extending battery life and reducing overall power consumption in portable devices.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature tolerance ensures reliability and stability in harsh environmental conditions, making it suitable for automotive and industrial applications.

CPU Family: CORTEX-R4F

The Cortex-R4F CPU family offers high performance and real-time processing capabilities, making it suitable for applications that require fast and accurate data processing.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures reliable operation in extreme cold conditions, making it suitable for outdoor and automotive applications that require reliable performance in harsh environments.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin silver copper provides excellent conductivity and corrosion resistance, ensuring reliable electrical connections for long-term performance.

ADC Channels: YES

The presence of ADC channels enables analog signal sampling and conversion, allowing the microcontroller to interface with a variety of sensors and input devices for data processing.

DMA Channels: YES

The availability of DMA channels enables efficient data transfer between peripherals and memory, reducing processor overhead and improving overall system performance.

Terminal Position: BOTTOM

The placement of terminals at the bottom facilitates easier and more space-efficient PCB layout designs, enabling compact and streamlined circuit board configurations.

ROM Words: 2097152

The large ROM capacity allows for storing a significant amount of program and data information, supporting complex algorithms and applications that require extensive memory storage.

Maximum Seated Height: 1.4 mm

The low seated height profile enables slim and compact device designs, ideal for applications where space-saving and height restrictions are critical design considerations.

Width: 16 mm

The compact width dimension allows for space-efficient placement on PCBs, contributing to a compact and streamlined overall system design.

Data EEPROM Size: 64K

The EEPROM size provides non-volatile memory storage for critical data retention, allowing for secure and reliable storage of configuration settings and calibration data.

External Data Bus Width: 16

The wide external data bus width facilitates faster data transfer rates and efficient communication between the microcontroller and external memory or peripherals, enhancing system performance.

Peripherals: DMA(16), POR, TIMER(45), WDT

The presence of multiple peripherals such as DMA, POR, timers, and watchdog timers enhances the functionality and versatility of the microcontroller, enabling support for various system requirements and applications.

Maximum Clock Frequency: 80 MHz

The high maximum clock frequency enables fast processing and data handling capabilities, supporting real-time operations and high-speed communication requirements in demanding applications.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature specification ensures reliable and consistent soldering during assembly processes, contributing to the overall quality and durability of the product.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance allows for robust soldering processes, ensuring secure and reliable electrical connections for long-term performance and durability.

Length: 16 mm

The compact length dimension enables space-efficient placement on PCBs, contributing to a compact and streamlined overall system design.

Temperature Grade: AUTOMOTIVE

The automotive-grade temperature rating ensures reliable operation in extreme temperature conditions commonly encountered in automotive applications, making it suitable for use in automotive electronics.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of the microcontroller offers high performance with reduced instruction set complexity, allowing for efficient and optimized data processing in a wide range of applications.

RAM Bytes: 262144

The large RAM capacity provides ample working memory for data storage and manipulation, supporting multitasking, data processing, and high-speed computing requirements in complex applications.

Technology: CMOS

The CMOS technology used in the microcontroller offers low power consumption, high noise immunity, and fast switching speeds, making it suitable for battery-powered and energy-efficient applications.

Terminal Form: BALL

The ball terminal form provides reliable and secure electrical connections, suitable for applications that require robust solder joints and high-density mounting configurations on PCBs.

Analog To Digital Convertors: 24-Ch 12-Bit

The presence of 24 analog to digital converters enables simultaneous conversion of multiple analog signals with high resolution and accuracy, supporting sensor interfacing and data acquisition in diverse applications.

Maximum Supply Current: 375 mA

The low maximum supply current requirement helps in reducing power consumption and heat dissipation, contributing to improved energy efficiency and overall system performance.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage specification ensures stable and reliable operation within the specified voltage range, supporting consistent performance and functionality of the microcontroller.

Connectivity: CAN(3), I2C, SCI(2), SPI(5)

The connectivity options including CAN, I2C, SCI, and SPI interfaces provide versatile communication capabilities, allowing for seamless integration with a variety of devices and networks in different applications.

ROM Programmability: FLASH

The flash ROM programmability feature allows for easy and flexible updating of firmware and software, enabling efficient customization and system upgrades without the need for external programming devices.

Terminal Pitch: 0.8 mm

The fine terminal pitch facilitates high-density mounting, enabling compact and space-efficient PCB layout designs for applications where board space is limited.

Moisture Sensitivity Level (MSL): 3

The MSL level of 3 indicates moderate moisture sensitivity during storage and handling, requiring precautions to prevent moisture-induced damage, ensuring product reliability and longevity.

Technical Specifications

Microcontrollers TMS5702134CZWTQQ1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

22

Bit Size:

32

CPU Family:

CORTEX-R4F

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

JESD-30 Code:

S-PBGA-B337

JESD-609 Code:

e1

Length:

16 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

144

No. of Terminals:

337

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA337,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

262144

ROM Words:

2097152

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.4 mm

Speed:

180 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

375 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN(3), I2C, SCI(2), SPI(5)

Peripherals:

DMA(16), POR, TIMER(45), WDT

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

TMS5702134CZWTQQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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