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TMS5701225CPGEQQ1

Texas Instruments

TMS5701225CPGEQQ1 by Texas Instruments

TMS5701225CPGEQQ1 by Texas Instruments is a 32-bit microcontroller with 1310720 ROM words, 192 RAM words, and 24-Ch 12-Bit ADC channels. Ideal for automotive applications due to AEC-Q100 screening level, it offers low power mode, CAN(3), I2C, LIN connectivity, and operates at up to 80 MHz clock frequency.

Median Price

$20.396

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 108 parts In-Stock

1+ parts

$20.396

100+ parts

$17.816

1k+ parts

$12.287

10k+ parts

-

108

$20.396

$17.816

$12.287

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,873 parts In-Stock

1+ parts

$19.376

100+ parts

-

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-

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3,873

$19.376

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Nova Conductors

Japan . 870 parts In-Stock

1+ parts

$22.400

100+ parts

-

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870

$22.400

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Maritex

Poland . 1,500 parts In-Stock

1+ parts

$34.211

100+ parts

$25.259

1k+ parts

$22.813

10k+ parts

-

1,500

$34.211

$25.259

$22.813

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Vyrian

USA . 5,349 parts In-Stock

1+ parts

-

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5,349

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Distributors (Availability)

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AZTECH Wire

Italy . 621 parts In-Stock

1+ parts

$15.138

100+ parts

-

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621

$15.138

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Ampacity Inc.

Singapore . 108 parts In-Stock

1+ parts

$17.340

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-

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108

$17.340

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Corphita

USA . 4,546 parts In-Stock

1+ parts

$18.356

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-

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4,546

$18.356

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-

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Continental Prestige Electronics

USA . 3,630 parts In-Stock

1+ parts

$22.400

100+ parts

-

1k+ parts

-

10k+ parts

$21.952

3,630

$22.400

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-

$21.952

Netroflash

USA . 50 parts In-Stock

1+ parts

$22.400

100+ parts

$21.952

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-

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50

$22.400

$21.952

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Microchip USA

USA . 1,519 parts In-Stock

1+ parts

$50.440

100+ parts

$49.570

1k+ parts

$49.130

10k+ parts

$48.690

1,519

$50.440

$49.570

$49.130

$48.690

Parana Technologies

USA . 1,444 parts In-Stock

1+ parts

$73.576

100+ parts

$6,832.676

1k+ parts

$66.219

10k+ parts

-

1,444

$73.576

$6,832.676

$66.219

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DigiPath Technology Company

USA . 1,124 parts In-Stock

1+ parts

$81.017

100+ parts

$74.535

1k+ parts

-

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1,124

$81.017

$74.535

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ChromeModa Solutions

Germany . 2,559 parts In-Stock

1+ parts

$82.670

100+ parts

$67.789

1k+ parts

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2,559

$82.670

$67.789

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IDEA Electronic Components Group

UK . 237 parts In-Stock

1+ parts

$82.670

100+ parts

$78.536

1k+ parts

$74.403

10k+ parts

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237

$82.670

$78.536

$74.403

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Argo Parts USA

USA . 2,849 parts In-Stock

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2,849

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Lixinc

USA . 2,489 parts In-Stock

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2,489

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Perfect Parts

USA . 403 parts In-Stock

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403

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Overview

Experience unparalleled performance and reliability with the TMS5701225CPGEQQ1 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments offers cutting-edge microcontrollers perfect for a wide range of applications. From automotive to industrial uses, this high-quality product provides customers with exceptional value, benefits, and advantages. Trust in Texas Instruments to deliver top-notch technology that exceeds expectations and drives innovation in your projects.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, making the product suitable for mass production.

Maximum Supply Voltage: 1.32 V

Provides a higher maximum supply voltage which can offer flexibility in power supply design and compatibility with different systems.

ADC Channels: YES

The presence of Analog-to-Digital Converter channels allows for accurate and versatile conversion of analog signals, enhancing the product's functionality.

DMA Channels: 16

Having a higher number of Direct Memory Access channels enables efficient data transfer and processing, improving overall performance.

Maximum Clock Frequency: 80 MHz

A high clock frequency allows for fast data processing and system operations, making the product suitable for applications requiring high speed.

Connectivity: CAN(3), I2C, LIN, MIBSPI(3), SCI(2), SPI

The variety of connectivity options provided makes the product versatile and compatible with different communication protocols, enhancing its usability in diverse applications.

RAM Bytes: 196608

The large RAM capacity allows for efficient storage and manipulation of data, enabling complex algorithms and processing tasks to be handled smoothly.

ROM Programmability: FLASH

The flash programmability of ROM enables flexibility in updating and reprogramming the software, ensuring the product can adapt to changing requirements and updates.

Technical Specifications

Microcontrollers TMS5701225CPGEQQ1 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-R4F

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of External Interrupts:

0

No. of I/O Lines:

58

No. of Serial I/Os:

4

No. of Terminals:

144

No. of Timers:

40

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

196608

RAM Words:

192

ROM Words:

1310720

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

160 rpm

Maximum Supply Current:

475 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN(3), I2C, LIN, MIBSPI(3), SCI(2), SPI

Peripherals:

CAP(6), DMA(16), POR, PWM(14), QEP(2), TIMER(40), WDT

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

TMS5701225CPGEQQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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